Design and Characterization of a Biocompatible Packaging Concept for Implantable Electronic Devices

2012 ◽  
Vol 9 (1) ◽  
pp. 43-50 ◽  
Author(s):  
Maaike Op de Beeck ◽  
Karen Qian ◽  
Paolo Fiorini ◽  
Karl Malachowski ◽  
Chris Van Hoof
Keyword(s):  
Diffusion Barrier ◽  
Phase 1 ◽  
Barrier Properties ◽  
The Body ◽  
Electronic Systems ◽  
Wafer Level ◽  
Packaging Process ◽  
Chip Sealing ◽  
Packaging Sequence

A biocompatible packaging process for implantable electronic systems is described, combining biocompatibility and hermeticity with extreme miniaturization. In Phase 1 of the total packaging sequence, all chips are encapsulated in order to realize a bidirectional diffusion barrier, preventing body fluids from leaching into the package, which would cause corrosion, and preventing IC materials such as Cu from diffusing into the body, which would cause various adverse effects. For cost-effectiveness, this hermetic chip sealing is performed as a postprocessing step at the wafer level using modifications of standard clean room (CR) fabrication techniques. Well-known conductive and insulating CR materials are investigated with respect to their biocompatibility, diffusion barrier properties, and sensitivity to corrosion. In Phase 2 of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme using, for example, gold or platinum. For electrodes in direct contact with the tissue after implantation, IrOx metallization is proposed. Phase 3 of device assembly is the final packaging step, during which all system components, such as electronics, passives, a battery, among others, will be interconnected. To provide sufficient mechanical support, all these components are embedded using a biocompatible elastomer such as PDMS.

Design and characterization of a biocompatible packaging concept for implantable electronic devices

2011 ◽  
Vol 2011 (1) ◽  
pp. 000152-000160 ◽  
Author(s):  
Maaike Op de Beeck ◽  
Karen Qian ◽  
Paolo Fiorini ◽  
Karl Malachowski ◽  
Chris Van Hoof
Keyword(s):  
Diffusion Barrier ◽  
Barrier Properties ◽  
The Body ◽  
Second Phase ◽  
Electronic Systems ◽  
Wafer Level ◽  
Packaging Process ◽  
Directional Diffusion ◽  
Chip Sealing

A biocompatible packaging process for implantable electronic systems is described, combining biocompatibility and hermeticity with extreme miniaturization. In a first phase of the total packaging sequence, all chips are encapsulated in order to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. For cost effectiveness, this hermetic chip sealing is performed as post-processing at wafer level, using modifications of standard clean room (CR) fabrication techniques. Well known conductive and insulating CR materials are investigated with respect to their biocompatibility, diffusion barrier properties and sensitivity to corrosion. In a second phase of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme using eg. gold or platinum. For electrodes being in direct contact with the tissue after implantation, IrOx metallization is proposed. Device assembly is the final packaging step, during which all system components such as electronics, passives, a battery,… will be interconnected. To provide sufficient mechanical support, all these components are embedded using a biocompatible elastomer such as PDMS.

Biocompatible encapsulation and interconnection technology for implantable electronic devices

2012 ◽  
Vol 2012 (1) ◽  
pp. 000215-000224
Author(s):  
Maaike Op de Beeck ◽  
John O'Callaghan ◽  
Karen Qian ◽  
Bishoy M. Morcos ◽  
Aleksandar Radisic ◽  
...  
Keyword(s):  
Diffusion Barrier ◽  
Material Selection ◽  
Cost Effective ◽  
Barrier Properties ◽  
The Body ◽  
Second Phase ◽  
Wafer Level ◽  
Packaging Process ◽  
Directional Diffusion ◽  
Chip Sealing

A biocompatible packaging process for implantable electronic systems is under development at imec, combining biocompatibility, hermeticity, extreme miniaturization and cost aspects. In a first phase of this packaging sequence, hermetic chip sealing is performed by encapsulating all chips to realize a bi-directional diffusion barrier preventing body fluids to leach into the package causing corrosion, and preventing IC materials such as Cu to diffuse into the body, causing various adverse effects. For cost effectiveness, this chip sealing is performed as post-processing at wafer level, using modifications of standard clean room (CR) fabrication techniques. Well known conductive and insulating CR materials are investigated with respect to their biocompatibility, biostability, diffusion barrier properties and sensitivity to corrosion. Material selection and integration aspects are modified until good properties are obtained. In a second phase of the packaging process, all chips of the final device should be electrically connected, applying a biocompatible metallization scheme. We selected the use of Pt due to its excellent biocompatibility and corrosion resistance. Since Pt is very expensive, a cost effective Pt-selective plating process is developed. During the third packaging step, all system components such as electronics, passives, a battery,… will be interconnected. To provide sufficient mechanical support, all components are finally embedded using a medical grade elastomer such as PDMS or Poly-urethane.

Reliability and Characterization of Micro-Packages in a Wafer Level Au-Si Eutectic Vacuum Bonding Process

2005 ◽  
Author(s):  
Jay S. Mitchell ◽  
Gholamhassan R. Lahiji ◽  
Khalil Najafi
Keyword(s):  
High Sensitivity ◽  
Pressure Change ◽  
Bonding Process ◽  
Wafer Level ◽  
Eutectic Solder ◽  
Packaging Process ◽  
Primary Mechanism ◽  
Airtight Seal ◽  
Over Time

A Au-Si eutectic vacuum packaging process was evaluated using high sensitivity poly-Si Pirani vacuum sensors. Encapsulation of devices was achieved by bonding a silicon cap wafer to a device wafer using a Au-Si eutectic solder at above 390°C in a vacuum bonder. The Au-Si eutectic solder encircled the devices, providing an airtight seal. The Pirani gauges were encapsulated and tested over a period of several months in order to determine base pressures and leak/outgassing rates of the micro-cavities. Packaged devices without getters showed initial pressures from 2 to 12 Torr with initial leak/outgassing rates of −0.073 to 80 Torr/year. Using getters, pressures as low as 5 mTorr have been achieved with leak/outgassing rates of <10 mTorr/year. Trends in pressure over time seem to indicate outgassing (desorption of atoms from inside of the microcavity) as the primary mechanism for pressure change over time.

Studies on the Characterization of Factor VIII and a Co-factor VIII

1974 ◽  
Vol 31 (02) ◽  
pp. 328-338
Author(s):  
M. M. P Paulssen ◽  
H. L. M. A Vandenbussche-Scheffers ◽  
P. B Spaan ◽  
T de Jong ◽  
M. C Planje
Keyword(s):  
Molecular Weight ◽  
Factor Viii ◽  
The Body ◽  
Haemophilia A ◽  
Von Willebrand's Disease ◽  
Von Willebrand’S Disease ◽  
Polysaccharide Content ◽  
Plasma Factor ◽  
Two Factors

SummaryFactor VIII occurs in the body in two different forms. In lymph factor VIII is bound to chylomicra. In plasma, factor VIII is bound to a protein.After delipidation of chylomicra we obtained a glycoprotein with a high polysaccharide content and a molecular weight of approx. 160,000.In plasma, factor VIII is attached to a protein which is present in normal concentrations in plasma of patients with haemophilia A and in serum (co-factor VIII).This factor is deficient in both the plasma and the serum of patients with von Willebrand’s disease.The binding between factor VIII and co-factor VIII is reversible.Some properties of these two factors are described.

The Sober Bacchae: Dance as Phenomenal Limitation in Nietzsche

2019 ◽  
Vol 37 (1) ◽  
pp. 59-76
Author(s):  
Monique Lyle
Keyword(s):  
World View ◽  
The Body ◽  
Specific Function ◽  
Alain Badiou ◽  
Classical Greece ◽  
Birth Of Tragedy

This essay seeks to dispel entrenched critical opinion regarding dance across Nietzsche's writings as representative of Dionysian intoxication alone. Taking as its prompt the riposte of Alain Badiou, ‘Nietzsche is miles away from any doctrine of dance as a primitive ecstasy’ and ‘dance is in no way the liberated bodily impulse, the wild energy of the body’, the essay uncovers the ties between dance and Apollo in the Nietzschean theory of art while qualifying dance's relation to Dionysus. Primarily through an analysis of The Dionysiac World View and The Birth of Tragedy, the essay seeks to illuminate enigmatic statements about dance in Nietzsche (‘in dance the greatest strength is only potential, although it is betrayed by the suppleness of movement’ and ‘dance is the preservation of orderly measure’). It does this through an elucidation of the specific function of dance in Nietzsche's interpretation of classical Greece; via an assessment of the difficulties associated with the Nietzschean understanding of the bacchanal; and lastly through an analysis of Nietzsche's characterization of dance as a symbol. The essay culminates in a discussion of dance's ties to Nietzschean life affirmation; here the themes of physico-phenomenal existence, joy and illusion in Nietzsche are surveyed.

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

In-vivo evaluation of cisplatin nanoparticles encompass natural polymer

2020 ◽  
Vol 6 (1) ◽  
pp. 1-7
Author(s):  
Bhavani J ◽  
Sunil Kumar Prajapati ◽  
Ravichandran S
Keyword(s):  
Tumor Volume ◽  
Nitrogen Mustard ◽  
Common Type ◽  
The Body ◽  
Nano Particles ◽  
Natural Polymer ◽  
Drinking Alcohol ◽  
In Vivo Evaluation

Cancer is assemblage diseases involving abnormal cell growth amid the potential of spread to other parts of the body due to tobacco use are the cause of about of cancer deaths. Another 10% is due to obesity, poor diet & drinking alcohol. In 2012 about 14.1 million new cases of cancer occurred globally. In females, the most common type is breast cancer. Cisplatin also known as cytophosphane is a nitrogen mustard alkylating agent from the oxazophosphinans groups were used to treat cancers & autoimmune disorders. Based on the above reasons I will fix the aim Preparation characterization of Cisplatin- nano particles  &  its anticancer activity. Solid tumor volume examination report showed that the assessment of different day indication 15,20,25 & 30th variations of different groups of tumor volumes were decreased CPG Nanoparticles (100 mg/kg)+ DAL(15th day 4.97±0.24↓), (20th day 0.6±0.13↓), (25th day 1.35±0.30↓) & (30th day 1.89±0.13↓).

Characterization of Unfilled Tungsten Plugs on a 0.35μm CMOS Multilevel Metallization Process

1996 ◽  
Author(s):  
H. Sur ◽  
S. Bothra ◽  
Y. Strunk ◽  
J. Hahn
Keyword(s):  
Process Development ◽  
Process Integration ◽  
Wafer Level ◽  
Electrical Failure ◽  
Analysis Techniques ◽  
Integration Approach ◽  
Intermetal Dielectric ◽  
Metallization Process ◽  
Section Analysis

Abstract An investigation into metallization/interconnect failures during the process development phase of an advanced 0.35μm CMOS ASIC process is presented. The corresponding electrical failure signature was electrical shorting on SRAM test arrays and subsequently functional/Iddq failures on product-like test vehicles. Advanced wafer-level failure analysis techniques and equipment were used to isolate and identify the leakage source as shorting of metal lines due to tungsten (W) residue which was originating from unfilled vias. Further cross-section analysis revealed that the failing vias were all exposed to the intermetal dielectric spin-on glass (SOG) material used for filling the narrow spaces between metal lines. The outgassing of the SOG in the exposed regions of the via prior to and during the tungsten plug deposition is believed to be the cause of the unfilled vias. This analysis facilitated further process development in eliminating the failure mechanism and since then no failures of this nature have been observed. The process integration approach used to eliminate the failure is discussed.

Stability and Microstructure Characterization of Barrierless Cu (Sn, C) Films

2014 ◽  
Vol 1052 ◽  
pp. 163-168 ◽  
Author(s):  
Xiao Na Li ◽  
Lu Jie Jin ◽  
Li Rong Zhao ◽  
Chuang Dong
Keyword(s):  
Diffusion Barrier ◽  
Amorphous Layer ◽  
Barrier Effect ◽  
Co Doping ◽  
Cu Alloy ◽  
Large Atom ◽  
Cu Film ◽  
Small Atom ◽  
Lower Resistivity

Thermal stability, adhesion and electronic resistivity of the Cu alloy films with diffusion barrier elements (large atom Sn and small atom C) have been studied. Ternary Cu (0.6 at.% Sn, 2 at.% C) films were prepared by magnetron co-sputtering in this work. The microstructure and resistivity analysis on the films showed that the Cu (0.6 at.% Sn, 2 at.% C) film had better adhesion with the substrate and lower resistivity (2.8 μΩ·cm, after annealing at 600 °C for 1 h). Therefore, the doping of carbon atoms makes less effect to the resistivity by decreasing the amount of the doped large atoms, which results in the decreasing of the whole resistivity of the barrierless structure. After annealing, the doped elements in the film diffused to the interface to form self-passivated amorphous layer, which could further hinder the diffusion between Cu and Si. So thus ternary Cu (0.6 at.% Sn, 2 at.% C) film had better diffusion barrier effect. Co-doping of large atoms and small atoms in the Cu film is a promising way to improve the barrierless structure.

scholarly journals Potential use of molecular and structural characterization of the gut bacterial community for postmortem interval estimation in Sprague Dawley rats

2021 ◽  
Vol 11 (1) ◽  
Author(s):  
Huan Li ◽  
Siruo Zhang ◽  
Ruina Liu ◽  
Lu Yuan ◽  
Di Wu ◽  
...  
Keyword(s):  
High Throughput Sequencing ◽  
Interval Estimation ◽  
The Body ◽  
Taxon Richness ◽  
Time Since Death ◽  
Sprague Dawley ◽  
Sprague Dawley Rats ◽  
Level Data ◽  
Species Taxon

AbstractOnce the body dies, the indigenous microbes of the host begin to break down the body from the inside and play a key role thereafter. This study aimed to investigate the probable shift in the composition of the rectal microbiota at different time intervals up to 15 days after death and to explore bacterial taxa important for estimating the time since death. At the phylum level, Proteobacteria and Firmicutes showed major shifts when checked at 11 different intervals and emerged at most of the postmortem intervals. At the species level, Enterococcus faecalis and Proteus mirabilis showed a downward and upward trend, respectively, after day 5 postmortem. The phylum-, family-, genus-, and species-taxon richness decreased initially and then increased considerably. The turning point occurred on day 9, when the genus, rather than the phylum, family, or species, provided the most information for estimating the time since death. We constructed a prediction model using genus-level data from high-throughput sequencing, and seven bacterial taxa, namely, Enterococcus, Proteus, Lactobacillus, unidentified Clostridiales, Vagococcus, unidentified Corynebacteriaceae, and unidentified Enterobacteriaceae, were included in this model. The abovementioned bacteria showed potential for estimating the shortest time since death.

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