Measurement techniques for the characterization of the European mini test chip

2015 ◽  
Keyword(s):  
Measurement Techniques ◽  
Test Chip

The Use of Metallographic and SEM Analysis for Characterization of Sidewall Surfaces in MEMS Devices with DRIE Processing

2010 ◽  
Vol 2010 (1) ◽  
pp. 000703-000706
Author(s):  
Colin Stevens ◽  
Robert Dean ◽  
Samuel Lawrence ◽  
Lee Levine
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Measurement Techniques ◽  
Sem Analysis ◽  
Defect Structures ◽  
Mems Devices ◽  
Depth Of Focus ◽  
Surface Conditions ◽  
Side Walls

The Bosch Deep Reactive Ion Etch Process is commonly used for the manufacture of MEMS and MOEMS devices that require deep high aspect ratio trenches. In many cases fully released, high aspect ratio features can be generated in one pass. However the process must be understood to avoid generating some of the defect structures that are characteristic of the process. Defects such as scalloping, silicon grass, and undercutting at the interface of a nonconductive layer can be controlled by process parameters and optimization. Measurement and characterization of the defective structures is a key element of controlling them. The use of SEM measurement techniques for characterizing the small features associated with scalloping and silicon grass is essential. No other technique is capable of providing the large depth of focus required to visualize these features. The use of metallographic techniques furthers understanding of the surface conditions on the side walls of these deep trenches.

scholarly journals A method for extracting calibrated volatility information from the FIGAERO-HR-ToF-CIMS and its experimental application

2019 ◽  
Vol 12 (3) ◽  
pp. 1429-1439 ◽  
Author(s):  
Thomas J. Bannan ◽  
Michael Le Breton ◽  
Michael Priestley ◽  
Stephen D. Worrall ◽  
Asan Bacak ◽  
...  
Keyword(s):  
Vapour Pressure ◽  
Homologous Series ◽  
Measurement Techniques ◽  
Ionization Mass ◽  
Particle Phase ◽  
Knudsen Effusion ◽  
Vapour Pressure Measurement ◽  
Knudsen Effusion Mass Spectrometry ◽  
Real Atmosphere

Abstract. The Filter Inlet for Gases and AEROsols (FIGAERO) is an inlet specifically designed to be coupled with the Aerodyne High-Resolution Time-of-Flight Chemical Ionization Mass Spectrometer (HR-ToF-CIMS). The FIGAERO-HR-ToF-CIMS provides simultaneous molecular information relating to both the gas- and particle-phase samples and has been used to extract vapour pressures (VPs) of the compounds desorbing from the filter whilst giving quantitative concentrations in the particle phase. However, such extraction of vapour pressures of the measured particle-phase components requires use of appropriate, well-defined, reference compounds. Vapour pressures for the homologous series of polyethylene glycols (PEG) ((H-(O-CH2-CH2)n-OH) for n=3 to n=8), covering a range of vapour pressures (VP) (10−1 to 10−7 Pa) that are atmospherically relevant, have been shown to be reproduced well by a range of different techniques, including Knudsen Effusion Mass Spectrometry (KEMS). This is the first homologous series of compounds for which a number of vapour pressure measurement techniques have been found to be in agreement, indicating the utility as a calibration standard, providing an ideal set of benchmark compounds for accurate characterization of the FIGAERO for extracting vapour pressure of measured compounds in chambers and the real atmosphere. To demonstrate this, single-component and mixture vapour pressure measurements are made using two FIGAERO-HR-ToF-CIMS instruments based on a new calibration determined from the PEG series. VP values extracted from both instruments agree well with those measured by KEMS and reported values from literature, validating this approach for extracting VP data from the FIGAERO. This method is then applied to chamber measurements, and the vapour pressures of known products are estimated.

Experimental Characterization of the Vertical and Lateral Heat Transfer in 3D-SIC Packages

2015 ◽  
Author(s):  
Herman Oprins ◽  
Vladimir Cherman ◽  
Geert Van der Plas ◽  
Joeri De Vos ◽  
Eric Beyne
Keyword(s):  
Power Distribution ◽  
Hot Spot ◽  
Lateral Spreading ◽  
Experimental Characterization ◽  
Test Chip ◽  
Conductivity Increase ◽  
Thermal Conductivity Increase ◽  
Equivalent Properties ◽  
Lateral Heat

In this paper, we present the experimental characterization of 3D packages using a dedicated stackable test chip. An advanced CMOS test chip with programmable power distribution has been designed, fabricated, stacked and packaged in molded and bare die 3D packages. The packages have been experimentally characterized in test sockets with and without cooling, and soldered to the PCB. Using uniform and localized hot spot power distribution, the thermal self-heating and thermal coupling resistance and the lateral spreading in the 3D packages have been studied. Furthermore, the measurements have been used to characterize the thermal properties of the epoxy mold compound and the die-die interface and to calibrate a thermal model for the calculation of equivalent properties of underfilled μbump arrays. This model has been applied to study the trade-off between the stand-off height reduction and the underfill thermal conductivity increase in order to reduce the inter die thermal resistance.

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