scholarly journals Applications of the Integrated High-Performance CMOS Image Sensor to Range Finders — from Optical Triangulation to the Automotive Field

Sensors ◽  
2008 ◽  
Vol 8 (3) ◽  
pp. 1719-1739 ◽  
Author(s):  
Jih-Huah Wu ◽  
Cheng-Chung Pen ◽  
Joe-Air Jiang
Keyword(s):  
High Performance ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Optical Triangulation

A Wearable Supporting System for Visually Impaired People in Operating Capacitive Touchscreen

2011 ◽  
Vol 103 ◽  
pp. 687-694
Author(s):  
Akira Yamawaki ◽  
Serikawa Seiichi
Keyword(s):  
Image Processing ◽  
Visually Impaired ◽  
High Performance ◽  
Middle Finger ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Supporting System ◽  
Visually Impaired People ◽  
Impaired People ◽  
Natural Way

We propose a wearable supporting system with a CMOS image sensor for the visually impaired people in operating capacitive touchscreen. This system attaches the CMOS image sensor without a lens to the tip of the middle finger. The icons and buttons displayed on the touchscreen are replaced to the color barcodes. Touching the surface of the touchscreen with the CMOS image sensor directly, the color barcode is detected and decoded. The decoded results are returned to the user by some interaction like audio. Then, the user touches the button area around the color barcode by the forefinger to operate the target device. This system can provide very easy and natural way for operating the touchscreen to the visually impaired people who usually recognize the materials by the finger. Any mechanical modification of the target device is not needed. The modification can be made by changing its software program. Since the color barcode is sensed by the image sensor without any lens touching the surface of the touchscreen, each bar in the color barcode should be blurred. So, we　develop an easy and simple image processing to handle such problem. We design it as the hardware module to achieve the high performance and low-power wearable device. A prototype hardware using an FPGA shows the hardware size, the performance and the actual demonstration.

scholarly journals Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive Application

Sensors ◽  
2020 ◽  
Vol 20 (15) ◽  
pp. 4077
Author(s):  
Tianshen Zhou ◽  
Shuying Ma ◽  
Daquan Yu ◽  
Ming Li ◽  
Tao Hang
Keyword(s):  
High Performance ◽  
Dynamic Range ◽  
High Reliability ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Automotive Application ◽  
Market Demand ◽  
Wafer Level ◽  
Reliability Performance ◽  
Silicon Vias

To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In this paper, a WLCSP with the size of 5.82 mm × 5.22 mm and thickness of 850 μm was developed for the backside illumination (BSI) CIS chip using a 65 nm node with a size of 5.8 mm × 5.2 mm. The packaged product has 1392 × 976 pixels and a resolution of up to 60 frames per second with more than 120 dB dynamic range. The structure of the 3D package was designed and the key fabrication processes on a 12” inch wafer were investigated. More than 98% yield and excellent optical performance of the CIS package was achieved after process optimization. The final packages were qualified by AEC-Q100 Grade 2.

High performance CMOS image sensor for digitally fused day/night vision systems

2010 ◽  
Author(s):  
Boyd Fowler ◽  
Paul Vu ◽  
Chiao Liu ◽  
Steve Mims ◽  
Hung Do ◽  
...  
Keyword(s):  
High Performance ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Night Vision ◽  
Vision Systems

scholarly journals Predicting the effect of radiation damage on dark current in a space-qualified high performance CMOS image sensor

2019 ◽  
Vol 14 (11) ◽  
pp. C11008-C11008
Author(s):  
C. Crews ◽  
M.R. Soman ◽  
D-D. Lofthouse-Smith ◽  
E.A.H. Allanwood ◽  
K.D. Stefanov ◽  
...  
Keyword(s):  
Radiation Damage ◽  
Dark Current ◽  
High Performance ◽  
Cmos Image Sensor ◽  
Image Sensor

Novel source follower transistor structure without lightly doped drain for high performance CMOS image sensor

2016 ◽  
Vol 55 (8S2) ◽  
pp. 08PD02
Author(s):  
Hyeong-Sub Song ◽  
Sung-Kyu Kwon ◽  
So-Ra Jeon ◽  
Dong-Jun Oh ◽  
Ga-Won Lee ◽  
...  
Keyword(s):  
High Performance ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Transistor Structure ◽  
Source Follower ◽  
Lightly Doped Drain

Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device

2017 ◽  
Vol 137 (2) ◽  
pp. 48-58
Author(s):  
Noriyuki Fujimori ◽  
Takatoshi Igarashi ◽  
Takahiro Shimohata ◽  
Takuro Suyama ◽  
Kazuhiro Yoshida ◽  
...  
Keyword(s):  
Medical Device ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Wafer Level ◽  
Packaging Process ◽  
Sensor Module ◽  
Chip Size

An Over 120dB Dynamic Range Linear Response Single Exposure CMOS Image Sensor with Two-stage Lateral Overflow Integration Trench Capacitors

2020 ◽  
Vol 2020 (7) ◽  
pp. 143-1-143-6 ◽  
Author(s):  
Yasuyuki Fujihara ◽  
Maasa Murata ◽  
Shota Nakayama ◽  
Rihito Kuroda ◽  
Shigetoshi Sugawa
Keyword(s):  
Linear Response ◽  
Dynamic Range ◽  
Signal To Noise Ratio ◽  
Cmos Image Sensor ◽  
Image Sensor ◽  
Signal To Noise ◽  
Single Exposure ◽  
Two Stage ◽  
Noise Ratio ◽  
Maximum Signal

This paper presents a prototype linear response single exposure CMOS image sensor with two-stage lateral overflow integration trench capacitors (LOFITreCs) exhibiting over 120dB dynamic range with 11.4Me- full well capacity (FWC) and maximum signal-to-noise ratio (SNR) of 70dB. The measured SNR at all switching points were over 35dB thanks to the proposed two-stage LOFITreCs.

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