scholarly journals Design of a Tri-Axial Surface Micromachined MEMS Vibrating Gyroscope

Sensors ◽  
2020 ◽  
Vol 20 (10) ◽  
pp. 2822
Author(s):  
Rocco Crescenzi ◽  
Giuseppe Vincenzo Castellito ◽  
Simone Quaranta ◽  
Marco Balucani
Keyword(s):  
Integrated Circuit ◽  
Large Scale ◽  
Manufacturing Industry ◽  
Low Cost ◽  
High Volume ◽  
Electronic System ◽  
Sensors And Actuators ◽  
Micro Electro Mechanical Systems ◽  
Final Assembly ◽  
Comb Drives

Gyroscopes are one of the next killer applications for the MEMS (Micro-Electro-Mechanical-Systems) sensors industry. Many mature applications have already been developed and produced in limited volumes for the automotive, consumer, industrial, medical, and military markets. Plenty of high-volume applications, over 100 million per year, have been calling for low-cost gyroscopes. Bulk silicon is a promising candidate for low-cost gyroscopes due to its large scale availability and maturity of its manufacturing industry. Nevertheless, it is not suitable for a real monolithic IC integration and requires a dedicated packaging. New designs are supposed to eliminate the need for magnets and metal case package, and allow for a real monolithic MEMS-IC (Integrated Circuit) electronic system. In addition, a drastic cost reduction could be achieved by utilizing off-the-shelf plastic packaging with lead frames for the final assembly. The present paper puts forward the design of a novel tri-axial gyroscope based on rotating comb-drives acting as both capacitive sensors and actuators. The comb-drives are comprised of a single monolithic moving component (rotor) and fixed parts (stators). The former is made out of different concentrated masses connected by curved silicon beams in order to decouple the motion signals. The sensor was devised to be fabricated through the PolyMUMPs® process and it is intended for working in air in order to semplify the MEMS-IC monolithic integration.

MEMS as In-Vivo Sensors and Actuators: Challenges and Opportunities

2000 ◽  
Author(s):  
Roop L. Mahajan
Keyword(s):  
Microelectromechanical Systems ◽  
Low Cost ◽  
High Volume ◽  
Medical Community ◽  
Medical Systems ◽  
Sensors And Actuators ◽  
Micro Fabrication ◽  
Challenges And Opportunities ◽  
Exceptional Stability

Abstract MicroElectroMechanical Systems (MEMS) is a developing field which promises to open up new fields of applications in such diverse areas as medical systems, wireless communications and space explorations. They are particularly attractive to the medical community for their consistent reproducibility, high levels of accuracy and reliability, and exceptional stability. This is achieved through silicon micro-fabrication techniques conducive to high volume manufacturing at a low cost.

Reliability Analysis

2020 ◽  
pp. 1-44
Author(s):  
Cherry Bhargava
Keyword(s):  
High Speed ◽  
Manufacturing Industry ◽  
Low Cost ◽  
Operating Performance ◽  
Operating Time ◽  
Electronic System ◽  
Health Condition ◽  
Operating Characteristics ◽  
Integrated Technique ◽  
Insight Into

As the integration of components are increasing from VLSI to ULSI level. This may lead to damage of electronic system because each component has its own operating characteristics and conditions. So, health prognostic techniques are used that comprise a deep insight into failure cause and effects of all the components individually as well as an integrated technique. It will raise alarm, in case health condition, of the components drift from the desired outcomes. From toy to satellite and sand to silicon, the major key constraint of designing and manufacturing industry are towards enhanced operating performance at less operating time. As the technology advances towards high-speed and low-cost gadgets, reliability becomes a challenging issue.

scholarly journals LEAN PRODUCTION IMPLEMENTATION: A SURVEY IN ITALY

2008 ◽  
pp. 52-60
Author(s):  
Alberto Portioli Staudacher ◽  
Marco Tantardini
Keyword(s):  
Manufacturing Industry ◽  
Lean Production ◽  
Low Cost ◽  
High Volume ◽  
Waste Reduction ◽  
Lean Implementation ◽  
Space Limitation ◽  
Managerial Innovation ◽  
Do So ◽  
Production Approach

European companies can beat competition from low cost countries only through innovation, and large investments are devoted to RD to improve products and processes. But this is not enough. Organisational and managerial innovation lever must be exploited too. Typically, some 40-70% of total activities companies carry out are waste because don't add value to the customer.Lean production focuses on waste reduction to improve operations' performances.Despite many firms report large benefits from lean implementation, a lot of scepticism still remains regarding attainable results and on the possibility to apply Lean approach outside high volume manufacturing. This is particularly true in Italy, where SMEs competing on high variety and customization are a dominant portion of the manufacturing industry .Therefore a survey has been implemented to better understand Lean Production approach and implementation, because it appears to be quite an effective organisational and managerial innovation, as many Lean implementer can testify. But, Lean Production is a trick easy approach, because it appears easy to understand and implement, but it is not. And the number of companies that have achieved no significant improvement is quite large. Therefore a survey has been designed and carried out, in order to deepen the knowledge and help companies that started a Lean implementation, or are considering to do so, in achieving best results. 60 Lean implementers and 45 Non Lean Implementers have been surveyed, out of companies of any manufacturing industr y, with at least 100 employees.Due to space limitation, only a small portion of the results can be presented in this paper. Future papers will present other results and comparisons with the results of other surveys. Besides, the same survey is about to be conducted in other European countries, allowing a much larger respondent sample and a comparison among different countries.

scholarly journals Unbalanced-Tests to the Improvement of Yield and Quality

Electronics ◽  
2021 ◽  
Vol 10 (23) ◽  
pp. 3032
Author(s):  
Chung-Huang Yeh ◽  
Jwu-E Chen
Keyword(s):  
Integrated Circuit ◽  
Large Scale ◽  
Manufacturing Industry ◽  
Product Distribution ◽  
Test Method ◽  
Distribution Model ◽  
Threshold Test ◽  
Yield And Quality ◽  
Large Scale Integration ◽  
Scale Integration

An integrated-circuit testing model (DITM) is used to describe various factors that affect test yield during a test process. We used a probability distribution model to evaluate test yield and quality and introduced a threshold test and a guardband test. As a result of the development speed of the semiconductor manufacturing industry in the future being unpredictable, we use electrical properties of existing products and the current manufacturing technology to estimate future product-distribution trends. In the development of very-large-scale integration (VLSI) testing, the progress of testing technology is very slow. To improve product testing yield and quality, we change the test method and propose an unbalanced-test method, leading to improvements in test results. The calculation using our proposed model and data estimated by the product published by the IEEE International Roadmap for Devices and Systems (IRDS, 2017) proves that the proposed unbalanced-test method can greatly improve test yield and quality and achieve the goal of high-quality, near-zero-defect products.

Gallium arsenide electronics in the marketplace

1992 ◽  
Vol 70 (10-11) ◽  
pp. 943-945
Author(s):  
Paul R. Jay.
Keyword(s):  
Gallium Arsenide ◽  
Integrated Circuits ◽  
Integrated Circuit ◽  
High Speed ◽  
Large Scale ◽  
Low Cost ◽  
Logic Gates ◽  
Process Technology ◽  
Maximum Benefit ◽  
Technological Developments

The last few years have seen a significant emergence of real product applications using gallium arsenide metal semi-conductor field effect transistor technology. These applications range from large volume consumer markets based on small low-cost GaAs integrated circuits to high-end supercomputer products using very large scale integrated GaAs chips containing up to 50 000 logic gates. This situation represents substantial advances in many areas: materials technology, device and integrated circuit process technology, packaging and high speed testing, as well as appropriate system design to obtain maximum benefit from the GaAs technology. This paper reviews some recent commercial successes, and considers commonalities existing between them in the context of recent technological developments.

scholarly journals A Low-Cost Electronic System for Human-Body Communication

Electronics ◽  
2020 ◽  
Vol 9 (11) ◽  
pp. 1928
Author(s):  
Adriano Vale-Cardoso ◽  
Mariana Moreira ◽  
Kristtopher Kayo Coelho ◽  
Alex Vieira ◽  
Aldri Santos ◽  
...  
Keyword(s):  
Human Body ◽  
Low Cost ◽  
Electronic System ◽  
Sensors And Actuators ◽  
Body Tissues ◽  
Communication Circuits ◽  
Adhesive Surface ◽  
Vector Network Analyzers ◽  
Network Analyzers ◽  
Human Body Communication

Human-body communication (HBC) has increasingly gained attention from academia and industry. Most current works focus on characterizing the use of human-body tissues as a physical medium to enable reliable communication. However, designing coupling hardware and communication circuits for reliable data transmission (e.g., high throughput and low latency) is a demanding task, especially for achieving a compact full electronic implementation. For this purpose, there are few commercial devices, mainly differential probes and balun transformers, employed with electrical analysis instruments such as oscilloscopes and vector network analyzers. Although these devices are widely used, they are expensive and are difficult to miniaturize and integrate into real-world HBC-specific applications (e.g., data security). This article presents a low-cost electronic system that transfers collected data using a secondary channel: the ionic environment (the primary channel would be the wireless environment). We design an electronic system as an experimental setup for studying HBC, allowing the communication between instruments, sensors, and actuators by human-body tissues. The experimental evaluation of the proposed system follows (i) a phantom composed of saline (0.9%) and (ii) a real human forearm through adhesive surface electrodes.

A Low Cost Image De-noising Implementation Using Low Area CSLA for Impulse Noise Removal

2017 ◽  
Vol 27 (04) ◽  
pp. 1850060
Author(s):  
B. Bommy ◽  
A. Albert Raj
Keyword(s):  
Integrated Circuit ◽  
Medical Image ◽  
Large Scale ◽  
Impulse Noise ◽  
Low Cost ◽  
Noise Removal ◽  
Low Area ◽  
Edge Features ◽  
Reduction Of Area ◽  
Salt And Pepper

In the process of image acquisition and transmission, data can be corrupted by impulse noise. This paper presented the removal of impulse noise in medical image by using Very Large Scale Integrated circuit (VLSI) implementation. The Low Cost Reduced Simple Edge Preserved De-noising (LCRSEPD) technique is introduced using Low Area Carry Select Adder (CSLA) to remove the salt and pepper noise instead of normal adder. Thus, LCRSEPD technique preserves visual performance and edge features in terms of quality and quantitative evaluation. By optimizing the architecture, low cost RSEPD can achieve low computational complexity that will reflect in area, power and delay. Compared to the previous VLSI implementations, the LCRSEPD implementation with CSLA adder has achieved good medical image quality and less hardware cost due to the reduction of area, power and delay.

scholarly journals Producing Hollow Polymer Microneedles Using Laser Ablated Molds in an Injection Molding Process

2021 ◽  
Author(s):  
Tim Evens ◽  
Lorenz Van Hileghem ◽  
Francesco Dal Dosso ◽  
Jeroen Lammertyn ◽  
Olivier Malek ◽  
...  
Keyword(s):  
Injection Molding ◽  
Large Scale ◽  
Low Cost ◽  
Mold Insert ◽  
High Volume ◽  
Mold Temperature ◽  
Injection Molding Process ◽  
Molding Process ◽  
Melt Temperature ◽  
Hollow Microneedles

Abstract Microneedle arrays contain needle-like microscopic structures which facilitate drug or vaccine delivery in a minimally invasive way. However, producing hollow microneedles is currently limited by expensive, time consuming and complex microfabrication techniques. In this paper, a novel method to produce hollow polymer microneedles is presented. This method utilizes a femtosecond laser to create hollow microneedle cavities in a mold insert. This mold insert is used in an injection molding process, to replicate polymethyl methacrylate microneedles. The combined effect of the mold temperature, volumetric injection rate and melt temperature on the replication fidelity was evaluated. It was found that the combination of high injection molding parameters facilitated the replication. Furthermore, the functionality of the manufactured hollow microneedles was successfully tested by injecting a controlled flow of colored water into an agarose matrix. The developed methodology enables the production of low-cost, high-volume microneedle devices, which could be a key asset for large scale vaccination campaigns.

Enhancement of Overall Output in a Small Scale Industry through VSM, Line Balancing and Work Standardization

2016 ◽  
Vol 26 ◽  
pp. 176-183 ◽  
Author(s):  
S. Nallusamy ◽  
V. Saravanan
Keyword(s):  
Lean Manufacturing ◽  
Lead Time ◽  
Large Scale ◽  
Manufacturing Industry ◽  
Low Cost ◽  
Current Trend ◽  
Standard Operating Procedure ◽  
Setup Time ◽  
Line Balancing ◽  
Small Scale

In the present scenario, it is necessary to follow lean manufacturing techniques more effectively and efficiently in order to meet the challenges of the global competitive market. Hence it is inevitable to introduce lean techniques which increase the productivity and reduce the lead time that ultimately results in customer satisfaction. Lean manufacturing has widely been executed in large scale industries over the past three decades. Lean means nothing but the creation of more value for customers with fewer resources and is the current trend for management of products and services. Companies are able to respond to changing customer desires with high variety, high quality, and fast throughput times with low cost. Also information management has become much simpler and more accurate. The main aim of this paper is to study the existing system in a small scale automotive component manufacturing industry and use lean tools to reduce lead time without greatly affecting the current working systems in the industry. Standard Operating Procedure (SOP) is used to standardize the production and Kanban is also introduced by indicating the part number and part description to all work stations. Ranked position weight method in line balancing is used to reduce the transportation time of products from one station to another. Cycle time and setup time were reduced by about 350 seconds and 1500 seconds by work standardization and hence the productivity also increased. After implementing SOP the overall lead time reduced from 5780 seconds to 3946 seconds.

Low-cost, high-volume packaging techniques for silicon sensors and actuators

2003 ◽  
Author(s):  
J. Mallon ◽  
J. Bryzek ◽  
J. Ramsey ◽  
G. Tomblin ◽  
F. Pourahmadi
Keyword(s):  
Low Cost ◽  
High Volume ◽  
Sensors And Actuators ◽  
Silicon Sensors
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