Advanced Applications of High Temperature Magnetics

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000046-000055
Author(s):  
John R. Fraley ◽  
Edgar Cilio ◽  
Bryon Western
Keyword(s):  
High Temperature ◽  
Elevated Temperatures ◽  
Electronic Systems ◽  
Theoretical Understanding ◽  
Magnetic Systems ◽  
Magnetic Structures ◽  
High Temperature Electronics ◽  
Systems Research ◽  
Wide Range ◽  
Active Engine

In recent years, high temperature magnetic structures have been developed and used for inductors and transformers in high temperature applications ranging from power electronics to wireless telemetry systems. Research in the high temperature magnetics field has led to the development of more advanced magnetic structures that can enable diverse applications ranging from regulators to amplifiers, with far reaching implications for the high temperature electronics community. Current high temperature electronics have shown potential in lab and rig tests, but high temperature electronics systems suffer from the relatively limited lifetime of the semiconductor devices themselves. The advanced magnetics discussed in this paper can be designed to have extreme lifetime capabilities even at elevated temperatures, and as such can have an immediate impact on the implementation of true field deployable high temperature electronic systems. Aerospace, power generation, and automotive industries may especially benefit from this technology, as significant advances in health monitoring and active engine control will be enabled by these advanced magnetic structures. A theoretical understanding of these advanced magnetic structures is necessary for initial design and feasibility, while the true development and implementation of this technology depends on state of the art high temperature packaging approaches. By combining high temperature, grain-oriented magnetic materials along with high temperature packaging processes, APEI, Inc. has created advanced high temperature magnetic systems that indicate the technology described in this paper is a viable one, with applications across a wide range of high temperature electronics systems.

Considerations for Sintering in High Temperature Electronics

2019 ◽  
Vol 2019 (HiTen) ◽  
pp. 000071-000073
Author(s):  
Thomas Krebs
Keyword(s):  
High Temperature ◽  
Elevated Temperatures ◽  
High Reliability ◽  
Extreme Environments ◽  
Hydraulic Systems ◽  
Mechatronic Systems ◽  
Clear Trend ◽  
High Temperature Electronics ◽  
Wide Range ◽  
Bonding Wires

Abstract High temperature electronics are used in a wide range of applications especially in extreme environments. There is a clear trend in aircrafts to have electrical controls mounted closer to the engine [1]. In cars more and more mechanical and hydraulic systems are replaced by electromechanical or mechatronic systems [2]. They are getting closer to high temperature environments like the engine or brakes. To its nature, avionic and automotive applications require predictable, highly reliable systems. Because elevated temperatures will increase the speed of material aging, the combination of high operation temperatures and high reliability is quite challenging. This applies in particular to interconnect materials such as solders or bonding wires.

HIGH TEMPERATURE HYBRID NANODIAMOND SENSOR SYSTEMS

2014 ◽  
Vol 2014 (HITEC) ◽  
pp. 000034-000039 ◽  
Author(s):  
John R. Fraley ◽  
Lauren Kegley ◽  
Stephen Minden ◽  
Jimmy L. Davidson ◽  
David Kerns
Keyword(s):  
High Temperature ◽  
Nuclear Reactor ◽  
Reactor Core ◽  
Chemical Species ◽  
Chemical Vapor ◽  
Smart Sensors ◽  
Sensor Systems ◽  
High Temperature Electronics ◽  
Wireless Telemetry ◽  
Wide Range

In recent years, high temperature semiconductors have been utilized in wireless telemetry systems for use in military and commercial applications, wherein a high temperature environment combined with other factors such as rotating machinery or weight-constraints preclude the use of conventional silicon based wireless telemetry or wired sensor solutions. Present systems include those which can measure temperatures, pressures, vibrations, and strains. By combining the advanced electronics developed for these systems with novel sensor elements created using chemical vapor deposition (CVD) nanodiamond technology, a wide range of other high temperature sensing systems can be enabled. The unique properties of the diamond sensors have proven in principle the capability to sense, with quantifiable signal, a wide variety of parameters under extreme conditions including very high temperatures and pressures. It has been clear for some time that diamond would be the ideal material of choice for solid-state sensors, but only in recent years has the advent of CVD diamond (as opposed to natural or HPHT [high pressure, high temperature] formation) opened the door for its practical development into harsh environment sensor systems. By combining these diamond sensor elements with high temperature electronics and high temperature packaging approaches, smart sensors can be developed to measure parameters ranging from gas chemical species on the surface of Venus, to neutron flux rates outside of a nuclear reactor core. The research presented here is centered around the use of hybrid diamond sensors for neutron detection applications in Nuclear Thermal Propulsion systems. The current technology state and development needs for these hybrid high temperature diamond smart sensors will be highlighted to potentially encourage future R&D from the high-temperature electronics community.

Modeling and Design of High Temperature Silicon Carbide DMOSFET Based Medium Power DC-DC Converter

2010 ◽  
Vol 2010 (HITEC) ◽  
pp. 000144-000151
Author(s):  
Siddharth Potbhare ◽  
Akin Akturk ◽  
Neil Goldsman ◽  
James M. McGarrity ◽  
Anant Agarwal
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
High Efficiency ◽  
Schottky Diodes ◽  
Power Converter ◽  
Electronic Systems ◽  
High Temperature Electronics ◽  
New Material ◽  
Silicon Power Devices ◽  
Relationship Of

Silicon Carbide (SiC) is a promising new material for high power high temperature electronics applications. SiC Schottky diodes are already finding wide acceptance in designing high efficiency power electronic systems. We present TCAD and Verilog-A based modeling of SiC DMOSFET, and the design and analysis of a medium power DC-DC converter designed using SiC power DMOSFETs and SiC Schottky diodes. The system is designed as a 300W boost converter with a 12V input and 24V/36V outputs. The SiC power converter is compared to another designed with commercially available Silicon power devices to evaluate power dissipation in the DMOSFETs, transient response of the system and its conversion efficiency. SiC DMOSFETs are characterized at high temperature by developing temperature dependent TCAD and Verilog-A models for the device. Detailed TCAD modeling allows probing inside the device for understanding the physical processes of transport, whereas Verilog-A modeling allows us to define the complex relationship of interface traps and surface physics that is typical to SiC DMOSFETs in a compact analytical format that is suitable for inclusion in commercially available circuit simulators.

Model Combustor to Assess the Oxidation Behavior of Ceramic Materials Under Real Engine Conditions

1999 ◽  
Author(s):  
D. Filsinger ◽  
A. Schulz ◽  
S. Wittig ◽  
C. Taut ◽  
H. Klemm ◽  
...  
Keyword(s):  
High Temperature ◽  
International Development ◽  
Gas Turbines ◽  
Gas Flow ◽  
Oxidation Behavior ◽  
Elevated Temperatures ◽  
Ceramic Materials ◽  
Test Rig ◽  
Combustion Gas ◽  
Wide Range

A further increase of thermal efficiency and a reduction of the exhaust emissions of ground based gas turbines can be achieved by introducing new high temperature resistant materials. Therfore, ceramics are under international development. They offer excellent strengths at room and elevated temperatures. For gas turbine combustor applications, however, these materials have to maintain their advantageous properties under hostile environment. For the assessment and comparison of the oxidation behavior of different nonoxide ceramic materials a test rig was developed at the Institute for Thermal Turbomachinery (ITS), University of Karlsruhe, Germany. The test rig was integrated into the high temperature/ high pressure laboratory. A ceramic model combustion chamber was designed which allowed the exposure of standard four-point flexure specimens to the hot combustion gas flow. Gas temperatures and pressures could be varied in a wide range. Additionally, the partial steam pressure could be adjusted to real combustor conditions. The present paper gives a detailed description of the test rig and presents results of 100 hours endurance tests of ceramic materials at 1400°C. The initial strengths and the strengths after oxidation tests are compared. In addition to this, photographs illustrating the changes of the material’s microstructure are presented.

HPM X-750

Alloy Digest ◽  
2006 ◽  
Vol 55 (6) ◽  
Keyword(s):  
Heat Treatment ◽  
High Temperature ◽  
Physical Properties ◽  
Elevated Temperatures ◽  
Alloy Composition ◽  
Heat Treating ◽  
Chromium Alloy ◽  
Nickel Chromium ◽  
Temperature Performance ◽  
Wide Range

Abstract HPM X-750 is a precipitation-hardenable nickel-chromium alloy that is well suited for a wide range of corrosive and oxidizing environments where strength must be maintained to elevated temperatures. The alloy composition provides a product that performs well at elevated temperatures up to 700 deg C (1300 deg F). The strength can be increased by heat treatment. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance as well as forming, heat treating, and joining. Filing Code: Ni-638. Producer or source: Hamilton Precision Metals.

High Temperature Dielectric Property Measurements - An Insight into Microwave Loss Mechanisms in Engineering Ceramics

1994 ◽  
Vol 347 ◽  
Author(s):  
J. G. P. Binnen ◽  
T. E. Cross ◽  
N. R. Greenacre ◽  
M. Naser-Moghadasi
Keyword(s):  
High Temperature ◽  
Dielectric Property ◽  
Microwave Dielectric Property ◽  
Elevated Temperatures ◽  
Engineering Ceramics ◽  
Microwave Dielectric ◽  
Wide Range ◽  
Microwave Loss ◽  
Effect Of Impurities ◽  
Loss Mechanisms

ABSTRACTIt is now possible, in a number of laboratories worldwide, to make microwave dielectric property measurements at temperatures up to about 1500°C. These measurements have shown that the loss tangent, tanδ, of a wide range of engineering ceramics increases dramatically at elevated temperatures. The interaction between the ceramic material and the impurities present during processing can have a dramatic effect on both the ease with which the material is able to extract energy from the microwave field and on the properties of the final ceramic. While the effect of impurities on the ceramic properties is relatively well understood the effect of impurities on the microwave loss mechanisms at elevated temperatures is not. This paper will review some of the recent work on the high temperature microwave dielectric property measurements performed at Nottingham.

The European SEEL (Solutions for energy efficient lighting) project: High temperature electronics for LED-lighting architectures

2013 ◽  
Vol 2013 (HITEN) ◽  
pp. 000193-000206
Author(s):  
S. Habenicht ◽  
H.J. Funke ◽  
D. Gruber ◽  
D. Oelgeschläger ◽  
O. Schumacher ◽  
...  
Keyword(s):  
High Temperature ◽  
Elevated Temperatures ◽  
Temperature Treatment ◽  
Current Status ◽  
High Temperature Treatment ◽  
Mechanical Degradation ◽  
Led Driver ◽  
High Temperature Electronics ◽  
Architecture Evaluation ◽  
High Efficient

Due to superior properties in energy-efficiency and design freedom, the “liberation of light” by LED-technology will draw more attention in future applications. Within the European SEEL project, the partners are performing research in enabling technologies for high-temperature electronics (up to 185°C) to be designed into the next generation of high-efficient LED-driver circuits. This requires high-temperature evaluation of the product architecture of electronic components, i.e. the 1st-level interconnection, i.e. the chip metallization and the chip bonding technology. Different methods such as Au- and Cu-wirebonding as well as soft-soldering technologies are evaluated and discussed. The material properties, i.e. the encapsulating mound compound and the die adhesives play an important role as these materials tend to degrade at elevated temperatures. On top of that, also the board mounting architecture of the products, i.e. the board materials and the interconnection techniques such as high-temperature soldering play an important role and have to be discussed during the architecture evaluation, as solder joints and board materials are prominent candidates for mechanical degradation during high-temperature treatment. Thermal aspects in the circuit design in order to prevent part of the system architecture from overheating during operation, play an important role in the system design. The current status of the project as well as the future exploitation outlook will be presented.

TANTALOY 63 METAL

Alloy Digest ◽  
1982 ◽  
Vol 31 (4) ◽  
Keyword(s):  
Corrosion Resistance ◽  
Electron Beam ◽  
High Temperature ◽  
Heat Exchangers ◽  
Elevated Temperatures ◽  
Base Alloy ◽  
Heat Treating ◽  
Temperature Performance ◽  
Wide Range ◽  
Better Than

Abstract TANTALOY 63 Metal is a tantalum-base alloy containing typically 2.5% tungsten and 0.15% columbium. It is melted in an electron-beam furance. Its strength is considerably greater than that of unalloyed tantalum. For a wide range of chemicals at elevated temperatures, its corrosion resistance is comparable to or better than that of pure tantalum. Typical appalications are heaters, condensers and multi-tube heat exchangers. This datasheet provides information on composition, physical properties, hardness, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: Ta-5. Producer or source: Fansteel Metallurgical Corporation.

scholarly journals High-throughput design of high-performance lightweight high-entropy alloys

2021 ◽  
Vol 12 (1) ◽  
Author(s):  
Rui Feng ◽  
Chuan Zhang ◽  
Michael C. Gao ◽  
Zongrui Pei ◽  
Fan Zhang ◽  
...  
Keyword(s):  
High Temperature ◽  
High Throughput ◽  
High Throughput Screening ◽  
Elevated Temperatures ◽  
Alloy System ◽  
Computational Method ◽  
High Entropy Alloy ◽  
High Entropy Alloys ◽  
Theoretical Understanding ◽  
High Entropy

AbstractDeveloping affordable and light high-temperature materials alternative to Ni-base superalloys has significantly increased the efforts in designing advanced ferritic superalloys. However, currently developed ferritic superalloys still exhibit low high-temperature strengths, which limits their usage. Here we use a CALPHAD-based high-throughput computational method to design light, strong, and low-cost high-entropy alloys for elevated-temperature applications. Through the high-throughput screening, precipitation-strengthened lightweight high-entropy alloys are discovered from thousands of initial compositions, which exhibit enhanced strengths compared to other counterparts at room and elevated temperatures. The experimental and theoretical understanding of both successful and failed cases in their strengthening mechanisms and order-disorder transitions further improves the accuracy of the thermodynamic database of the discovered alloy system. This study shows that integrating high-throughput screening, multiscale modeling, and experimental validation proves to be efficient and useful in accelerating the discovery of advanced precipitation-strengthened structural materials tuned by the high-entropy alloy concept.

Improving Oil well Cement Slurry Performance Using Hydroxypropylmethylcellulose Polymer

2013 ◽  
Vol 787 ◽  
pp. 222-227 ◽  
Author(s):  
Ghulam Abbas ◽  
Sonny Irawan ◽  
Sandeep Kumar ◽  
Ahmed A.I. Elrayah
Keyword(s):  
Compressive Strength ◽  
High Temperature ◽  
Rheological Properties ◽  
Elevated Temperatures ◽  
Free Water ◽  
Oil Wells ◽  
Fluid Loss ◽  
Cement Slurry ◽  
Multifunctional Additive ◽  
Wide Range

At present, high temperature oil wells are known as the most problematic for cementing operation due to limitations of polymer. The polymers are significantly used as mutlifunctional additives for improving the properties of cement slurry. At high temperature, viscosity of polymer decreases and unable to obtained desired properties of cement slurry. It becomes then major cause of fluid loss and gas migration during cementing operations. Thus, it necessitates for polymers that can able to enhance viscosity of slurry at elevated temperatures. This paper is aiming to study Hydroxypropylmethylcellulose (HPMC) polymer at high temperature that is able to increase the viscosity at elevated temperature. In response, experiments were conducted to characterize rheological properties of HPMC at different temperatures (30 to 100 °C). Then it was incorporated as multifunctional additive in cement slurry for determining API properties (fluid loss, free water, thickening time and compressive strength). It was observed that HPMC polymer has remarkable rheological properties that can have higher viscosity with respect to high temperatures. The best concentration of HPMC was found from 0.30 to 0.50 gallon per sack. This concentration showed minimal fluid loss, zero free water, high compressive strength and wide range of thickening time in cement slurry. The results signified that HPMC polymer is becoming multifunctional additive in cement slurry to improve the API properties of cement slurry and unlock high temperature oil wells for cementing operations.

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