A Novel Low Cost Package for Radio Frequency Applications

2013 ◽  
Vol 135 (2) ◽  
Author(s):  
Sandeep Chaturvedi ◽  
Shiban K. Koul
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Cost Effective ◽  
Circuit Board ◽  
Test Results ◽  
Printed Circuit ◽  
Pcb Manufacturing ◽  
Manufacturing Techniques ◽  
Commercial Applications

Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.

scholarly journals A Low-Cost and Efficient Microstrip-Fed Air-Substrate-Integrated Waveguide Slot Array

Electronics ◽  
2021 ◽  
Vol 10 (3) ◽  
pp. 338
Author(s):  
Linfeng Li ◽  
Jie-Bang Yan
Keyword(s):  
Printed Circuit Board ◽  
High Efficiency ◽  
Low Cost ◽  
Design Procedure ◽  
Substrate Material ◽  
Circuit Board ◽  
Substrate Integrated Waveguide ◽  
Printed Circuit ◽  
Waveguide Transition ◽  
Pcb Manufacturing

A microstrip-fed air-substrate-integrated waveguide (ASIW) slot array with high efficiency and low cost is presented. The design cuts out the substrate material within SIW, replaces the vias with metallic sidewalls, and uses a simple microstrip line-waveguide transition to feed the slot array. Radiating slots are cut on a 5-mil brass-plate, which covers the top of the substrate cutout to resemble a hollow waveguide structure. This implementation provides a simple and efficient antenna array solution for millimeter-wave (mm-wave) applications. Meanwhile, the fabrication is compatible with the standard printed circuit board (PCB) manufacturing process. To demonstrate the concept, a 4-element ASIW slot array working at the n257 band for 5G communications was designed using low-cost Rogers 4350B and FR4 substrate materials. Our simulation result shows 18% more efficiency than a conventional SIW slot array using the same substrate. The fabricated prototype shows |S11| < −15 dB over 27–29 GHz and a peak realized gain of 10.1 dBi at 28.6 GHz. The design procedure, prototyping process, and design analysis are discussed in the paper.

scholarly journals Microstrip Impedance Management through Multilayer PCB Stack-Up: Discontinuity Compensation Voids with Asymmetric Dielectrics

Symmetry ◽  
2021 ◽  
Vol 13 (10) ◽  
pp. 1771
Author(s):  
Aleksandr Vasjanov ◽  
Vaidotas Barzdenas
Keyword(s):  
High Frequency ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Dielectric Materials ◽  
Time Domain Reflectometry ◽  
Circuit Board ◽  
Reference Plane ◽  
Printed Circuit ◽  
S Parameter ◽  
Practical Design

To process high-frequency signals on a printed circuit board (PCB), it is often necessary to carefully analyze and select the pad widths of the chip packages and components to match their impedance to the standard Z0. Modern PCBs are complex multilayer designs, utilizing either only high-end laminates, low-end laminates, or a combination of both. The on-board component footprints usually have larger pads that become discontinuities and corrupt the impedance of critical traces. One way to address this issue is to include reference plane cutouts as a measure of compensation. This paper aims to find out how an asymmetric dielectric stack-up affects the microstrip discontinuity impedance compensation using reference plane cutouts. The selected board layer stack-up imitates several different practical design scenarios, including costly PCBs that strictly comprise high-end dielectric materials, as well as trying to lower PCB cost by introducing low-cost materials without major performance sacrifice. S-parameter measurements are performed and confirmed by time domain reflectometry (TDR) measurements.

scholarly journals Highly Compact Through-Wire Microstrip to Empty Substrate Integrated Coaxial Line Transition

2021 ◽  
Vol 11 (15) ◽  
pp. 6885
Author(s):  
Marcos D. Fernandez ◽  
José A. Ballesteros ◽  
Angel Belenguer
Keyword(s):  
Printed Circuit Board ◽  
Low Cost ◽  
Coaxial Line ◽  
Circuit Board ◽  
Central Layer ◽  
Printed Circuit ◽  
Integrated Technology ◽  
Low Profile ◽  
The Many ◽  
High Degree

Empty substrate integrated coaxial line (ESICL) technology preserves the many advantages of the substrate integrated technology waveguides, such as low cost, low profile, or integration in a printed circuit board (PCB); in addition, ESICL is non-dispersive and has low radiation. To date, only two transitions have been proposed in the literature that connect the ESICL to classical planar lines such as grounded coplanar and microstrip. In both transitions, the feeding planar lines and the ESICL are built in the same substrate layer and they are based on transformed structures in the planar line, which must be in the central layer of the ESICL. These transitions also combine a lot of metallized and non-metallized parts, which increases the complexity of the manufacturing process. In this work, a new through-wire microstrip-to-ESICL transition is proposed. The feeding lines and the ESICL are implemented in different layers, so that the height of the ESICL can be independently chosen. In addition, it is a highly compact transition that does not require a transformer and can be freely rotated in its plane. This simplicity provides a high degree of versatility in the design phase, where there are only four variables that control the performance of the transition.

Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang
Keyword(s):  
Cross Sections ◽  
Flip Chip ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Circuit Board ◽  
Test Results ◽  
Pcb Assembly ◽  
Creep Analysis ◽  
Chip Scale Package ◽  
Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

In-Plane Electromagnetic Generator Fabricated on Printed Circuit Board Technology

2013 ◽  
Vol 479-480 ◽  
pp. 524-529
Author(s):  
C.T. Pan ◽  
F.T. Hsu ◽  
C.C. Nien ◽  
Z.H. Liu ◽  
Y.J. Chen ◽  
...  
Keyword(s):  
Printed Circuit Board ◽  
Energy Harvester ◽  
Cost Effective ◽  
Circuit Board ◽  
Outer Diameter ◽  
Magnetic Element ◽  
Induced Voltage ◽  
Element Analysis ◽  
Printed Circuit ◽  
Electromagnetic Generator

Small and efficient energy harvesters, as a renewable power supply, draw lots of attention in the last few years. This paper presents a planar rotary electromagnetic generator with copper coils fabricated by using printed circuit board (PCB) as inductance and Nd-Fe-B magnets as magnetic element. Coils are fabricated on PCB, which is presumably cost-effective and promising methods. 28-pole Nd-Fe-B magnets with outer diameter of 50 mm and thickness of 2 mm was sintered and magnetized, which can provide magnetic field of 1.44 Tesla. This harvester consists of planar multilayer with multi-pole coils and multi-pole permanent magnet, and the volume of this harvester is about 50x50x2.5 mm3. Finite element analysis is used to design energy harvesting system, and simulation model of the energy harvester is established. In order to verify the simulation, experiment data are compared with simulation result. The PCB energy harvester prototype can generate induced voltage 0.61 V and 13.29mW output power at rotary speed of 4,000 rpm.

A PCB Sensor for Magnetic Materials

2019 ◽  
Vol 2019 (DPC) ◽  
pp. 001323-001342
Author(s):  
Robert N. Dean ◽  
Lauren E. Beckingham
Keyword(s):  
Magnetic Materials ◽  
Printed Circuit Board ◽  
Low Cost ◽  
Complex Impedance ◽  
Corrosion Products ◽  
Physical Contact ◽  
Circuit Board ◽  
Sensor Technology ◽  
Printed Circuit ◽  
Surrounding Environment

Printed circuit board (PCB) sensors are a sensor technology where the layout of traces on a PCB has been optimized so that the traces electromagnetically interact with the surrounding environment. These types of sensors can be manufactured at very low cost using standard commercially available low-cost printed circuit board fabrication. Exposed conductive electrodes on the circuit board are useful for measuring the electrical conductivity of the surrounding environment, and these sensors have been used in applications such as salinity measurement and dissolved ion content measurement of aqueous solutions. Insulated interdigitated electrode sensors are useful for capacitively analyzing the surrounding environment, and these sensors have been used to detect the presence of liquid water and to measure the moisture content of substances in physical contact with the sensor. Additionally, by measuring the complex impedance of the capacitive sensor over a wide frequency range, information concerning the chemical composition of the substance in contact with the sensor can be determined. In addition to conducive and capacitive PCB sensors, the third type of PCB sensor would be an inductive sensor. Although it is challenging to realize 3D coils in PCB technology, planar inductors can be realized in a single Cu layer on a PCB, and insulated from the environment using a cover layer of polymeric solder mask. This type of electrode structure can inductively couple with magnetic materials in close proximity to the sensor. A variety of magnetic materials exist, including iron, nickel and cobalt. Additionally, many alloys of these elements are also magnetic. Of particular interest are corrosion products with magnetic properties, such as iron(III) oxide, Fe3O2, also known as common rust. A thin layer of iron(III) oxide powder deposited on the sensor's active area results in a measureable increase in the sensor's inductance. As such, an inductive PCB sensor could be a low-cost option for detecting the presence of some corrosion products in its operating environment.

Integration of a K-Band Receiver Front-End Using a Copper Core Printed Circuit Board

2018 ◽  
Vol 2018 (1) ◽  
pp. 000384-000388
Author(s):  
Brian Curran ◽  
Jacob Reyes ◽  
Christian Tschoban ◽  
Ivan Ndip ◽  
Klaus-Dieter Lang ◽  
...  
Keyword(s):  
Integrated Circuits ◽  
Antenna Arrays ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Cost Effective ◽  
Circuit Board ◽  
Front End ◽  
High Bandwidth ◽  
Increasing Demand ◽  
K Band

Abstract Increasing demand for high bandwidth wireless satellite connections and telecommunications has resulted in interest in steerable antenna arrays in the GHz frequency range. These applications require cost-effective integration technologies for high frequency and high power integrated circuits (ICs) using GaAs, for example. In this paper, an integration platform is proposed, that enables GaAs ICs to be directly placed on a copper core inside cavities of a high frequency laminate for optimal cooling purposes. The platform is used to integrate a K-Band receiver front-end, composed of four GaAs ICs, with linear IF output power for input powers above −40dBm and a temperature of 42°C during operation.

Sign in / Sign up

Export Citation Format

Share Document