Ultra High 3D Capacitors Values with High Volume Efficiency and Outstanding Stability

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001163-001191
Author(s):  
Catherine Bunel ◽  
Franck Murray
Keyword(s):  
Mass Production ◽  
High Reliability ◽  
High Volume ◽  
Volumetric Efficiency ◽  
Key Technology ◽  
Passive Devices ◽  
Package Size ◽  
Advanced Packaging ◽  
High Level ◽  
Volume Efficiency

IPDIA's primary effort is to develop innovative 3D technologies to integrate Passive Devices .One of their key technology drivers is the trench high-density capacitor. After introducing the 250nF/mm2 in mass production, it's now the turn to launch outstanding performances with a new worldwide record of 550nF/mm2. With the advanced packaging solutions using very thin dies stacking ,combining a high level of capacitance integration and high volumetric efficiency, this achievement will enable to extend the range of high reliability Silicon Capacitor values up to 10 μF in a package size 3.4mm*2.4mm*1.4mm and even smaller . This paper will provide the details to prove that the former ambitious target of 2 μF/mm3 is now close to reality.

Lithography Process Challenges for 3D and 2.5D Applications

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 000398-000424
Author(s):  
Doug Shelton ◽  
Tomii Kume
Keyword(s):  
High Resolution ◽  
Process Optimization ◽  
Mass Production ◽  
Low Cost ◽  
High Density ◽  
Through Silicon Via ◽  
Key Technology ◽  
Lithography Process ◽  
Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon will continue its discussion of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications.

Lithography Process Optimization for 3D and 2.5D Applications

2013 ◽  
Vol 2013 (1) ◽  
pp. 000790-000793 ◽  
Author(s):  
Doug Shelton ◽  
Tomii Kume
Keyword(s):  
High Resolution ◽  
Process Optimization ◽  
Preliminary Data ◽  
Mass Production ◽  
Low Cost ◽  
High Density ◽  
Through Silicon Via ◽  
Key Technology ◽  
Lithography Process ◽  
Advanced Packaging

Lithography process optimization is a key technology enabling mass production of high-density interconnects using 3D and 2.5D technologies. In this paper, Canon continues its investigation of lithography optimization of thick-resist profiles and overlay accuracy to increase process margins for Through-Silicon Via (TSV) and Redistribution Layer (RDL) applications. Canon will also provide updates on the FPA-5510iV and FPA-5510iZ i-line steppers that are gaining acceptance as high-resolution, and low-cost lithography solutions for aggressive advanced packaging, 3D and 2.5D applications also preliminary data illustrating 450 mm wafer process challenges.

scholarly journals Validity of patient-reported complications after total hip and knee arthroplasty

2018 ◽  
Vol 26 (3) ◽  
pp. 230949901880249 ◽  
Author(s):  
Kinh Luan Thanh Dang ◽  
Helen Badge ◽  
Ian A Harris
Keyword(s):  
Knee Arthroplasty ◽  
High Volume ◽  
Total Hip ◽  
Joint Replacement Surgery ◽  
Patient Reports ◽  
Replacement Surgery ◽  
Telephone Interviews ◽  
Patient Reported ◽  
Hip And Knee Arthroplasty ◽  
High Level

Background: Evaluating the effectiveness of total hip arthroplasty (THA) and total knee arthroplasty (TKA) often relies on accurate patient reporting of postoperative complications. Despite this, there is little research regarding the accuracy of patient reports. We aimed to determine the accuracy of patient-reported significant complications after THA and TKA. Methods: Patients were recruited prior to undergoing primary hip or knee arthroplasty at 19 high-volume hospitals. After surgery, follow-up of patients via telephone interviews at 35, 90 and 365 days recorded surgical outcomes including readmission, reoperation and venous thromboembolism (VTE). Patient-reported complications were verified via medical record audits and liaison with surgeons, general practitioners or other health professionals. Surgical and demographic information and patient-reported and verified complications were entered into a database. Patient-reported and verified complications were compared for readmission, reoperation and VTE. Results: The sample included 150 of 1811 patients who reported a total of 242 significant complications. Of the 242 patient-reported complications, 224 (92.6%) were correct (true positive). The type of complication had variable levels of accuracy in patient reports. Readmission to hospital was accurately reported by 90.2% (129/143) of patients. Reoperation (including any manipulations under anaesthesia, joint washouts, reductions of dislocated joints and revisions) was accurately reported by 98.7% (75/76) of patients. VTE was accurately reported by 86.7% (20/23) of patients. Conclusion: A high level of accuracy in patient-reported experience of complications was demonstrated following THA and TKA. Patient-reported complications may be reliably used for post-operative surveillance of joint replacement surgery.

Flip-Chip Flux Evolution

2019 ◽  
Vol 2019 (1) ◽  
pp. 000115-000119 ◽  
Author(s):  
Andy Mackie ◽  
Hyoryoon Jo ◽  
Sze Pei Lim
Keyword(s):  
Flip Chip ◽  
Elevated Temperatures ◽  
High Volume ◽  
Automotive Electronics ◽  
Assembly Process ◽  
Surface Finishes ◽  
Solder Bumps ◽  
Thermocompression Bonding ◽  
Advanced Packaging ◽  
Flip Chip Assembly

Abstract Flip-chip assembly accounts for more than 80% of the advanced packaging technology platform, compared to fan-in, fan-out, embedded die, and through silicon via (TSV). Flip-chip interconnect remains a critical assembly process for large die used in artificial intelligence processors; thin die that warps at elevated temperatures; heterogeneous integration in SiP applications; flip-chip on leadframe; and MicroLED die usage. This paper will first outline trends in evolving flip-chip and direct chip placement (DCP) technology, then will examine the changing nature of the solder bump, the interconnect itself, and the substrate. Many variables of the flip-chip assembly process will be discussed, including standard solder bumps to micro Cu-pillar bumps with different alloys; different pad surface finishes of Cu OSP, NiAu, and solder on pad (SOP); and from regular pads on substrates to bond-on-trace applications. A major focus will be on flip-chip assembly methods, from old C4 conventional reflow processing to thermocompression bonding (TCB), and the latest laser assisted bonding (LAB) technology, with an emphasis on how the usage of different technologies necessitates different assembly materials, especially fluxes. Flip-chip fluxes such as the commonly used water-washable flux, the standard no-clean flux, and the ultra-low residue flux, and how these fluxes react to different processing methods, will be an area of discussion. Finally, the paper will examine the need for increased reliability as the technology inevitably moves into the high-volume, zero-defect arena of automotive electronics.

Packaging Materials for 2.5/3D Technology

2013 ◽  
Vol 2013 (1) ◽  
pp. 000276-000284 ◽  
Author(s):  
Brian Schmaltz
Keyword(s):  
High Reliability ◽  
Low Cost ◽  
High Yield ◽  
Wafer Level ◽  
Reflow Process ◽  
Thermal Compression ◽  
Conductive Films ◽  
Cu Pillar ◽  
Advanced Packaging ◽  
Capillary Underfill

The age of advanced mobile devices is on the direct horizon, are we ready for it? Less power consumption, faster processing, high reliability, high yield, low cost are words engineers are all too familiar with. 2.5/3D utilizing interposer technology, Thru Silicon Via (TSV), sub-50μm die thickness are a few of the latest techniques engineers use to solve these issues. As technology progresses to smaller process generations, new packaging applications are being demanded. The standard solder reflow process is being pushed by advancements in Cu pillar bumps, thermal compression bonding (TCB) and wafer level / pre-applied materials. This presentation will centralize around the latest advancements in NAMICS Materials for Advanced Packaging Technology; Capillary Underfill (CUF), Pre-Applied Material, Non-Conductive Paste (NCP), Non-Conductive Films (NCF).

Automated Precision Assembly for High-Volume HB LEDs

2011 ◽  
Vol 2011 (1) ◽  
pp. 000117-000122
Author(s):  
Donald J. Beck ◽  
Jessica Sylvester
Keyword(s):  
Light Emitting Diode ◽  
High Reliability ◽  
Bright Light ◽  
High Volume ◽  
Commercial Production ◽  
Production Lines ◽  
Light Emitting ◽  
Die Attach ◽  
High Volume Production ◽  
Volume Production

Since the introduction of automated die and wire bonders in the 1980s, equipment manufacturers and process engineers have been challenged to balance speed with repeatability. Today, die bonders can perform epoxy die attach at a rate of 1.5 to 4 thousand die per hour [6]; and wire bonders can interconnect complex packages at speeds of more than 10 wires per second [7]. The advantage of automation is speed and consistency—however, there is one major concern with operating at these speeds: if something in the assembly process is wrong, everything will be wrong. Having tightly regulated assembly processes helps avoid the risk of building a large batch of rejected product. This paper presents a methodology and process flow supporting High Bright Light Emitting Diode (HB LED) automated assembly, supported by equipment certification, product inspection and SPC data collection methods. The methods presented in this paper have been formulated through extensive work in the high-reliability microelectronics industry and commercial production lines over the last three decades. To ensure time-to-market success in high-volume production, specific methods to achieve throughput and quality are required. This paper will cover the strategies and methods necessary to achieve the ultimate goal of an automated precision HB LED assembly—to blend the requirements of high-reliability and high-throughput to support high-volume commercial production.

Assembly Equipment Requirements for Next Generation Advanced Packaging

2016 ◽  
Vol 2016 (1) ◽  
pp. 000321-000325
Author(s):  
Bob Chylak ◽  
Horst Clauberg ◽  
Tom Strothmann
Keyword(s):  
Capital Investment ◽  
Flip Chip ◽  
High Volume ◽  
Electrical Performance ◽  
Wafer Level ◽  
Considerable Uncertainty ◽  
Thermocompression Bonding ◽  
Advanced Packaging ◽  
The Impact ◽  
3D Package

Abstract Device packaging is undergoing a proliferation of assembly options within the ever-expanding category of Advanced Packaging. Fan Out-Wafer Level Packages are achieving wide adoption based on improved performance and reduced package size and new System in Package products are coming to market in FOWLP, 2.5D and 3D package formats with the full capability to leverage heterogeneous integration in small package profiles. While the wide-spread adoption of thermocompression bonding and 2.5D packages predicted several years ago has not materialized to the extent predicted, advanced memory modules assembled by TCB are in high volume manufacturing, as are some high-end GPUs with integrated memory on Si interposer. High accuracy flip chip has been pushed to fine pitches that were difficult to imagine only three years ago and innovation in substrates and bonder technology is pushing the throughput and pitch capability even further. The packaging landscape, once dominated by a few large assembly providers, now includes turn-key packaging initiatives from the foundries with an expanding set of fan-out packing options. The fan-out processes include face-up and face-down methods, die first and die last methods and 2.5D or 3D package options. Selection of the most appropriate packaging technology from the combined aspects of electrical performance, form-factor, yield and cost presents a complex problem with considerable uncertainty and high risk for capital investment. To address this problem, the industry demands flexible manufacturing solutions that can be modified and upgraded to accommodate a changing assembly environment. This presentation will present the assembly process flows for various packaging options and discuss the key aspects of the process that influence throughput, accuracy and other key quality metrics, such as package warpage. These process flows in turn impose design constraints on submodules of the bonder. It will be shown that thoughtfully designed machine architecture allows for interchangeable and upgradeable submodules that can support nearly the entire range of assembly options. As an example, a nimble, low weight, medium force, constant heat bondhead for high throughput FOWLP can be interchanged with a high force, pulse heater bondhead to support low stress/low warpage thermocompression bonding. The various configuration options for a flexible advanced packaging bonder will be reviewed along with the impact of configuration changes on throughput and accuracy.

Is the EuroSCORE II reliable in surgical mitral valve repair? A single-centre validation study

2020 ◽  
Author(s):  
Davide Carino ◽  
Paolo Denti ◽  
Guido Ascione ◽  
Benedetto Del Forno ◽  
Elisabetta Lapenna ◽  
...  
Keyword(s):  
Mitral Valve ◽  
Mitral Valve Repair ◽  
Goodness Of Fit ◽  
Area Under The Curve ◽  
High Volume ◽  
Brier Score ◽  
Calibration Plot ◽  
Valve Repair ◽  
Goodness Of Fit Test ◽  
High Level

Abstract OBJECTIVES The EuroSCORE II is widely used to predict 30-day mortality in patients undergoing open and transcatheter cardiac surgery. The aim of this study is to evaluate the discriminatory ability of the EuroSCORE II in predicting 30-day mortality in a large cohort of patients undergoing surgical mitral valve repair in a high-volume centre. METHODS A retrospective review of our institutional database was carried on to find all patients who underwent mitral valve repair in our department from January 2012 to December 2019. Discrimination of the EuroSCORE II was assessed using receiver operating characteristic curves. The maximum Youden’s Index was employed to define the optimal cut-point. Calibration was assessed by generating calibration plot that visually compares the predicted mortality with the observed mortality. Calibration was also tested with the Hosmer–Lemeshow goodness-of-fit test. Finally, the accuracy of the models was tested calculating the Brier score. RESULTS A total of 2645 patients were identified, and the median EuroSCORE II was 1.3% (0.6–2.0%). In patients with degenerative mitral regurgitation (MR), the EuroSCORE II showed low discrimination (area under the curve 0.68), low accuracy (Brier score 0.27) and low calibration with overestimation of the 30-day mortality. In patients with secondary MR, the EuroSCORE II showed a good overall performance estimating the 30-day mortality with good discrimination (area under the curve 0.88), good accuracy (Brier score 0.003) and good calibration. CONCLUSIONS In patients with degenerative MR operated on in a high-volume centre with a high level of expertise in mitral valve repair, the EuroSCORE II significantly overestimates the 30-day mortality.

scholarly journals Research on the Detection Method of Implicit Self Symmetry in a High-Level Semantic Model

Symmetry ◽  
2019 ◽  
Vol 12 (1) ◽  
pp. 28 ◽  
Author(s):  
Chao Wang
Keyword(s):  
Point Cloud ◽  
Detection Method ◽  
Cloud Model ◽  
High Reliability ◽  
Semantic Model ◽  
Symmetry Detection ◽  
Model Surface ◽  
Point Cloud Model ◽  
High Level ◽  
Skeleton Point

In order to improve the accuracy of semantic model intrinsic detection, a skeleton-based high-level semantic model intrinsic self-symmetry detection method is proposed. The semantic analysis of the model set is realized by the uniform segmentation of the model within the same style, the component correspondence of the model between different styles, and the shape content clustering. Based on the results of clustering analysis, for a given three-dimensional (3D) point cloud model, according to the curve skeleton, the skeleton point pairs reflecting the symmetry between the model surface points are obtained by the election method, and the symmetry is extended to the model surface vertices according to these skeleton point pairs. With the help of skeleton, the symmetry of the point cloud model is obtained, and then the symmetry region of point cloud model is obtained by the symmetric correspondence matrix and spectrum method, so as to realize the intrinsic symmetry detection of the model. The experimental results show that the proposed method has the advantages of less time, high accuracy, and high reliability.

Application of RFID to High-Reliability Nuclear Power Plant Construction

2006 ◽  
Author(s):  
Kenji Akagi ◽  
Masayuki Ishiwata ◽  
Kenji Araki ◽  
Jun-Ichi Kawahata
Keyword(s):  
Power Plant ◽  
Nuclear Power Plant ◽  
Mass Production ◽  
Nuclear Power ◽  
High Reliability ◽  
Construction Technology ◽  
Rfid Technology ◽  
Plant Construction ◽  
Under Construction ◽  
Production Industry

In nuclear power plant construction, countless variety of parts, products, and jigs more than one million are treated under construction. Furthermore, strict traceability to the history of material, manufacturing, and installation is required for all products from the start to finish of the construction, which enforce much workforce and many costs at every project. In an addition, the operational efficiency improvement is absolutely essential for the effective construction to reduce the initial investment for construction. As one solution, RFID (Radio Frequent Identification) application technology, one of the fundamental technologies to realize a ubiquitous society, currently expands its functionality and general versatility at an accelerating pace in mass-production industry. Hitachi believes RFID technology can be useful of one of the key solutions for the issues in non-mass production industry as well. Under this situation, Hitachi initiated the development of next generation plant concept (ubiquitous plant construction technology) which utilizes information and RFID technologies. In this paper, our application plans of RFID technology to nuclear power is described.

Sign in / Sign up

Export Citation Format

Share Document