Flexible On-Chip Inductors and Transformer

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 001948-001966 ◽  
Author(s):  
James J. Wang

Inductors directly on-chip was designed, processed and tested. Combining thick, electroplated gold used to produce LCD driver ICs plus gold wire bonding, toroidal inductors are formed directly on top of ICs. Both processes are production ready. One layouts inductor line segments on top of ICs and then complete loops using gold wire bonds at packaging. Two, 4, 8 or 16 toroids will fit inside thin QFN package. Cost to integrate 2 or more inductors is less than buying 0402 chip inductors and then soldering SMT components around ICs. Integrating inductors shrinks PCB board and allows IC design of filters, LC oscillator, EM noise suppression or ESD protection circuits. On-chip 4nH to 2000nH inductors is practical today. Choosing the magnetic core material and selecting the number of loops/turns, designers can integrate different inductors on top of an existing IC. Custom, ultra-tiny magnetic cores are produced from same magnetic materials that are inside discrete inductors or transformers. 50nH to 500nH inductors with Q comparable to chip inductors are possible for MHz frequency ranges by selecting ferrite core. Using high permeability permalloy, one produces 200nH to 2000nH inductors or transformers directly on-chip. Flexibility is another advantage of on-chip Gold InductorsTM. By adjusting loop heights during wire bonding, one can adjust inductance value +- 100%. By laying out both primary and secondary coils around magnetic core, designers can choose to integrate transformer or inductors. Low cost, production processes, control with IC design, plus flexibility, one can begin to design and produce on-chip filters and transformers; achieving smaller electronics.

2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000334-000338
Author(s):  
Jens Müller ◽  
Thomas Mache ◽  
Torsten Thelemann

Electroless plating on silver is a low cost alternative to printing of mixed metals or pure gold paste systems on LTCC. It overcomes the necessity to have material transitions from inner to outer layers or from conductor lines to wire bonding- or solder-pads. Since no commercial process and material set for silver thick film conductors has been available on the market a proprietary Ni/Pd/Au coating technology was developed for the use on silver inks for LTCC and Al2O3-ceramic as a base for both soldering and wire bonding. The work included the screening of different chemicals as well as several silver paste systems from two commercial vendors. Conductor adhesion, plating layer thicknesses, plating accuracy, (lead free) solderability and gold wire-bondability were assessed to optimize the process. Layers of about 5 microns Ni, (0.1 to 0.3) microns Pd and (0.05 to 0.15) microns Au were electrolessly deposited. The developed Ni-Pd-Au finish is an economical alternative with only about a quarter of the cost compared to the conventional use of silver, silver / palladium and gold compounds for ceramic substrates. This technology allows coating of the structures down to a fine pad size of 200×200 microns and a minimum line width of 100 microns, without reducing the adhesion mechanism between thick-film metallization and ceramic substrate. By covering of pure conductors with high temperature glass or dielectrics, further material saving is possible. Besides, the process offers also very good coating of structures in cavities.


Alloy Digest ◽  
1983 ◽  
Vol 32 (1) ◽  

Abstract Unilec 1409 Al is a ductile alloy steel that is moderately magnetic, has high electrical resistance and relatively low cost. It is capable of resisting oxidation for continuous duty at temperatures up to 1800 F and is satisfactory for intermittent heating up to 1600 F. It is primarily used as an electrical-resistance alloy, but it also can be used as a magnetic core material in applications where resistance to oxidation and corrosion are required. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance and corrosion resistance as well as forming, heat treating, machining, and joining. Filing Code: SS-419. Producer or source: Cyclops.


Alloy Digest ◽  
1963 ◽  
Vol 12 (6) ◽  

Abstract Carpenter No. 1-JR is a low cost oxidation-resistant steel which offers an excellent combination of electrical resistance and scale resistance. It is primarily used as an electrical resistant material, but is also used as a magnetic core material where resistance to oxidation and corrosion are required. This datasheet provides information on composition, physical properties, elasticity, and tensile properties. It also includes information on high temperature performance as well as forming, heat treating, machining, and joining. Filing Code: SS-144. Producer or source: Carpenter.


Author(s):  
C. H. Chen ◽  
W. L. Tsai ◽  
C. Y. Tang ◽  
M. Y. Tsai

The LED issues, associated with high cost, high junction temperature, low luminous efficiency, and low reliability, have to be solved before gaining more market penetration. With special features of low-junction-temperature and low-cost design, COP (Chip-on-Plate) LED package modules with and without phosphors are evaluated in terms of their thermal resistance and reliability under wet high temperature operation life (WHTOL) test. The WHTOL test is with the condition of 85°C/85% RH and 350mA of forward current for 1008 hrs, specified in JESD22 Method A101-B. First of all, the thermal behaviors of the COP package module are investigated by experimental measurement, and a computational fluid dynamics approach. The reliability under WHTOL test is then carried out. The results show that all COP package modules with phosphors in the silicone encapsulant failed after 309 hrs at WHTOL test, but all those without phosphors passed for 1008 hrs. The failure sites are located at aluminum wire debonding to the chip and copper pads of the substrate. However, the aluminum wire bonding of the COP package modules are replaced to gold wire bonding, then all COP package modules with and without phosphors pass for 1008 hrs. For the passing package modules, their thermal resistances are found to increase more than two fold after 1008 hrs of the WHTOL test from 41°C/W to 87.1°C/W. This is due to the thermal conductivity decreasing in the die attach and thermal grease and the contact resistance increasing after the moisture absorption. Moreover, for the thermal behavior of the COP package modules under the natural and forced convections in the WHTOL test, the results show that there exists the difference of 17°C/W in the junction-to-air thermal resistances, which might result in different reliability data. In addition, it is also indicated that the junction-to-air thermal resistances are very sensitive to the flow conditions of the chamber, but not for junction-to-aluminum substrate and junction-to-heat sink thermal resistances. Therefore, the standard test of the WHTOL should specify flow conditions in the test chamber.


Sensors ◽  
2020 ◽  
Vol 20 (10) ◽  
pp. 2921 ◽  
Author(s):  
Matteo Lodi ◽  
Alberto Oliveri

In this paper, a nonlinear observer is proposed for the estimation of the current ripple in a ferrite-core inductor working in partial saturation, mounted on a boost converter. The estimator is based on a recently proposed nonlinear inductance model, which expresses the inductance as a function of the inductor current, taking into account also the non-negligible effects of the core temperature. The proposed observer is implemented on a low-cost microcontroller and tested, both offline and online, on a real boost converter with different operating conditions. The offline tests show a satisfactory estimation accuracy both during the electrical (fast) and thermal (slow) transients. Due to the high microcontroller latency, some delays and inaccuracies occur during electrical transients in the online tests. This work suggests that, in order to exploit the observer for control purposes, the target architecture should be a high-performance microcontroller, a system-on-chip, or a field programmable gate array, where parallelism can be exploited to speed-up the computations. The proposed implementation can be instead suitable for switch-mode power supply (SMPS) monitoring purposes.


Sensors ◽  
2019 ◽  
Vol 19 (5) ◽  
pp. 1178 ◽  
Author(s):  
Jorge Prada ◽  
Christina Cordes ◽  
Carsten Harms ◽  
Walter Lang

This contribution outlines the design and manufacturing of a microfluidic device implemented as a biosensor for retrieval and detection of bacteria RNA. The device is fully made of Cyclo-Olefin Copolymer (COC), which features low auto-fluorescence, biocompatibility and manufacturability by hot-embossing. The RNA retrieval was carried on after bacteria heat-lysis by an on-chip micro-heater, whose function was characterized at different working parameters. Carbon resistive temperature sensors were tested, characterized and printed on the biochip sealing film to monitor the heating process. Off-chip and on-chip processed RNA were hybridized with capture probes on the reaction chamber surface and identification was achieved by detection of fluorescence tags. The application of the mentioned techniques and materials proved to allow the development of low-cost, disposable albeit multi-functional microfluidic system, performing heating, temperature sensing and chemical reaction processes in the same device. By proving its effectiveness, this device contributes a reference to show the integration potential of fully thermoplastic devices in biosensor systems.


Author(s):  
S.L. Khoury ◽  
D.J. Burkhard ◽  
D.P. Galloway ◽  
T.A. Scharr

1999 ◽  
Vol 22 (1) ◽  
pp. 7-15 ◽  
Author(s):  
R.W. Johnson ◽  
M.J. Palmer ◽  
M.J. Bozack ◽  
T. Isaacs-Smith

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