Numerical Investigation of Heat Transfer Characteristics of a Novel Wavy-Tapered Microchannel Heat Sink

2016 ◽  
Author(s):  
Ahmed Eltaweel ◽  
Abdulla Baobeid ◽  
Brian Tompkins ◽  
Ibrahim Hassan
Keyword(s):  
Heat Transfer ◽  
Aspect Ratio ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Substrate Surface ◽  
Microchannel Heat Sink ◽  
Aspect Ratios ◽  
Wavy Channels ◽  
Channel Configuration

In the present study, a multi-variable comparative study of the effect of microchannel heat sink configurations on their thermal performance is conducted by numerically simulating three-dimensional fluid flow and heat transfer in multiple microchannel heat sink configurations. Thermal analysis is performed to investigate a novel wavy-tapered channel configuration of microchannel heat sinks with directionally alternating coolant flow for high-end electronics cooling. Simulations were conducted at different tapering and aspect ratios, focusing on how effectively previously proven geometric enhancements combine with one another in novel ways. Results confirmed the superiority of wavy channels over straight channels due to the development of the secondary flow (Dean Vortices), which enhance the advection mixing and consequently the overall heat sink thermal performance. Moreover, width-tapering of the wavy channel showed improved channel performance in terms of thermal resistance compared to untapered wavy channels. Almost 10% improvement in thermal resistance is obtained with width tapering. Also, the thermal performance showed a strong dependency on channel aspect ratio. Overall performance suggests that optimum tapering and aspect ratio conditions exist. The numerical investigations are then extended to novel heat sink design includes wavy tapered microchannels with directionally alternating flow to improve heat sink thermal performance. A 15% reduction in thermal resistance and highly improved substrate surface temperature distribution uniformity are obtained using alternating flow compared to corresponding parallel flow channels.

THERMAL AND HYDRODYNAMIC PERFORMANCE OF A MICROCHANNEL HEAT SINK COOLED WITH CARBON NANOTUBES NANOFLUID

2016 ◽  
Vol 78 (10-2) ◽  
Author(s):  
Nik Ahmad Faiz Nik Mazlam ◽  
Normah Mohd-Ghazali ◽  
Thierry Mare ◽  
Patrice Estelle ◽  
Salma Halelfadl
Keyword(s):  
Thermal Resistance ◽  
Heat Sink ◽  
Operating Temperature ◽  
Heat Removal ◽  
Hydrodynamic Performance ◽  
Spherical Particles ◽  
Microchannel Heat Sink ◽  
Pumping Power ◽  
Rectangular Microchannel ◽  
Aspect Ratios

The microchannel heat sink (MCHS) has been established as an effective heat removal system in electronic chip packaging. With increasing power demand, research has advanced beyond the conventional coolants of air and water towards nanofluids with their enhanced heat transfer capabilities. This research had been carried out on the optimization of the thermal and hydrodynamic performance of a rectangular microchannel heat sink (MCHS) cooled with carbon nanotube (CNT) nanofluid, a coolant that has recently been discovered with improved thermal conductivity. Unlike the common nanofluids with spherical particles, nanotubes generally come in cylindrical structure characterized with different aspect ratios. A volume concentration of 0.1% of the CNT nanofluid is used here; the nanotubes have an average diameter and length of 9.2 nm and 1.5 mm respectively. The nanofluid has a density of 1800 kg/m3 with carbon purity 90% by weight having lignin as the surfactant. The approach used for the optimization process is based on the thermal resistance model and it is analyzed by using the non-dominated sorting multi-objective genetic algorithm. Optimized outcomes include the channel aspect ratio and the channel wall ratio at the optimal values of thermal resistance and pumping power. The optimized results show that, at high operating temperature of 40°C the use of CNT nanofluid reduces the total thermal resistance by 3% compared to at 20°C and consequently improve the thermal performance of the fluid. In terms of the hydrodynamic performance, the pumping power is also being reduced significantly by 35% at 40°C compared to the lower operating temperature.  

Experimental Investigation on Thermal Performance of Heat Sink With Two Pairs of Embedded Heat Pipes

2007 ◽  
Author(s):  
Hsiang-Sheng Huang ◽  
Jung-Chang Wang ◽  
Sih-Li Chen
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Transfer Rate ◽  
Thermal Performance ◽  
Heat Sink ◽  
Transfer Rate ◽  
Heat Pipes ◽  
Total Heat ◽  
Heating Power ◽  
Total Heat Transfer

This article provides an experimental method to study the thermal performance of a heat sink with two pairs (outer and inner pair) of embedded heat pipes. The proposed method can determine the heat transfer rate of the heat pipes under various heating power of the heat source. A comprehensive thermal resistance network of the heat sink is also developed. The network estimates the thermal resistances of the heat sink by applying the thermal performance test result. The results show that the outer and inner pairs of heat pipes carries 21% and 27% of the total heat transfer rate respectively, while 52% of the heating power is dissipated from the base plate to the fins. The dominated thermal resistance of the heat sink is the base to heat pipes resistance which is strongly affected by the thermal performance of the heat pipes. The total thermal resistance of the heat sink shows the lowest value, 0.23°C/W, while the total heat transfer rate of the heat sink is 140W and the heat transfer rate of the outer and inner pairs of heat pipes is 30W and 38 W, respectively.

Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement

2011 ◽  
Vol 8 (1) ◽  
pp. 16-22 ◽  
Author(s):  
Pradeep Hegde ◽  
Mukesh Patil ◽  
K. N. Seetharamu
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Element Model ◽  
Channel Length ◽  
Computational Time ◽  
Microchannel Heat Sink ◽  
Method Performance

Thermal performance of a water cooled multistack microchannel heat sink with counterflow arrangement has been analyzed using the finite element method. Performance parameters such as thermal resistance, pressure drop, and pumping power are computed for a typical counterflow heat sink with different number of stacks. The temperature distribution in a typical multistack counterflow microchannel heat sink is obtained for different numbers of stacks and plotted along the channel length. A parametric study involving the effects of number of stacks and channel aspect ratio on thermal resistance and pressure drop of the heat sink is done. The finite element model developed for the analysis is simple and consumes less computational time.

The effect of viscous dissipation on laminar nanofluid flow in a microchannel heat sink

2009 ◽  
Vol 223 (11) ◽  
pp. 2697-2706 ◽  
Author(s):  
M Ghazvini ◽  
M A Akhavan-Behabadi ◽  
M Esmaeili
Keyword(s):  
Heat Transfer ◽  
Nusselt Number ◽  
Viscous Dissipation ◽  
Heat Sink ◽  
Volume Fraction ◽  
Numerical Study ◽  
Microchannel Heat Sink ◽  
Fluid Temperature ◽  
Nanofluid Flow ◽  
Aspect Ratios

The present article focuses on analytical and numerical study on the effect of viscous dissipation when nanofluid is used as the coolant in a microchannel heat sink (MCHS). The nanofluid is made from CuO nanoparticles and water. To analyse the MCHS, a modified Darcy equation for the fluid and two-equation model for heat transfer between fluid and solid sections are employed in porous media approach. In addition, to deal with nanofluid heat transfer, a model based on the Brownian motion of nanoparticles is used. The model evaluates the thermal conductivity of nanofluid considering the thermal boundary resistance, nanoparticle diameter, volume fraction, and the fluid temperature. At first, the effects of particle volume fraction on temperature distribution and overall heat transfer coefficient are investigated with and without considering viscous dissipation. After that, the influence of different channel aspect ratios and porosities is studied. The results show that for nanofluid flow in microchannels, the viscous dissipation can be neglected for low volume fractions and aspect ratios only. Finally, the effect of porosity and Brinkman number on the overall Nusselt number is studied, where asymptotic behaviour of the Nusselt number is observed and discussed from the energy balance point of view.

scholarly journals Constructal Optimization of Rectangular Microchannel Heat Sink with Porous Medium for Entropy Generation Minimization

Entropy ◽  
2021 ◽  
Vol 23 (11) ◽  
pp. 1528
Author(s):  
Wenlong Li ◽  
Zhihui Xie ◽  
Kun Xi ◽  
Shaojun Xia ◽  
Yanlin Ge
Keyword(s):  
Heat Flux ◽  
Aspect Ratio ◽  
Entropy Generation ◽  
Heat Sink ◽  
Width Ratio ◽  
Microchannel Heat Sink ◽  
Rectangular Microchannel ◽  
Entropy Generation Minimization ◽  
Aspect Ratios ◽  
Length Width

A model of rectangular microchannel heat sink (MCHS) with porous medium (PM) is developed. Aspect ratio of heat sink (HS) cell and length-width ratio of HS are optimized by numerical simulation method for entropy generation minimization (EGM) according to constructal theory. The effects of inlet Reynolds number (Re) of coolant, heat flux on bottom, porosity and volume proportion of PM on dimensionless entropy generation rate (DEGR) are analyzed. From the results, there are optimal aspect ratios to minimize DEGR. Given the initial condition, DEGR is 33.10% lower than its initial value after the aspect ratio is optimized. With the increase of Re, the optimal aspect ratio declines, and the minimum DEGR drops as well. DEGR gets larger and the optimal aspect ratio remains constant with the increasing of heat flux on bottom. For the different volume proportion of PM, the optimal aspect ratios are diverse, but the minimum DEGR almost stays unchanged. The twice minimized DEGR, which results from aspect ratio and length-width ratio optimized simultaneously, is 10.70% lower than the once minimized DEGR. For a rectangular bottom, a lower DEGR can be reached by choosing the proper direction of fluid flow.

Buoyancy Effects on Heat Transfer in Five Different Aspect-Ratio Rectangular Channels With Smooth Walls and 45-Degree Ribbed Walls

2005 ◽  
Author(s):  
Wen-Lung Fu ◽  
Lesley M. Wright ◽  
Je-Chin Han
Keyword(s):  
Heat Transfer ◽  
Nusselt Number ◽  
Aspect Ratio ◽  
Thermal Performance ◽  
Flow Direction ◽  
Aspect Ratios ◽  
Number Ratio ◽  
Buoyancy Parameter ◽  
Rectangular Channels ◽  
Channel Aspect Ratio

This paper experimentally studies the effects of the buoyancy force and channel aspect ratio on heat transfer in two-pass rotating rectangular channels with smooth walls and 45° ribbed walls. The channel aspect ratios include 4:1, 2:1, 1:1, 1:2 and 1:4. Four Reynolds numbers are studied: 5000, 10000, 25000 and 40000. The rotation speed is fixed at 550 rpm for all tests, and for each channel, two channel orientations are studied: 90° and 45° or 135°, with respect to the plane of rotation. Rib turbulators are placed on the leading and trailing walls of the channels at an angle of 45° to the flow direction. The ribs have a 1.59 by 1.59 mm square cross section, and the rib pitch-to-height ratio (P/e) is 10 for all tests. The effects of the local buoyancy parameter and channel aspect ratio on the regional Nusselt number ratio are presented. The results show that increasing the local buoyancy parameter increases the Nusselt number ratio on the trailing surface and decreases the Nusselt number ratio on the leading surface in the first pass for all channels. However, the trend of the Nusselt number ratio in the second pass is more complicated due to the strong effect of the 180° turn. Results are also presented for this critical turn region of the two-pass channels. In addition to these regions, the channel averaged heat transfer, friction factor, and thermal performance are determined for each channel. With the channels having comparable Nusselt number ratios, the 1:4 channel has the superior thermal performance because it incurs the least pressure penalty.

scholarly journals Optimization of the thermal performance of multi-layer silicon microchannel heat sinks

2016 ◽  
Vol 20 (6) ◽  
pp. 2001-2013 ◽  
Author(s):  
Shanglong Xu ◽  
Yihao Wu ◽  
Qiyu Cai ◽  
Lili Yang ◽  
Yue Li
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Optimization Design ◽  
Heat Sinks ◽  
Structural Parameter ◽  
Microchannel Heat Sink ◽  
Total Thermal Resistance ◽  
Sqp Method ◽  
Resistance Network Model

The objective is to optimize the configuration sizes and thermal performance of a multilayer silicon microchannel heat sink by the thermal resistance network model. The effect of structural parameter on the thermal resistance is analyzed by numercal simulation. Taking the thermal resistance as an objective function, a nonlinear and multi-constrained optimization model are proposed for the silicon microchannel heat sink in electronic chips cooling. The sequential quadratic programming (SQP) method is used to do the optimization design of the configuration sizes of the microchannel. For the heat sink with the size of 20mm?20mm and the power of 400 W, the optimized microchannel number, layer, height and width are 40 and 2, 2.2mm and 0.2mm, respectively, and its corresponding total thermal resistance for whole microchannel heat sink is 0.0424 K/W.

Forced Convection in Microstructures for Electronic Equipment Cooling

1999 ◽  
Vol 121 (3) ◽  
pp. 639-645 ◽  
Author(s):  
S. J. Kim ◽  
D. Kim
Keyword(s):  
Heat Transfer ◽  
Porous Medium ◽  
Fluid Flow ◽  
Thermal Resistance ◽  
Analytical Solutions ◽  
Heat Sink ◽  
Microchannel Heat Sink ◽  
Fluid Temperature ◽  
Medium Model ◽  
Porous Medium Model

This paper reports analytical solutions for both velocity and temperature profiles in Microchannel heat sinks by modeling the Microchannel heat sink as a fluid-saturated porous medium. The analytical solutions are obtained based on the modified Darcy model for fluid flow and the two-equation model for heat transfer. To validate the porous medium model and the analytical solutions based on that model, the closed-form solution for the velocity distribution in the fully-developed channel flow and the numerical solutions for the conjugate heat transfer problem, comprising the solid fin and the fluid, are also obtained. The analytical solutions based on the porous medium model are shown to predict the volume-averaged velocity and temperature distributions quite well. Using the analytical solutions, the aspect ratio and the effective thermal conductivity ratio are identified as variables of engineering importance and their effects on fluid flow and heat transfer are studied. As either one of these variables increases, the fluid temperature is shown to approach the solid temperature. Finally, the expression for the total thermal resistance, derived from the analytical solutions and the geometry of the microchannel heat sink for which the thermal resistance of the heat sink is minimal, is obtained.

Thermal Performance of Triangular Folded Fin Heat Sinks in a Duct

2003 ◽  
Author(s):  
Seo Young Kim ◽  
Taeho Ji ◽  
Dong Gyu Choi ◽  
Byung Ha Kang
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Flow Velocity ◽  
Convective Heat Transfer ◽  
Convective Heat ◽  
Thermal Performance ◽  
Heat Sink ◽  
Base Plate ◽  
Heat Sinks ◽  
Heat Transfer Characteristics

Experiments have been carried out to investigate the convective heat transfer characteristics from triangular folded fin heat sinks in a suction-type fan duct. The dimension of the triangular folded fin heat sinks is 62 mm in height with a 12 mm thick base plate, 292 mm in width, and 447 mm in length. The inlet flow velocity is varied in the range of 0.6–5.3 m/s. Thermal performance of triangular folded fin heat sinks is evaluated in terms of thermal resistance of heat sinks according to flow velocity and fan power. The results obtained show that the present triangular folded-fin heat sink shows a higher thermal performance compared to a conventional extruded plate-fin heat sink. Especially, a perforated slit folded-fin heat sink displays a lower thermal resistance. As the number of slit fabricated on the perforated folded fins increases, thermal performance is more pronounced.

Sign in / Sign up

Export Citation Format

Share Document