Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement

2011 ◽  
Vol 8 (1) ◽  
pp. 16-22 ◽  
Author(s):  
Pradeep Hegde ◽  
Mukesh Patil ◽  
K. N. Seetharamu
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Element Model ◽  
Channel Length ◽  
Computational Time ◽  
Microchannel Heat Sink ◽  
Method Performance

Thermal performance of a water cooled multistack microchannel heat sink with counterflow arrangement has been analyzed using the finite element method. Performance parameters such as thermal resistance, pressure drop, and pumping power are computed for a typical counterflow heat sink with different number of stacks. The temperature distribution in a typical multistack counterflow microchannel heat sink is obtained for different numbers of stacks and plotted along the channel length. A parametric study involving the effects of number of stacks and channel aspect ratio on thermal resistance and pressure drop of the heat sink is done. The finite element model developed for the analysis is simple and consumes less computational time.

scholarly journals Optimization of the thermal performance of multi-layer silicon microchannel heat sinks

2016 ◽  
Vol 20 (6) ◽  
pp. 2001-2013 ◽  
Author(s):  
Shanglong Xu ◽  
Yihao Wu ◽  
Qiyu Cai ◽  
Lili Yang ◽  
Yue Li
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Optimization Design ◽  
Heat Sinks ◽  
Structural Parameter ◽  
Microchannel Heat Sink ◽  
Total Thermal Resistance ◽  
Sqp Method ◽  
Resistance Network Model

The objective is to optimize the configuration sizes and thermal performance of a multilayer silicon microchannel heat sink by the thermal resistance network model. The effect of structural parameter on the thermal resistance is analyzed by numercal simulation. Taking the thermal resistance as an objective function, a nonlinear and multi-constrained optimization model are proposed for the silicon microchannel heat sink in electronic chips cooling. The sequential quadratic programming (SQP) method is used to do the optimization design of the configuration sizes of the microchannel. For the heat sink with the size of 20mm?20mm and the power of 400 W, the optimized microchannel number, layer, height and width are 40 and 2, 2.2mm and 0.2mm, respectively, and its corresponding total thermal resistance for whole microchannel heat sink is 0.0424 K/W.

Numerical Investigation of Heat Transfer Characteristics of a Novel Wavy-Tapered Microchannel Heat Sink

2016 ◽  
Author(s):  
Ahmed Eltaweel ◽  
Abdulla Baobeid ◽  
Brian Tompkins ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Aspect Ratio ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Substrate Surface ◽  
Microchannel Heat Sink ◽  
Aspect Ratios ◽  
Wavy Channels ◽  
Channel Configuration

In the present study, a multi-variable comparative study of the effect of microchannel heat sink configurations on their thermal performance is conducted by numerically simulating three-dimensional fluid flow and heat transfer in multiple microchannel heat sink configurations. Thermal analysis is performed to investigate a novel wavy-tapered channel configuration of microchannel heat sinks with directionally alternating coolant flow for high-end electronics cooling. Simulations were conducted at different tapering and aspect ratios, focusing on how effectively previously proven geometric enhancements combine with one another in novel ways. Results confirmed the superiority of wavy channels over straight channels due to the development of the secondary flow (Dean Vortices), which enhance the advection mixing and consequently the overall heat sink thermal performance. Moreover, width-tapering of the wavy channel showed improved channel performance in terms of thermal resistance compared to untapered wavy channels. Almost 10% improvement in thermal resistance is obtained with width tapering. Also, the thermal performance showed a strong dependency on channel aspect ratio. Overall performance suggests that optimum tapering and aspect ratio conditions exist. The numerical investigations are then extended to novel heat sink design includes wavy tapered microchannels with directionally alternating flow to improve heat sink thermal performance. A 15% reduction in thermal resistance and highly improved substrate surface temperature distribution uniformity are obtained using alternating flow compared to corresponding parallel flow channels.

Numerical investigation on fluid flow and convective heat transfer in a microchannel heat sink with fan-shaped cavities and ribs

2021 ◽  
pp. 095440892098743
Author(s):  
K Bala Subrahmanyam ◽  
Pritam Das ◽  
Aparesh Datta
Keyword(s):  
Heat Transfer ◽  
Nusselt Number ◽  
Fluid Flow ◽  
Pressure Drop ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Extraction ◽  
Microchannel Heat Sink

In the present study, a detailed numerical simulations of liquid flow in microchannel heat sink with four different geometry of ribs: rectangular (RR), backward triangular (BTR), forward triangular (FTR) and diamond (DR) arranged symmetrically inside reentrant fan shaped cavities (FC) on side walls has been conducted and compared with smooth channel (SC) to acquire fluid flow and heat transfer characteristics between Reynolds numbers of 136−588. The local pressure, temperature and heat transfer coefficients were determined to understand the convective heat transfer regimes and to analyze local flow behavior. The three-dimensional conjugate heat transfer model, investigation is done extensively to identify the influence of geometrical parameters towards augmenting thermal performance with parametric optimization. Evolved governing equations are solved by using SIMPLEC algorithm. Attempt has been made to improve heat extraction ability with reasonable pressure drop by replacing the existing simple design of microsink. It is observed that Nusselt number and friction factor are in good agreement with previous experimental data. Based on detailed parametric study, it was found that FC-RR is good in achieving maximum Nusselt number, but due to higher pressure drop penalty giving lower performance. Out of four proposed, FC-DR is conferring upstanding balance between heat transfer, pressure drop and giving the best thermal performance of 1.97 at Re = 391.47.

Heat Sink With Stacked Multi-Layer Porous Media

2014 ◽  
Author(s):  
Arun K. Karunanithi ◽  
Fatemeh Hassanipour
Keyword(s):  
Porous Media ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Lower Pressure ◽  
Heat Sinks ◽  
Rectangular Channels ◽  
Mini Channels

Previous studies have shown that stacked multi-layer mini-channels heat sinks with square or circular channels have advantages over traditional single layered channels in terms of both pressure drop and thermal resistance. In this work, porous media is used in the multi-layered stacked mini-channels instead of square or rectangular channels and the effect of the same on pressure drop and thermal performance is studied. Porosity scaling is done between the layers of porous media and is compared with unscaled stacked multilayer channel. Porosity scaling allows the porosity to vary from one layer to the next layer and could result in a lower pressure drop and better thermal performance.

Thermo-Hydraulic Performance of Heat Sinks With Microchannel Embedded With Pin-fins

2021 ◽  
Author(s):  
Anas Alkhazaleh ◽  
Mohamed Younes El-Saghir Selim ◽  
Fadi Alnaimat ◽  
Bobby Mathew
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Reynolds Numbers ◽  
Sine Wave ◽  
Hydraulic Diameter ◽  
Heat Sinks ◽  
Microchannel Heat Sink ◽  
Pin Fins ◽  
The Cost

Abstract In this work, an investigation of the heat sink performance employing sinusoidal microchannels embedded with pin fins was conducted. The effect of the sine wave frequency, the pin fins’ diameter, and the hydraulic diameter of the microchannel are studied. The results are quantified in terms of thermal resistance and pressure drop. The study was done using Reynolds numbers varying from 250 to 2000. As Reynolds number increases, the heat sink’s thermal resistance decreased while the pressure drop increased accordingly for all scenarios. The sinusoidal microchannels showed better performance — lower thermal resistance — but with the cost of higher pressure drop compared to the straight microchannel heat sink. The heat sink’s performance was improved by increasing the frequency, diameter of pin fins, and hydraulic diameter; however, this reduction in thermal resistance was associated with an increase in pressure drop. The reduction in thermal resistance of the different configurations of the sinusoidal microchannels was between 17% and 69% compared to the straight microchannel heat sink.

Two-Phase Stacked Microchannel Heat Sinks for Microelectronics Cooling

2005 ◽  
Vol 2 (2) ◽  
pp. 122-131
Author(s):  
Pradeep Hegde ◽  
K.N. Seetharamu ◽  
P.A. Aswatha Narayana ◽  
Zulkifly Abdullah
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Two Phase Flow ◽  
Heat Sinks ◽  
Phase Flow ◽  
Pumping Power ◽  
Two Phase ◽  
Microchannel Heat Sinks

Stacked microchannel heat sinks with two-phase flow have been analyzed using the Finite Element Method (FEM). The present method is a simple and practical approach for analyzing the thermal performance of single or multi layered microchannel heat sinks with either single or two-phase flow. A unique 10 noded finite element is used for the channel discretization. Two-phase thermal resistance, pressure drop and pumping power of single, double and triple stack microchannel heat sinks are determined at different base heat fluxes ranging from 150 W/cm2 to 300 W/cm2. The temperature distribution along the length of the microchannel is also plotted. It is found that stacked microchannel heat sinks with two-phase flow are thermally more efficient than two-phase single layer microchannel heat sinks, both in terms of thermal resistance and pumping power requirements. It is observed that the thermal resistance of a double stack microchannel heat sink with two-phase flow is about 40% less than that for a single stack heat sink. A triple stack heat sink yields a further 20% reduction in the thermal resistance and at the same time operates with about 30% less pumping power compared to a single stack heat sink. The effect of channel aspect ratio on the thermal resistance and pressure drop of stacked microchannel heat sinks with two-phase flow are also studied.

Thermal Performance and Pressure Drop of Galinstan-Based Microchannel Heat-Sink for High Heat-Flux Thermal Management

2015 ◽  
Author(s):  
Yoshikazu Hayashi ◽  
Navid Saneie ◽  
Yoon Jo Kim ◽  
Jong-Hoon Kim
Keyword(s):  
Heat Transfer ◽  
Thermal Conductivity ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Specific Heat ◽  
Thermal Management ◽  
Heat Sink ◽  
Working Fluid ◽  
Microchannel Heat Sink ◽  
Pumping Power

We numerically investigated a novel galinstan-based microfluidic heat-sink. Galinstan is an eutectic alloys of gallium, indium, and tin. The thermal conductivity of galinstan is ∼27 times that of water, while the dynamic viscosity is only twice of water. Thus, heat transfer coefficient can be remarkably enhanced with a small penalty of pumping power. However, the specific heat of galinstan is significantly lower than that of water, which will inevitably undermine the cooling capability by increasing fluid outlet temperature (i.e., increase of caloric thermal management) and/or flow rate. As an alternative, therefore, galinstan/water heterogeneous mixture was proposed as a working fluid and the cooling performance was numerically explored with varying volume composition of galinstan. Effective medium theory for heterogeneous medium was used to evaluate the thermal conductivity of the mixture. The viscosity change with respect to the volume composition was also predicted considering both the viscosity of dispersed phase and interaction between the droplets. Classical models were used for the mixture density and specific heat calculations. Heat transfer and pressure drop characteristics of laminar flow through a silicon microchannel heat-sink was simulated using Fluent. The length and width of the channel array are 10 mm and 9.5 mm, respectively. The cross-sectional area of each channel is 300 μm × 300 μm and the spacing between channels is 100 μm. The heat dissipation was 50 W and the pumping power was fixed at 5 mW for the comparison between the varying galinstan/water compositions. The results showed that more than 30% of the thermal resistance enhancement was attainable using the novel working fluid. Due to the compromise between the convective thermal resistance (effect of thermal conductivity) and the caloric thermal resistance (effect of viscosity and specific heat), the lowest junction temperature was marked at the galinstan composition of ∼35% by volume.

Effect of a Slotted Shield on Thermal and Hydraulic Performance of a Heat Sink

2014 ◽  
Vol 137 (1) ◽  
Author(s):  
Mohamed L. Elsayed ◽  
Osama Mesalhy
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Hydraulic Performance ◽  
Slot Width ◽  
The Other ◽  
Moderate Pressure ◽  
Other Hand

The attachment of a shield to a heat sink enhances the thermal performance. But, forming slots in the shield increases thermal resistance. We found that increasing the slot width enhances the flow performance over the heat sink and this improvement continues as the number of slots increases, but the thermal performance, on the other hand, decreases. Slots work as a flow bypass and create jets to destroy eddies and vortices created by the shield. Therefore, pressure drop at Re = 55,000 for a slotted case is about 80% lower than a solid shield. For suitable thermal resistance and moderate pressure drop, the appropriate slotted shield will have 3–7 slots at different slot widths. These slots preserve the improvement of thermal resistance with a suitable pressure drop.

Thermal Optimal Design for Partially-Confined Compact Heat Sinks

2005 ◽  
Author(s):  
M. P. Wang ◽  
H. T. Chen ◽  
J. T. Horng ◽  
T. Y. Wu ◽  
P. L. Chen ◽  
...  
Keyword(s):  
Experimental Data ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Flow Velocity ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Optimal Designs ◽  
Inlet Flow ◽  
Design Factors

An effective method for predicting the optimal thermal performance of partially-confined compact heat sinks under multi-constraints of pressure drop and heat sink mass has been successfully developed. The design variables of PPF compact heat sinks include: heat sink fin and base material, thickness of heat sink base, heat flux, channel top bypass and inlet flow velocity. A total of 108 experimental cases for confined forced convection are designed by the Central Composite Design (CCD) method. According to the results in ANOVA, a sensitivity analysis for the design factors is performed. From the analysis, the effect of inlet flow velocity, which has the contribution percentage of 86.24%, dominates the thermal performance. The accuracies of the quadratic RSM models for both thermal resistance and pressure drop have been verified by comparing the predicted response values to the actual experimental data. The maximum deviations of thermal resistance and pressure drop are 9.41% and 7.20% respectively. The Response Surface Methodology is applied to establish analytical models of the thermal resistance and pressure drop constraints in terms of the key design factors with a CCD experimental design. By employing the Sequential Quadratic Programming technique, a series of constrained optimal designs can be efficiently performed. The numerical optimization results for four cases under different constraints are obtained, and the comparisons between these predicted optimal designs and those measured by the experimental data are made with a satisfactory agreement.

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