Aerosol Jet® Printing of High Density, 3-D Interconnects for Multi-Chip Packaging

2010 ◽  
Vol 2010 (DPC) ◽  
pp. 002131-002152 ◽  
Author(s):  
Michael J. Renn ◽  
Bruce H. King ◽  
Michael O'Reilly ◽  
Jeff S. Leal ◽  
Suzette K. Pangrle
Keyword(s):  
Video Communication ◽  
High Density ◽  
Contact Material ◽  
Functional Requirements ◽  
3 Dimensional ◽  
Material Deposition ◽  
Printing System ◽  
Working Distance ◽  
Nanoparticle Ink ◽  
Semiconductor Packaging

Optomec's patented Aerosol Jet technology is a maskless, non-contact material deposition system used to enable 3-dimensional semiconductor packaging. This presentation highlights results of printing high density, 3-D interconnects on stacked die modules which incorporate video, communication and memory chips. Such packages are critical for meeting the increasing functional requirements of SmartPhones, personal entertainment, and other mobile devices. The Aerosol Jet system is used to deposit silver nanoparticle ink connections along the staircase sidewall of staggered multi-chip die stacks. High aspect ratio interconnects with 30-micron line width and greater than 10-micron line height are demonstrated at a pitch of 61-microns. After printing, the silver inks are cured at ~200°C for ~30 minutes, which gives interconnect resistances below one-Ohm (< 5 micron Ohm*cm). The stacks can include up to 8 die, with a total stack height below 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Multiplexed print nozzles are used to achieve production throughputs of greater than two interconnects per second per nozzle. Based on cost and functional advantages, the Aerosol Jet process is emerging as an effective alternative to traditional wire bond and through-silicon-via (TSV) technologies.

Aerosol Jet Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001250-001268
Author(s):  
Michael O'Reilly ◽  
Michael J. Renn ◽  
Stephen Barnes
Keyword(s):  
Aspect Ratio ◽  
Integrated Circuits ◽  
High Performance ◽  
3 Dimensional ◽  
Wire Bond ◽  
Printing System ◽  
Performance System ◽  
Definition Of ◽  
Working Distance ◽  
Nanoparticle Ink

Optomec's Aerosol Jet print platform provides an evolutionary alternative to both wire bond and TSV technology, providing high density 3-dimensional interconnect capabilities which enable multi-functional integrated circuits to be stacked and vertically interconnected in high performance System-in-Package (SiP) solutions. The die stacks can include 8 or more die, with a total stack height of ~ 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Closely coupled pneumatic atomizers with multiplexed print nozzles are used to achieve production throughput of greater than 15,000 interconnects per hour. The Aerosol Jet deposits silver nanoparticle ink connections on staggered multi-chip die stacks. High aspect ratio interconnects with <30-micron line width and 6-micron line heights have been demonstrated at sub 60-micron pitches with resistivity <1x10−7 ohm*m. Pre-production yields exceeding 80% have been consistently realized. This paper will be further expanded to include pre-production qualification results, final production packaging, and further definition of the Aerosol Jet print platform integrated within a high throughput, manufacturing ready automation solution.

An Innovation System for Building Manufacturing

2012 ◽  
Author(s):  
Flávio Craveiro ◽  
João Meneses de Matos ◽  
Helena Bártolo ◽  
Paulo Bártolo
Keyword(s):  
New Technologies ◽  
Innovation System ◽  
Efficient Solutions ◽  
Urban Environments ◽  
Functionally Graded ◽  
Functional Requirements ◽  
Geometric Information ◽  
Material Deposition ◽  
Novel Approach ◽  
Graded Material

Traditionally the construction sector is very conservative, risk averse and reluctant to adopt new technologies and ideas. The construction industry faces great challenges to develop more innovative and efficient solutions. In recent years, significant advances in technology and more sustainable urban environments has been creating numerous opportunities for innovation in automation. This paper proposes a new system based on extrusion-based technologies aiming at solving some limitations of current technologies to allow a more efficient building construction with organic forms and geometries, based on sustainable eco principles. This novel approach is described through a control deposition software. Current modeling techniques focus only on capturing the geometric information and cannot satisfy the requirements from modeling the components made of multi-heterogeneous materials. There is a great deal of interest in tailoring structures so the functional requirements can vary with location. The proposed functionally graded material deposition (FGM) system will allow a smooth variation of material properties to build up more efficient buildings regarding thermal, acoustic and structural conditions.

Three-Dimensional Magneto-Optical Recording

2004 ◽  
Vol 834 ◽  
Author(s):  
Akiyoshi Itoh
Keyword(s):  
Storage System ◽  
Three Dimensional ◽  
Optical Recording ◽  
High Density ◽  
The Novel ◽  
National Project ◽  
3 Dimensional ◽  
Disk Storage ◽  
High Density Recording ◽  
New Type

ABSTRACTIn this report, the newly developed three-dimensional magneto-optical (MO) recording scheme and the experimental results are reported. A part of this work has been done as the national project of 3D-MO (3-dimensional MO) project. It started at September 1998 and ended March 2002 as a part of the national project “Nanometer-Scale Optical High Density Disk Storage System” and aimed at achieving 100 Gb/in2 in storage density. Three-dimensional MO recording is one of the prosperous candidates of next generation ultra high density recording. Magnetic amplifying MO system (MAMMOS) is employed for achieving the novel three-dimensional MO recording. Double-MAMMOS scheme consists of 2-recording layers of differing compensation temperature (Tcomp ) and one readout layer was proposed and discussed.With write/read test it is succeeded to show the results corresponding to a 100 Gb/in2 (50 Gb/in2 × 2) recording density. We also proposed and showed results of simulations of a new type of Double-MAMMOS in which the recording layers can hold quadri-valued information by single writing process.

3D-IC Integration Using D2C or D2W Alignment Schemes Together with Local Oxide Reduction

2011 ◽  
Vol 2011 (DPC) ◽  
pp. 001291-001315
Author(s):  
Gilbert Lecarpentier ◽  
Jean-Stephane Mottet ◽  
Keith Cooper ◽  
Michael Stead
Keyword(s):  
Integrated Circuits ◽  
High Density ◽  
Oxide Reduction ◽  
3D Ic ◽  
3 Dimensional ◽  
Temperature Requirements

3-Dimensional interconnection of high density integrated circuits enables building devices with greater functionality with higher performances in a smaller space. This paper explores the chip-to-chip and chip-to-wafer alignment and the associated bonding techniques such as in-situ reflow or thermocompression with a local oxide reduction which contributes to higher yield together with reduction of the force or temperature requirements.

Die to Die and Die To Wafer Bonding Solution for High Density, Fine Pitch Micro-Bumped Die

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 002251-002284 ◽  
Author(s):  
Gilbert Lecarpentier ◽  
Joeri De Vos
Keyword(s):  
Wafer Bonding ◽  
Flip Chip ◽  
High Accuracy ◽  
High Density ◽  
Size Reduction ◽  
Direct Impact ◽  
3 Dimensional ◽  
Fine Pitch ◽  
Placement Accuracy ◽  
Die Bonding

Higher density interconnection using 3-Dimensional technology implies a pitch reduction and the use of micro-bumps. The micro-bump size reduction has a direct impact on the placement accuracy needed on the die placement and flip chip bonding equipment. The paper presents a Die-to-Die and Die-to-Wafer, high accuracy, die bonding solution illustrated by the flip chip assembly of a large 2x2cm die consisting of 1 million 10 μm micro-bumps at 20 μm pitch

Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications

2011 ◽  
Vol 2011 (1) ◽  
pp. 001028-001032
Author(s):  
Michael J. O’Reilly ◽  
Jeff Leal ◽  
Suzette K. Pangrle ◽  
Kenneth Vartanian
Keyword(s):  
Integrated Circuits ◽  
High Performance ◽  
Three Dimensional ◽  
Contact Printing ◽  
Wire Bond ◽  
Printing System ◽  
3D Printed ◽  
Working Distance ◽  
Aerosol Jet Deposition ◽  
Vertical Interconnect

Aerosol Jet deposition systems provide an evolutionary alternative to both wire bond and TSV technology. As part of the Vertical Interconnect Pillar (ViP™) process, the Aerosol Jet system prints high density three-dimensional (3D) interconnects enabling multi-function integrated circuits to be stacked and vertically interconnected in high performance System-in-Packages (SiP). The stacks can include two or more die, with a total height of ∼ 2 millimeters. The non-contact printing system has a working distance of several millimeters above the substrate allowing 3D interconnects to be printed with no Z-height adjustments. The Aerosol Jet printhead is configured with multiple nozzles and a closely coupled atomizer to achieve production throughput of greater than 19,000 interconnects per hour. The Aerosol Jet printer deposits silver fine particle ink to form connections on staggered die stacks. High aspect ratio interconnects, less than 30-microns wide and greater than 6-microns tall, are printed at sub 60-micron pitch. After isothermal sintering at 150° C to 200° C for 30 minutes, highly conductive interconnects near bulk resistivity are produced. Pre-production yields exceeding 80% have been realized. This paper will provide further details on the 3D printed interconnect process, current and planned production throughput levels, and process yield and device reliability status.

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

2020 ◽  
Vol 142 (3) ◽  
Author(s):  
Daiki Saito ◽  
Kazuhiko Sasagawa ◽  
Takeshi Moriwaki ◽  
Kazuhiro Fujisaki
Keyword(s):  
Grain Growth ◽  
Current Density ◽  
High Density ◽  
Metal Nanoparticle ◽  
Density Current ◽  
Ag Nanoparticle ◽  
Severe Problem ◽  
Atomic Transport ◽  
Current Loading ◽  
Nanoparticle Ink

Abstract Flexible printed circuits (FPCs) are widely used in electronic equipment such as mobile devices and wearable sensors. The conductive electric lines in these circuits are printed using nanoparticle metal ink and ink-jet direct write methods. Physical characteristics such as flexibility and mechanical durability of metal nanoparticle ink lines have been evaluated by bending or tensile tests. In contrast, the electrical characteristics of these lines have not been sufficiently evaluated, and the failure mechanism under high-density current has not been clarified. When electric devices are scaled down, current density and Joule heating increase in conductive lines and electromigration (EM) damage becomes a severe problem. Therefore, reducing the EM damage is extremely important to enhance the device reliability. In this study, a failure analysis of Ag nanoparticle ink lines were assessed using current loading tests and microscopic observations to discuss the damage mechanism and evaluate electrical reliability under high-density current. Atomic transport due to EM was observed at 60 kA/cm2 current loading, and relatively large aggregates and grain growth were observed at 120 kA/cm2 current loading. The time to open circuit was longer at 120 kA/cm2 than at 60 kA/cm2. The formation of large aggregates and unstable changes in the potential drop were observed at the two values of current density. It is considered that aggregate formation and grain growth affected the atomic transport by EM.

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