High performance CMOS image sensor for digitally fused day/night vision systems

2010 ◽  
Author(s):  
Boyd Fowler ◽  
Paul Vu ◽  
Chiao Liu ◽  
Steve Mims ◽  
Hung Do ◽  
...  
2009 ◽  
Author(s):  
Boyd Fowler ◽  
Chiao Liu ◽  
Steve Mims ◽  
Janusz Balicki ◽  
Wang Li ◽  
...  

2011 ◽  
Vol 58 (2) ◽  
pp. 85-89 ◽  
Author(s):  
Arthur Spivak ◽  
Alexander Belenky ◽  
Alexander Fish ◽  
Orly Yadid-Pecht

2011 ◽  
Vol 103 ◽  
pp. 687-694
Author(s):  
Akira Yamawaki ◽  
Serikawa Seiichi

We propose a wearable supporting system with a CMOS image sensor for the visually impaired people in operating capacitive touchscreen. This system attaches the CMOS image sensor without a lens to the tip of the middle finger. The icons and buttons displayed on the touchscreen are replaced to the color barcodes. Touching the surface of the touchscreen with the CMOS image sensor directly, the color barcode is detected and decoded. The decoded results are returned to the user by some interaction like audio. Then, the user touches the button area around the color barcode by the forefinger to operate the target device. This system can provide very easy and natural way for operating the touchscreen to the visually impaired people who usually recognize the materials by the finger. Any mechanical modification of the target device is not needed. The modification can be made by changing its software program. Since the color barcode is sensed by the image sensor without any lens touching the surface of the touchscreen, each bar in the color barcode should be blurred. So, we develop an easy and simple image processing to handle such problem. We design it as the hardware module to achieve the high performance and low-power wearable device. A prototype hardware using an FPGA shows the hardware size, the performance and the actual demonstration.


Sensors ◽  
2020 ◽  
Vol 20 (15) ◽  
pp. 4077
Author(s):  
Tianshen Zhou ◽  
Shuying Ma ◽  
Daquan Yu ◽  
Ming Li ◽  
Tao Hang

To meet the urgent market demand for small package size and high reliability performance for automotive CMOS image sensor (CIS) application, wafer level chip scale packaging (WLCSP) technology using through silicon vias (TSV) needs to be developed to replace current chip on board (COB) packages. In this paper, a WLCSP with the size of 5.82 mm × 5.22 mm and thickness of 850 μm was developed for the backside illumination (BSI) CIS chip using a 65 nm node with a size of 5.8 mm × 5.2 mm. The packaged product has 1392 × 976 pixels and a resolution of up to 60 frames per second with more than 120 dB dynamic range. The structure of the 3D package was designed and the key fabrication processes on a 12” inch wafer were investigated. More than 98% yield and excellent optical performance of the CIS package was achieved after process optimization. The final packages were qualified by AEC-Q100 Grade 2.


2019 ◽  
Vol 14 (11) ◽  
pp. C11008-C11008
Author(s):  
C. Crews ◽  
M.R. Soman ◽  
D-D. Lofthouse-Smith ◽  
E.A.H. Allanwood ◽  
K.D. Stefanov ◽  
...  

2016 ◽  
Vol 55 (8S2) ◽  
pp. 08PD02
Author(s):  
Hyeong-Sub Song ◽  
Sung-Kyu Kwon ◽  
So-Ra Jeon ◽  
Dong-Jun Oh ◽  
Ga-Won Lee ◽  
...  

2012 ◽  
Author(s):  
Eric De Borniol ◽  
Fabrice Guellec ◽  
Pierre Castelein ◽  
Anne Rouvié ◽  
Jean-Alexandre Robo ◽  
...  

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