scholarly journals Integrated Rogowski Coil Sensor for Press-Pack Insulated Gate Bipolar Transistor Chips

Sensors ◽  
2020 ◽  
Vol 20 (15) ◽  
pp. 4080
Author(s):  
Chaoqun Jiao ◽  
Zuoming Zhang ◽  
Zhibin Zhao ◽  
Xiumin Zhang
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Simulation Analysis ◽  
Rogowski Coil ◽  
Bipolar Transistor ◽  
Circuit Board ◽  
Equivalent Model ◽  
Printed Circuit ◽  
Insulated Gate Bipolar Transistor ◽  
The Press

Recently, the press-pack insulated gate bipolar transistor (IGBT) has usually been used in direct current (DC) transmission. The press-pack IGBT (PPI) adopts a parallel layout of boss chips, and the currents of each chip will be uneven in the process of turning on and off, which will affect the reliability of the device. To measure the currents of each chip, based on the analysis of the principle and equivalent model of the Rogowski coil, this paper puts forward the design scheme and design index of multi-layer printed circuit board (PCB) Rogowski coil with good high-frequency performance, strong anti-interference ability and sufficient sensitivity. With the simulation analysis of Altium Designer and ANSYS softwares, a 1 mm thick, 76-turn integrated four-layer PCB Rogowski coil is designed. Then, adding a composite integrator, an integrated Rogowski coil sensor for measurement of PPI chips currents is designed. The Pspice simulation and the experiment results show that the sensor is fully satisfied with the chip current measurement.

scholarly journals Research on Small Square PCB Rogowski Coil Measuring Transient Current in the Power Electronics Devices

Sensors ◽  
2019 ◽  
Vol 19 (19) ◽  
pp. 4176 ◽  
Author(s):  
Chaoqun Jiao ◽  
Juan Zhang ◽  
Zhibin Zhao ◽  
Zuoming Zhang ◽  
Yuanliang Fan
Keyword(s):  
Power Electronics ◽  
Printed Circuit Board ◽  
Electronic Devices ◽  
Rogowski Coil ◽  
Bipolar Transistors ◽  
Circuit Board ◽  
Power Electronic ◽  
Insulated Gate Bipolar Transistors ◽  
Printed Circuit ◽  
Internal Structures

With the development of China’s electric power, power electronics devices such as insulated-gate bipolar transistors (IGBTs) have been widely used in the field of high voltages and large currents. However, the currents in these power electronic devices are transient. For example, the uneven currents and internal chip currents overshoot, which may occur when turning on and off, and could have a great impact on the device. In order to study the reliability of these power electronics devices, this paper proposes a miniature printed circuit board (PCB) Rogowski coil that measures the current of these power electronics devices without changing their internal structures, which provides a reference for the subsequent reliability of their designs.

A Design of Printed Inverted-F Antenna for RFID Tag at 5.8 GHz

2013 ◽  
Vol 427-429 ◽  
pp. 1293-1296
Author(s):  
Yan Zhong Yu ◽  
Ji Zhen Ni ◽  
Xian Hui Li
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Ground Plane ◽  
Simulation Software ◽  
Circuit Board ◽  
Electromagnetic Simulation ◽  
Antenna Structure ◽  
Rfid Tag ◽  
Printed Circuit ◽  
Substrate Layer

A printed inverted-F antenna for RFID tag at 5.8 GHz is designed in this paper. The antenna structure consists of an inverted-F patch, a substrate layer, and a ground plane. To reduce costs, the FR4 is selected as the material of substrate layer, which is used commonly in PCB (Printed Circuit Board). Its relative permittivity is 4.4 and a loss tangent is 0.02. The inverted-F patch and ground plane are laid on/under the substrate layer respectively. The designed antenna is modeled, simulated and optimized by using HFSS (high frequency electromagnetic simulation software). Simulation results demonstrate that the printed inverted-F antenna can satisfy the requirements of RFID Tag applications.

A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

Equivalent model of circular-type spiral inductor in printed circuit board

2012 ◽  
Vol 55 (2) ◽  
pp. 337-340 ◽  
Author(s):  
Tong-Ho Chung ◽  
Hee-Do Kang ◽  
Tae-Lim Song ◽  
Jong-Gwan Yook
Keyword(s):  
Printed Circuit Board ◽  
Circuit Board ◽  
Equivalent Model ◽  
Spiral Inductor ◽  
Printed Circuit

scholarly journals A Double Inverted F-Shape Patch Antenna for Dual-Band Operation

2014 ◽  
Vol 2014 ◽  
pp. 1-8 ◽  
Author(s):  
M. M. Islam ◽  
M. R. I. Faruque ◽  
W. Hueyshin ◽  
J. S. Mandeep ◽  
T. Islam
Keyword(s):  
Finite Element Method ◽  
Patch Antenna ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Dual Band ◽  
The Finite Element Method ◽  
Microstrip Transmission Line ◽  
Printed Circuit ◽  
Measured Impedance

A double inverted F-shape patch antenna is presented for dual-band operation. The proposed antenna is comprised of circular and rectangular slots on a printed circuit board of 40 mm × 40 mm × 1.6 mm with a 50 Ω microstrip transmission line. Commercially available high frequency structural simulator (HFSS) based on the finite element method (FEM) has been adopted in this investigation. It has a measured impedance bandwidths (2 : 1 VSWR) of 18.53% on the lower band and 7.8% on the upper band, respectively. It has achieved stable radiation efficiencies of 79.76% and 80.36% with average gains of 7.82 dBi and 5.66 dBi in the operating frequency bands. Moreover, numerical simulations have been indicated as an important uniformity with measured results.

Sign in / Sign up

Export Citation Format

Share Document