A comparison of copper and gold wire bonding on integrated circuit devices

Author(s):  
S.L. Khoury ◽  
D.J. Burkhard ◽  
D.P. Galloway ◽  
T.A. Scharr
Author(s):  
Qian Xie ◽  
Kun Long ◽  
Dening Lu ◽  
Dawei Li ◽  
Yuan Zhang ◽  
...  

1990 ◽  
Vol 13 (4) ◽  
pp. 673-681 ◽  
Author(s):  
S.L. Khoury ◽  
D.J. Burkhard ◽  
D.P. Galloway ◽  
T.A. Scharr

2021 ◽  
Vol 22 (2) ◽  
pp. 306-315
Author(s):  
Chatpon Phimpha ◽  
Sombat Sindhuchao

Manufacturing process improvement is necessary for manufacturers to gain business advantages. Re-using or increasing the useful lives of machine parts is considered to be a process of performance improvement. To re-use parts, the manufacturers must know the effects of the factors related to workpieces' qualities to prevent defects. This research study aims at presenting the results of analysing the effects of the factors and mathematical models for bond shear strength when reusing gold wire bonding capillary in the gold wire bonding process of integrated circuit (IC) products using design experiment. The operation factors in the reference experiment, including bond force, bond time, USG current, EFO current and EFO gap, are investigated. The Fractional Factorial Design was used to determine five factors that affect the bond shear strength. The analysis of the results show that the bond force is a significant factor where increasing bond force factors leads to increasing bond shear strength. In the end, a Regression model of bond shear strength is obtained to show the result between the bond shear strength and effect of factors. ABSTRAK: Proses pembaharuan pengilangan adalah penting untuk para pengilang bagi memperoleh keuntungan bisnes. Guna-semula atau menambah jangka hayat pada bahagian-bahagian tertentu pada mesin adalah dianggar sebahagian proses penambahbaikan prestasi mesin. Bagi mengguna semula bahagian-bahagian ini, pengilang mesti mengetahui akibat sesuatu faktor berkaitan kualiti bahan bagi mengelak kecacatan. Kajian ini bertujuan menyampaikan dapatan kajian melalui kesan faktor dan model matematik pada kekuatan ricihan ikatan apabila mengguna semula wayar emas melalui proses kapilari ikatan wayar emas pada produk litar bersepadu melalui rekaan eksperimen. Faktor operasi melalui rujukan eksperimen dari daya ikatan, masa ikatan, arus USG, arus EFO dan jarak EFO dikaji. Rekaan Faktorial Pecahan digunakan bagi mendapatkan lima faktor yang mempengaruhi kekuatan ricihan ikatan. Dapatan kajian menunjukkan daya ikatan merupakan faktor penting di mana, pertambahan faktor daya ikatan menguatkan ricihan ikatan. Akhirnya, model Regression kekuatan ricihan ikatan diperoleh bagi menjelaskan dapatan kajian antara kekuatan ricihan ikatan dan kesan faktor.


1999 ◽  
Vol 22 (1) ◽  
pp. 7-15 ◽  
Author(s):  
R.W. Johnson ◽  
M.J. Palmer ◽  
M.J. Bozack ◽  
T. Isaacs-Smith

2015 ◽  
Vol 137 (1) ◽  
Author(s):  
Fuliang Wang ◽  
Dengke Fan

A wire clamp is used to grip a gold wire with in 1–2 ms during thermosonic wire bonding. Modern wire bonders require faster and larger opening wire clamps. In order to simplify the design process and find the key parameters affecting the opening of wire clamps, a model analysis based on energy conservation was developed. The relation between geometric parameters and the amplification ratio was obtained. A finite element (FE) model was also developed in order to calculate the amplification ratio and natural frequency. Experiments were carried out in order to confirm the results of these models. Model studies show that the arm length was the major factor affecting the opening of the wire clamp.


2012 ◽  
Vol 2012 (CICMT) ◽  
pp. 000334-000338
Author(s):  
Jens Müller ◽  
Thomas Mache ◽  
Torsten Thelemann

Electroless plating on silver is a low cost alternative to printing of mixed metals or pure gold paste systems on LTCC. It overcomes the necessity to have material transitions from inner to outer layers or from conductor lines to wire bonding- or solder-pads. Since no commercial process and material set for silver thick film conductors has been available on the market a proprietary Ni/Pd/Au coating technology was developed for the use on silver inks for LTCC and Al2O3-ceramic as a base for both soldering and wire bonding. The work included the screening of different chemicals as well as several silver paste systems from two commercial vendors. Conductor adhesion, plating layer thicknesses, plating accuracy, (lead free) solderability and gold wire-bondability were assessed to optimize the process. Layers of about 5 microns Ni, (0.1 to 0.3) microns Pd and (0.05 to 0.15) microns Au were electrolessly deposited. The developed Ni-Pd-Au finish is an economical alternative with only about a quarter of the cost compared to the conventional use of silver, silver / palladium and gold compounds for ceramic substrates. This technology allows coating of the structures down to a fine pad size of 200×200 microns and a minimum line width of 100 microns, without reducing the adhesion mechanism between thick-film metallization and ceramic substrate. By covering of pure conductors with high temperature glass or dielectrics, further material saving is possible. Besides, the process offers also very good coating of structures in cavities.


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