scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

scholarly journals Aileen Gabriela Susiana PEMANFAATAN E-WASTE PRINTED CIRCUIT BOARD MENJADI ARMATUR LAMPU

2020 ◽  
Vol 2 ◽  
pp. 44-49
Author(s):  
Aileen Gabriela Susiana ◽  
Gracia Ika Gunawan
Keyword(s):  
Printed Circuit Board ◽  
Electronic Waste ◽  
Electronic Devices ◽  
Economic Value ◽  
Circuit Board ◽  
Toxic Substances ◽  
The Public ◽  
Printed Circuit ◽  
Business Model Canvas ◽  
Waste Printed Circuit Board

Electronic Waste, abbreviated as E-waste, is a product of no longer used electronic devices. E-waste alsoconsidered as dangerous, as it contains 2,70% of toxic substances. The sheer amount of electronic wasteproduced by citizens of Indonesia alone means that any semblance of effort is needed to process thesewastes into something which has usage and economic value. Printed Circuit Board or shorten as PCB is acomponent structure of an electronic devices, unused electronic devices still has PCB left intact inside ofthem, which make PCB also an electronic waste. This design was done to reuse E-waste, in this case is PCBinto an interior accessory. Other than reducing the amount of electronic waste in our vicinity, this design hasanother goal to increase the ingeniousness of the human resources who are going to realize the design into thefinal product, also to teach and engage the public to develop a more creative way of thinking in solvingenvironmental problems of our vicinity. The final product of this design is a lamp armature made of PCBs. Thesurface of PCB has intricate pattern and a futuristic look to it, which when processed into an interior accessorycould increase the visual esthetic of a room. Lamp armature itself has many variations, and the chosen variantfor this design is table lamp, and the lamp will be able to be placed on a nightstand and act as a sleep lamp.To strengthen the armature structure, black painted iron was used as a place where the PCB will be arrangedand the lamp placed. BMC (Business Model Canvas) was used to analyze the market and to help the marketingof the lamp armature. This lamp armature was designed to prove that even an electronic waste such asPCB able to retain economic and usage value.

scholarly journals Analysis of the Influence of Shrinkage Tensile Stress in Potting Material on the Anti-Overload Performance of the Circuit Board

Sensors ◽  
2021 ◽  
Vol 21 (7) ◽  
pp. 2316
Author(s):  
Lei Sun ◽  
Wenjun Yi
Keyword(s):  
Tensile Stress ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Circuit Board ◽  
Shrinkage Stress ◽  
Dense Structure ◽  
Printed Circuit ◽  
Expansion Property ◽  
Set Up

In this article, the influence of shrinkage tensile stress in potting materials on the anti-overload performance of a circuit board was studied. Firstly, the phenomenon of shrinkage tensile stress in common potting materials was analyzed, and it was found that the commonly used potting adhesives displayed large shrinkage characteristics. Secondly, a small experiment was set up to verify that the shrinkage tensile stress of potting adhesives would lead to printed circuit board (PCB) deformation, and the shrinkage stress was contrary to the acceleration direction of overload. Thirdly, the influence of potting adhesives on the overload resistance of the PCB was analyzed. However, the shrinkage tensile stress in the potting adhesive weakened the anti-overload ability of the circuit board. When there was a small amount of expansion stress in the potting adhesive, the overload resistance of the circuit board could be partially increased. From the analysis, it is indicated that a material with a certain expansion property, elasticity, and dense structure should be selected as the potting adhesive. This article provides a reference for improving the overload resistance of electronic devices.

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