scholarly journals Array of Horns Fed by a Transverse Slotted Groove Gap Waveguide at 28 GHz

Sensors ◽  
2020 ◽  
Vol 20 (18) ◽  
pp. 5311
Author(s):  
Malcolm Ng Mou Kehn ◽  
Chih-Kai Hsieh ◽  
Eva Rajo-Iglesias
Keyword(s):  
Linear Array ◽  
Experimental Results ◽  
Manufacturing Costs ◽  
Waveguide Wall ◽  
Low Profile ◽  
Planar Array ◽  
5G Technologies

An array of low profile horns fed by transverse slots on a groove gap waveguide (GGWG) is presented. The GGWG is implemented with glide symmetrical holes and the design frequency is 28 GHz. The low profile horns are integrated in the same waveguide wall as the slots. The designed antenna is a linear array of these horns but the solution can be easily extended to a planar array. Experimental results support this work. The designed antenna is a good candidate for applications related to 5G technologies where medium to high gains as well as high efficiencies are required and reasonable manufacturing costs are demanded.

scholarly journals EXPERIMENTAL RESULTS ON A PLANAR ARRAY OF PARASITIC DIPOLES FED BY ONE ACTIVE ELEMENT

2011 ◽  
Vol 113 ◽  
pp. 369-377 ◽  
Author(s):  
Marcos Alvarez Folgueiras ◽  
Juan Antonio Rodríguez-Gonzalez ◽  
Francisco Jose Ares-Pena
Keyword(s):  
Active Element ◽  
Experimental Results ◽  
Planar Array

scholarly journals A High Gain Omnidirectional Antenna Using Negative Permeability Metamaterial

2013 ◽  
Vol 2013 ◽  
pp. 1-7 ◽  
Author(s):  
Hangfei Tang ◽  
Quanwen Hou ◽  
Yahong Liu ◽  
Xiaopeng Zhao
Keyword(s):  
Wireless Communications ◽  
Dendritic Structure ◽  
High Gain ◽  
Experimental Results ◽  
Negative Permeability ◽  
Zeroth Order ◽  
Omnidirectional Antenna ◽  
Low Profile ◽  
Operating Bandwidth

A high gain omnidirectional antenna with low profile is proposed and is investigated numerically and experimentally. Based on the conventional center-fed circular epsilon-negative (ENG) zeroth-order resonator (ZOR) antenna, dendritic structure negative permeability metamaterial (NPM) is used as the substrate to enhance the gain of the omnidirectional antenna. The experimental results show that the gain of a center-fed circular ENG ZOR antenna with NPM substrate is enhanced about 2.2 dB, and the efficiency is enhanced about 38%, in the whole broad operating bandwidth as compared to that of the antenna without NPM substrate, which can be used to improve the reliability of wireless communications.

scholarly journals Simulation and Testing of a Linear Array of Modified Four-Square Feed Antennas for the Tianlai Cylindrical Radio Telescope

2017 ◽  
Vol 06 (03) ◽  
pp. 1750003 ◽  
Author(s):  
Aleksander J. Cianciara ◽  
Christopher J. Anderson ◽  
Xuelei Chen ◽  
Zhiping Chen ◽  
Jingchao Geng ◽  
...  
Keyword(s):  
Radio Telescope ◽  
Linear Array ◽  
Experimental Results ◽  
Scattering Parameters ◽  
Antenna Beam ◽  
Intensity Mapping ◽  
Multiple Frequencies ◽  
Four Square ◽  
Combined Feed ◽  
Beam Patterns

A wide bandwidth, dual polarized, modified four-square antenna is presented as a feed antenna for radio astronomical measurements. A linear array of these antennas is used as a line-feed for cylindrical reflectors for Tianlai, a radio interferometer designed for 21[Formula: see text]cm intensity mapping. Simulations of the feed antenna beam patterns and scattering parameters are compared to experimental results at multiple frequencies across the 650–1420[Formula: see text]MHz range. Simulations of the beam patterns of the combined feed array/reflector are presented as well.

scholarly journals AIRBORNE LINEAR ARRAY IMAGE GEOMETRIC RECTIFICATION METHOD BASED ON UNEQUAL SEGMENTATION

2016 ◽  
Vol XLI-B1 ◽  
pp. 355-359
Author(s):  
J. M. Li ◽  
C. R. Li ◽  
M Zhou ◽  
J. Hu ◽  
C. M. Yang
Keyword(s):  
Linear Array ◽  
Exterior Orientation ◽  
Line Feature ◽  
Straight Line ◽  
Geometric Rectification ◽  
Planar Array ◽  
Disaster Monitoring ◽  
Feature Based ◽  
Limited Precision ◽  
Straight Lines

As the linear array sensor such as multispectral and hyperspectral sensor has great potential in disaster monitoring and geological survey, the quality of the image geometric rectification should be guaranteed. Different from the geometric rectification of airborne planar array images or multi linear array images, exterior orientation elements need to be determined for each scan line of single linear array images. Internal distortion persists after applying GPS/IMU data directly to geometrical rectification. Straight lines may be curving and jagged. Straight line feature -based geometrical rectification algorithm was applied to solve this problem, whereby the exterior orientation elements were fitted by piecewise polynomial and evaluated with the straight line feature as constraint. However, atmospheric turbulence during the flight is unstable, equal piecewise can hardly provide good fitting, resulting in limited precision improvement of geometric rectification or, in a worse case, the iteration cannot converge. To solve this problem, drawing on dynamic programming ideas, unequal segmentation of line feature-based geometric rectification method is developed. The angle elements fitting error is minimized to determine the optimum boundary. Then the exterior orientation elements of each segment are fitted and evaluated with the straight line feature as constraint. The result indicates that the algorithm is effective in improving the precision of geometric rectification.

scholarly journals AIRBORNE LINEAR ARRAY IMAGE GEOMETRIC RECTIFICATION METHOD BASED ON UNEQUAL SEGMENTATION

2016 ◽  
Vol XLI-B1 ◽  
pp. 355-359
Author(s):  
J. M. Li ◽  
C. R. Li ◽  
M Zhou ◽  
J. Hu ◽  
C. M. Yang
Keyword(s):  
Linear Array ◽  
Exterior Orientation ◽  
Line Feature ◽  
Straight Line ◽  
Geometric Rectification ◽  
Planar Array ◽  
Disaster Monitoring ◽  
Feature Based ◽  
Limited Precision ◽  
Straight Lines

As the linear array sensor such as multispectral and hyperspectral sensor has great potential in disaster monitoring and geological survey, the quality of the image geometric rectification should be guaranteed. Different from the geometric rectification of airborne planar array images or multi linear array images, exterior orientation elements need to be determined for each scan line of single linear array images. Internal distortion persists after applying GPS/IMU data directly to geometrical rectification. Straight lines may be curving and jagged. Straight line feature -based geometrical rectification algorithm was applied to solve this problem, whereby the exterior orientation elements were fitted by piecewise polynomial and evaluated with the straight line feature as constraint. However, atmospheric turbulence during the flight is unstable, equal piecewise can hardly provide good fitting, resulting in limited precision improvement of geometric rectification or, in a worse case, the iteration cannot converge. To solve this problem, drawing on dynamic programming ideas, unequal segmentation of line feature-based geometric rectification method is developed. The angle elements fitting error is minimized to determine the optimum boundary. Then the exterior orientation elements of each segment are fitted and evaluated with the straight line feature as constraint. The result indicates that the algorithm is effective in improving the precision of geometric rectification.

Experimental results for a prototype 3‐D acoustic imaging system using an ultra‐sparse planar array

2002 ◽  
Vol 112 (5) ◽  
pp. 2421-2421
Author(s):  
John M. Impagliazzo ◽  
Alice M. Chiang ◽  
Steven R. Broadstone
Keyword(s):  
Imaging System ◽  
Acoustic Imaging ◽  
Experimental Results ◽  
Planar Array

scholarly journals Design of a Planar Array of Low Profile Horns at 28 GHz

Sensors ◽  
2020 ◽  
Vol 20 (23) ◽  
pp. 6989
Author(s):  
Jou-Yi Wang ◽  
Malcolm Ng Mou Kehn ◽  
Eva Rajo-Iglesias
Keyword(s):  
Millimeter Wave ◽  
Dielectric Materials ◽  
Waveguide Array ◽  
Wave Regime ◽  
Metal Solution ◽  
Radar Systems ◽  
Low Profile ◽  
Planar Array ◽  
Slotted Waveguide ◽  
Very High

A planar array of low profile horns fed by a transverse slotted waveguide array in the low millimeter-wave regime (28 GHz) is presented. The array of transverse slots cannot be directly used as antenna as it has grating lobes due to the fact that slot elements must be spaced a guided wavelength. However, these slots can be transformed into low profile horns that with their radiation patterns attenuate the grating lobes. To this aim, low profile horns with less than 0.6λ0 height were designed. The horns include a couple of chips that contribute to further reduce the grating lobes especially in the H-plane. The good performance of the designed array was demonstrated by both simulations and experiments performed on a manufactured prototype. A 5 × 5 array was designed that has a measured realized gain of 26.6 dBi with a bandwidth below 2%, still useful for some applications such as some radar systems. The total electrical size of the array is 6.63λ0× 6.63λ0. The radiation efficiency is very high and the aperture efficiency is above 80%. This all-metal solution is advantageous for millimeter-wave applications where losses sustained by dielectric materials become severe and it can be easily scaled to higher frequencies.

Simulations of Process-Induced Warpage During IC Encapsulation Process

2006 ◽  
Vol 129 (3) ◽  
pp. 307-315 ◽  
Author(s):  
Shiang-Yu Teng ◽  
Sheng-Jye Hwang
Keyword(s):  
Thermal Expansion ◽  
Integrated Circuit ◽  
Opposite Sign ◽  
Simulation Models ◽  
Experimental Results ◽  
New Approach ◽  
Low Profile ◽  
Quad Flat Package ◽  
Encapsulation Process

Warpage during integrated circuit encapsulation process is a serious problem. Previous researchers had focused on warpage analysis with thermal-induced shrinkage and the cure-induced shrinkage was neglected. A new approach considering both cure- and thermal-induced shrinkage during encapsulation process was presented to predict the amount of warpage. The cure-induced shrinkage was described by the pressure-volume-temperature-cure (P-V-T-C) equation of epoxy. The thermal-induced shrinkage was described by the coefficients of thermal expansion of the component materials. The thin small outline package (TSOP) DBS-27P and low-profile quad flat package (LQFP) LQFP-64, which were manufactured by Philips Semiconductor located in Taiwan and Siliconware Precision Industries Corporation, respectively, were chosen to be the simulation models. By comparing the amount of predicted warpage with the experimental results, it showed that the approach could better predict the amount of warpage than that considering only thermal-induced shrinkage. It was also found that the sign of cure-induced warpage could be opposite to the thermal-induced warpage. Appropriate design of a package to make cure- and thermal-induced shrinkage to be of opposite sign could minimize the warpage of a package.

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