scholarly journals Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

Sensors ◽  
2021 ◽  
Vol 21 (7) ◽  
pp. 2316
Author(s):  
Lei Sun ◽  
Wenjun Yi
Keyword(s):  
Tensile Stress ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Circuit Board ◽  
Shrinkage Stress ◽  
Dense Structure ◽  
Printed Circuit ◽  
Expansion Property ◽  
Set Up

In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed. However, the shrinkage tensile stress in the potting adhesive weakened the anti-overload ability of the circuit board. When there was a small amount of expansion stress in the potting adhesive, the overload resistance of the circuit board could be partially increased. From the analysis, it is indicated that a material with a certain expansion property, elasticity, and dense structure should be selected as the potting adhesive. This article provides a reference for improving the overload resistance of electronic devices.

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

scholarly journals Group set-up for printed circuit board assembly

1989 ◽  
Vol 27 (10) ◽  
pp. 1795-1810 ◽  
Author(s):  
TALI F. CARMON ◽  
ODED Z. MAIMON ◽  
EZEY M. DAR-EL
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Printed Circuit Board Assembly ◽  
Printed Circuit ◽  
Circuit Board Assembly ◽  
Set Up

scholarly journals Aileen Gabriela Susiana PEMANFAATAN E-WASTE PRINTED CIRCUIT BOARD MENJADI ARMATUR LAMPU

2020 ◽  
Vol 2 ◽  
pp. 44-49
Author(s):  
Aileen Gabriela Susiana ◽  
Gracia Ika Gunawan
Keyword(s):  
Printed Circuit Board ◽  
Electronic Waste ◽  
Electronic Devices ◽  
Economic Value ◽  
Circuit Board ◽  
Toxic Substances ◽  
The Public ◽  
Printed Circuit ◽  
Business Model Canvas ◽  
Waste Printed Circuit Board

Electronic Waste, abbreviated as E-waste, is a product of no longer used electronic devices. E-waste alsoconsidered as dangerous, as it contains 2,70% of toxic substances. The sheer amount of electronic wasteproduced by citizens of Indonesia alone means that any semblance of effort is needed to process thesewastes into something which has usage and economic value. Printed Circuit Board or shorten as PCB is acomponent structure of an electronic devices, unused electronic devices still has PCB left intact inside ofthem, which make PCB also an electronic waste. This design was done to reuse E-waste, in this case is PCBinto an interior accessory. Other than reducing the amount of electronic waste in our vicinity, this design hasanother goal to increase the ingeniousness of the human resources who are going to realize the design into thefinal product, also to teach and engage the public to develop a more creative way of thinking in solvingenvironmental problems of our vicinity. The final product of this design is a lamp armature made of PCBs. Thesurface of PCB has intricate pattern and a futuristic look to it, which when processed into an interior accessorycould increase the visual esthetic of a room. Lamp armature itself has many variations, and the chosen variantfor this design is table lamp, and the lamp will be able to be placed on a nightstand and act as a sleep lamp.To strengthen the armature structure, black painted iron was used as a place where the PCB will be arrangedand the lamp placed. BMC (Business Model Canvas) was used to analyze the market and to help the marketingof the lamp armature. This lamp armature was designed to prove that even an electronic waste such asPCB able to retain economic and usage value.

Effect of Continuous and Discontinuous Fabrication and Reflow Processes on PWB Warpage

2005 ◽  
Author(s):  
Saket Karajgikar ◽  
Wonkee Ahn ◽  
Dereje Agonafer
Keyword(s):  
Manufacturing Process ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Physical Structure ◽  
Circuit Board ◽  
Multilayer Structures ◽  
Curing Process ◽  
Electronic Components ◽  
Reflow Process ◽  
Printed Circuit

PWB also known as Printed Circuit Board (PCB) provides the physical structure for mounting and holding the electronic components and electrically connecting it. They are foundation of virtually all of the electronic devices. Typically they are multilayer structures consisting of organic/composites (e.g. FR4) and circuit layers, laminated together. Such multi-layered structures exhibit ‘board warpage’ during manufacturing process. It is a result of residual thermo-mechanical stresses along with any asymmetries (if present) during the curing process. This effect further increases when the board undergoes thermal cycling during component mounting and reflow process. Effect of different parameters such as board size, board thickness, and pressure (at the time of developing) on PWB warpage is studied.

scholarly journals Locally Fabricated Electronic Drum Trigger-Module

2016 ◽  
Vol 23 (1) ◽  
Author(s):  
Julius Moises S. Albalos
Keyword(s):  
Circuit Design ◽  
Printed Circuit Board ◽  
Raw Materials ◽  
Electronic Devices ◽  
Musical Instrument ◽  
Circuit Board ◽  
Printed Circuit ◽  
Project Method ◽  
Do It Yourself ◽  
Transfer Method

Different electronic gadgets and devices nowadays exist and develop rapidly with the latest trends and technology. Gadgets have specific functions based on people’s interests or needs in communication, transportation, music, and entertainment. The electronic drum is one of these gadgets that music enthusiasts would surely want to have. The study aimed to fabricate or assemble an electronic drum using raw materials which is locally available. The study used the experimental and project method. It was accomplished by fabricating the edrum module based on the circuit design of Admir Salahovic. The processes include the use of the toner transfer method in making the Printed Circuit Board; programming the microcontroller; the construction of the different triggers with the use of locally available materials and testing the device’s functionality. The study concludes that the locally fabricated electronic drum trigger-module found on the internet as a do-it-yourself project using locally available materials works; it answers the queries of how electronic musical instrument works and what it is made of. The researcher and students are capable to build complicated electronic devices with the theories and skills learned behind it. It is recommended to enhance some of the trigger pads for a professional-like electronic drum kit.

Contamination profile on typical printed circuit board assemblies vs soldering process

2014 ◽  
Vol 26 (4) ◽  
pp. 194-202 ◽  
Author(s):  
Helene Conseil ◽  
Morten Stendahl Jellesen ◽  
Rajan Ambat
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Content Type ◽  
Contamination Control ◽  
Conformal Coating ◽  
Printed Circuit ◽  
Soldering Process ◽  
Wave Soldering ◽  
Solder Flux ◽  
Set Up

Purpose – The purpose of this paper was to analyse typical printed circuit board assemblies (PCBAs) processed by reflow, wave or selective wave soldering for typical levels of process-related residues, resulting from a specific or combination of soldering processes. Typical solder flux residue distribution pattern, composition and concentration are profiled and reported. The effect of such contaminants on conformal coating was tested. Design/methodology/approach – Presence of localized flux residues was visualized using a commercial residue reliability assessment testing gel test and chemical structure was identified by Fourier transform infrared spectroscopy, while the concentration was measured using ion chromatography, and the electrical properties of the extracts were determined by measuring the leak current using a twin platinum electrode set-up. Localized extraction of residue was carried out using a commercial critical contamination control extraction system. Findings – Results clearly show that the amount and distribution of flux residues are a function of the soldering process, and the level can be reduced by an appropriate cleaning. Selective soldering process generates significantly higher levels of residues compared to the wave and reflow process. For conformal coated PCBAs, the contamination levels generated from the tested wave and selective soldering process are found to be enough to generate blisters under exposure to high humidity levels. Originality/value – Although it is generally known that different soldering processes can introduce contamination on the PCBA surface, compromising its cleanliness, no systematic work is reported investigating the relative levels of residue introduced by various soldering processes and its effect on corrosion reliability.

Microstructure of Solder Joint Interconnect in Used Mobile Phone

2006 ◽  
Vol 517 ◽  
pp. 123-128
Author(s):  
Shahrul Nizam Shahdan ◽  
Azman Jalar ◽  
Muhammad Azmi Abd Hamid
Keyword(s):  
Solder Joint ◽  
Mobile Phone ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Void Formation ◽  
Circuit Board ◽  
Electronic Package ◽  
X Ray ◽  
Printed Circuit ◽  
Tin Content

A tin-lead solder is generally used to mount an electronic package on to a printed circuit board (PCB) of an electronic devices. In this study, we investigated the microstructure of the solder joint from a four years old used mobile phone. Microstructure and morphology of the joint was obtained using optical and scanning electron microscopy (OM and SEM) respectively. Cracks and voids can clearly be seen in the solder area for the most of the sample observed. Crack up to 10 μm wide appeared to be propagating along the solder line between Cu lead and Cu substrate. Energy dispersive X-ray (EDX) analysis revealed that cracks occurred at the richer tin content. It was not clear the exact mechanism that leads to the existence of the crack. However we believe that thermomechanical cause such as thermal fatigue, void formation and the thicker layer of intermetallic compound contributed to the failure of the solder joint.

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