Effect of a Slotted Shield on Thermal and Hydraulic Performance of a Heat Sink

2014 ◽  
Vol 137 (1) ◽  
Author(s):  
Mohamed L. Elsayed ◽  
Osama Mesalhy
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Hydraulic Performance ◽  
Slot Width ◽  
The Other ◽  
Moderate Pressure ◽  
Other Hand

The attachment of a shield to a heat sink enhances the thermal performance. But, forming slots in the shield increases thermal resistance. We found that increasing the slot width enhances the flow performance over the heat sink and this improvement continues as the number of slots increases, but the thermal performance, on the other hand, decreases. Slots work as a flow bypass and create jets to destroy eddies and vortices created by the shield. Therefore, pressure drop at Re = 55,000 for a slotted case is about 80% lower than a solid shield. For suitable thermal resistance and moderate pressure drop, the appropriate slotted shield will have 3–7 slots at different slot widths. These slots preserve the improvement of thermal resistance with a suitable pressure drop.

Numerical Prediction of Thermal Performance of Water Cooled Multi-Stack Microchannel Heat Sink with Counterflow Arrangement

2011 ◽  
Vol 8 (1) ◽  
pp. 16-22 ◽  
Author(s):  
Pradeep Hegde ◽  
Mukesh Patil ◽  
K. N. Seetharamu
Keyword(s):  
Finite Element ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Element Model ◽  
Channel Length ◽  
Computational Time ◽  
Microchannel Heat Sink ◽  
Method Performance

Thermal performance of a water cooled multistack microchannel heat sink with counterflow arrangement has been analyzed using the finite element method. Performance parameters such as thermal resistance, pressure drop, and pumping power are computed for a typical counterflow heat sink with different number of stacks. The temperature distribution in a typical multistack counterflow microchannel heat sink is obtained for different numbers of stacks and plotted along the channel length. A parametric study involving the effects of number of stacks and channel aspect ratio on thermal resistance and pressure drop of the heat sink is done. The finite element model developed for the analysis is simple and consumes less computational time.

Heat Sink With Stacked Multi-Layer Porous Media

2014 ◽  
Author(s):  
Arun K. Karunanithi ◽  
Fatemeh Hassanipour
Keyword(s):  
Porous Media ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Lower Pressure ◽  
Heat Sinks ◽  
Rectangular Channels ◽  
Mini Channels

Previous studies have shown that stacked multi-layer mini-channels heat sinks with square or circular channels have advantages over traditional single layered channels in terms of both pressure drop and thermal resistance. In this work, porous media is used in the multi-layered stacked mini-channels instead of square or rectangular channels and the effect of the same on pressure drop and thermal performance is studied. Porosity scaling is done between the layers of porous media and is compared with unscaled stacked multilayer channel. Porosity scaling allows the porosity to vary from one layer to the next layer and could result in a lower pressure drop and better thermal performance.

Thermal Optimal Design for Partially-Confined Compact Heat Sinks

2005 ◽  
Author(s):  
M. P. Wang ◽  
H. T. Chen ◽  
J. T. Horng ◽  
T. Y. Wu ◽  
P. L. Chen ◽  
...  
Keyword(s):  
Experimental Data ◽  
Pressure Drop ◽  
Thermal Resistance ◽  
Flow Velocity ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Optimal Designs ◽  
Inlet Flow ◽  
Design Factors

An effective method for predicting the optimal thermal performance of partially-confined compact heat sinks under multi-constraints of pressure drop and heat sink mass has been successfully developed. The design variables of PPF compact heat sinks include: heat sink fin and base material, thickness of heat sink base, heat flux, channel top bypass and inlet flow velocity. A total of 108 experimental cases for confined forced convection are designed by the Central Composite Design (CCD) method. According to the results in ANOVA, a sensitivity analysis for the design factors is performed. From the analysis, the effect of inlet flow velocity, which has the contribution percentage of 86.24%, dominates the thermal performance. The accuracies of the quadratic RSM models for both thermal resistance and pressure drop have been verified by comparing the predicted response values to the actual experimental data. The maximum deviations of thermal resistance and pressure drop are 9.41% and 7.20% respectively. The Response Surface Methodology is applied to establish analytical models of the thermal resistance and pressure drop constraints in terms of the key design factors with a CCD experimental design. By employing the Sequential Quadratic Programming technique, a series of constrained optimal designs can be efficiently performed. The numerical optimization results for four cases under different constraints are obtained, and the comparisons between these predicted optimal designs and those measured by the experimental data are made with a satisfactory agreement.

Understanding the Impact of Flow Bypass on the Thermal Performance of Air Cooled Heat Sinks

2014 ◽  
Author(s):  
Krishna Kota ◽  
Mohamed M. Awad
Keyword(s):  
Energy Conservation ◽  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Heat Sinks ◽  
Laminar Regime ◽  
Flow Energy ◽  
Factor Α ◽  
The Impact ◽  
Fundamental Mass

In this effort, theoretical modeling was employed to understand the impact of flow bypass on the thermal performance of air cooled heat sinks. Fundamental mass and flow energy conservation equations across a longitudinal fin heat sink configuration and the bypass region were applied and a generic parameter, referred as the Flow Bypass Factor (α), was identified from the theoretical solution that mathematically captures the effect of flow bypass as a quantifiable parameter on the junction-to-ambient thermal resistance of the heat sink. From the results obtained, it was found that, at least in the laminar regime, the impact of flow bypass on performance can be neglected for cases when the bypass gap is typically less than 5% of the fin height, and is almost linear at high relative bypass gaps (i.e., usually for bypass gaps that are more than 10–15% of the fin height). It was also found that the heat sink thermal resistance is more sensitive to small bypass gaps and the effect of flow bypass decreases with increasing bypass gap.

Optimal Shapes of Fully Embedded Channels for Conjugate Cooling

1999 ◽  
Author(s):  
T. S. Fisher ◽  
K. E. Torrance
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Wall Thickness ◽  
Thermal Performance ◽  
Channel Width ◽  
Optimal Boundary ◽  
Optimal Shapes ◽  
Optimal Distance ◽  
Channel Boundary ◽  
Boundary Curvature

Abstract Optimal shapes and geometries are determined for systems involving liquid and gas coolants. The shape of the channel boundary, channel width, and wall thickness are varied to minimize overall thermal resistance under flow constraints involving pressure drop and pump work. The effect of boundary curvature is studied systematically by employing a parameterized boundary shape that spans from rounded rectangles to ellipses to rounded diamonds. The results indicate that increased channel boundary curvature can decrease the optimal distance between channels, and that the optimal boundary shapes of fully embedded channels can be non-rectangular. In particular, elliptic and nearly elliptic shapes are found to produce equivalent optimal thermal performance as rounded rectangular shapes under practical conditions.

Experimental Investigation on Thermal Performance of Heat Sink With Two Pairs of Embedded Heat Pipes

2007 ◽  
Author(s):  
Hsiang-Sheng Huang ◽  
Jung-Chang Wang ◽  
Sih-Li Chen
Keyword(s):  
Heat Transfer ◽  
Thermal Resistance ◽  
Heat Transfer Rate ◽  
Thermal Performance ◽  
Heat Sink ◽  
Transfer Rate ◽  
Heat Pipes ◽  
Total Heat ◽  
Heating Power ◽  
Total Heat Transfer

This article provides an experimental method to study the thermal performance of a heat sink with two pairs (outer and inner pair) of embedded heat pipes. The proposed method can determine the heat transfer rate of the heat pipes under various heating power of the heat source. A comprehensive thermal resistance network of the heat sink is also developed. The network estimates the thermal resistances of the heat sink by applying the thermal performance test result. The results show that the outer and inner pairs of heat pipes carries 21% and 27% of the total heat transfer rate respectively, while 52% of the heating power is dissipated from the base plate to the fins. The dominated thermal resistance of the heat sink is the base to heat pipes resistance which is strongly affected by the thermal performance of the heat pipes. The total thermal resistance of the heat sink shows the lowest value, 0.23°C/W, while the total heat transfer rate of the heat sink is 140W and the heat transfer rate of the outer and inner pairs of heat pipes is 30W and 38 W, respectively.

Thermal Performance Analysis of Hybrid Jet Impingement/Microchannel Cooling for Concentrated Photovoltaic (CPV) Cells

2016 ◽  
Author(s):  
Afzal Husain ◽  
Mohd Ariz ◽  
Nasser A. Al-Azri ◽  
Nabeel Z. H. Al-Rawahi ◽  
Mohd. Z. Ansari
Keyword(s):  
Thermal Resistance ◽  
Thermal Performance ◽  
Heat Sink ◽  
Three Dimensional ◽  
Jet Impingement ◽  
Constant Heat Flux ◽  
Pumping Power ◽  
High Concentration ◽  
Microchannel Cooling ◽  
Characteristic Relationship

The increase in the CPV temperature significantly reduces the efficiency of CPV system. To maintain the CPV temperature under a permissible limit and to utilize the unused heat from the CPVs, an efficient cooling and transportation of coolant is necessary in the system. The present study proposes a new design of hybrid jet impingements/microchannels heat sink with pillars for cooling densely packed PV cells under high concentration. A three-dimensional numerical model was constructed to investigate the thermal performance under steady state, incompressible and laminar flow. A constant heat flux was applied at the base of the substrate to imitate heated CPV surface. The effect of two dimensionless variables, i.e., ratios of standoff (distance from the nozzle exit to impingement surface) to jet diameter and jet pitch to jet diameter was investigated at several flow conditions. The performance of hybrid heat sink was investigated in terms of heat transfer coefficient, pressure-drop, overall thermal resistance and pumping power. The characteristic relationship between the overall thermal resistance and the pumping power was presented which showed an optimum design corresponding to S/Dj = 12 having lower overall thermal resistance and lower pumping power.

Optimization Design the Configuration Sizes of Multi-Layer Rectangle Micro-Channel Heat Sink

2013 ◽  
Vol 444-445 ◽  
pp. 1101-1106
Author(s):  
Li Feng Wang ◽  
Bao Dong Shao ◽  
He Ming Cheng ◽  
Ying He
Keyword(s):  
Pressure Drop ◽  
Thermal Resistance ◽  
Heat Sink ◽  
Optimization Design ◽  
High Heat ◽  
Micro Channel ◽  
Compact Structure ◽  
Total Thermal Resistance ◽  
High Heat Transfer ◽  
High Heat Transfer Coefficient

The configuration sizes of multi-layer rectangle micro-channel heat sink are optimized, which has been widely used to cool electronic chip for its high heat transfer coefficient and compact structure. Taking the thermal resistance and the pressure drop as goal functions, a binary-objective optimization model was proposed for the multi-layer rectangle micro-channel heat sink based on Sequential Quadratic Programming (SQP) method. The number of optimized micro-channel in width n1 and that in height n2 are 24 and 3, the width of optimized micro-channel Wc and fin Wf are 360 and 55μm, the height of optimized micro-channel Hc is 1000μm, and the corresponding total thermal resistance of the whole micro-channel heat sink is 1.5429 °C/W. The corresponding pressure drop is about 2.3454 Pa. When the velocity of liquid is larger than 0.3 m/s, the effect of change of velocity of liquid on the thermal resistance and pressure drop can be neglected.

Computational fluid dynamics for thermal performance of a water-cooled minichannel heat sink with different chip arrangements

2014 ◽  
Vol 24 (4) ◽  
pp. 797-810 ◽  
Author(s):  
Gongnan Xie ◽  
Shian Li ◽  
Bengt Sunden ◽  
Weihong Zhang
Keyword(s):  
Heat Transfer ◽  
Fluid Dynamics ◽  
Computational Fluid Dynamics ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Devices ◽  
Heat Sinks ◽  
Bottom Surface ◽  
Moderate Pressure ◽  
Content Type

Purpose – With the development of electronic devices, including the desires of integration, miniaturization, high performance and the output power, cooling requirement of chips have been increased gradually. Water-cooled minichannel is an effective cooling technology for cooling of heat sinks. The minichannel flow geometry offers large surface area for heat transfer and a high convective heat transfer coefficient with only a moderate pressure loss. The purpose of this paper is to analyze a minichannel heat sink having the bottom size of 35 mm×35 mm numerically. Two kinds of chip arrangement are investigated: diagonal arrangement and parallel arrangement. Design/methodology/approach – Computational fluid dynamics (CFD) technique is used to investigate the flow and thermal fields in forced convection in a three-dimensional minichannels heat sink with different chip arrangements. The standard k-e turbulence model is applied for the turbulence simulations on the minichannel heat sink. Findings – The results show that the bottom surface of the heat sink with various chip arrangements will have different temperature distribution and thermal resistance. A suitable chip arrangement will achieve a good cooling performance for electronic devices. Research limitations/implications – The fluid is incompressible and the thermophysical properties are constant. Practical implications – New and additional data will be helpful as guidelines in the design of heat sinks to achieve a good thermal performance and a long lifetime in operation. Originality/value – In real engineering situations, chips are always placed in various manners according to design conditions and constraints. In this case the assumption of uniform heat flux is acceptable for the surfaces of the chips rather than for the entire bottom surface of the heat sink.

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