scholarly journals Nearly Aberration-Free Multiphoton Polymerization into Thick Photoresist Layers

Micromachines ◽  
2017 ◽  
Vol 8 (7) ◽  
pp. 219 ◽  
Author(s):  
◽  
◽  
Keyword(s):  
Thick Photoresist

Electrochemical Deposition of (Bi,Sb)2Te3 for Thermoelectric Microdevices

2000 ◽  
Vol 626 ◽  
Author(s):  
Jean-Pierre Fleurial ◽  
Jennifer A. Herman ◽  
G. Jeffrey Snyder ◽  
Margaret A. Ryan ◽  
Alexander Borshchevsky ◽  
...  
Keyword(s):  
Surface Morphology ◽  
Electrochemical Deposition ◽  
Smooth Surface ◽  
Room Temperature ◽  
Aqueous Electrolyte ◽  
Experimental Methods ◽  
Thick Photoresist ◽  
P Type ◽  
Nanoporous Templates ◽  
Deposited Films

ABSTRACTNew experimental methods have been developed to electrochemically deposit p-type Sb-rich Bi2-xSbxTe3, Pb-doped and Bi-doped Bi2Te3, and PbTe thick films. Some of the deposited films were dense and had a smooth surface morphology. These films were deposited potentiostatically at room temperature in an acidic aqueous electrolyte. Experimental deposition of Bi2Te3 alloys into various thick nanoporous templates made out of anodized alumina has also been achieved. Miniaturized thermoelements for microdevices (25 μm tall, 60 μm diameter) were grown by plating through thick photoresist templates. The experimental techniques developed, as well as the transport properties of some of the films and filled templates, will be presented.

Fabrication of Tall Structures for Microelectronics Application Using Selective Electrodeposition Process

2010 ◽  
Vol 2010 (1) ◽  
pp. 000947-000953
Author(s):  
Bernd Scholz ◽  
WeiYang Lim ◽  
Ferdous Sarwar ◽  
Syed Sajid Ahmad ◽  
Aaron Reinholz
Keyword(s):  
Aspect Ratio ◽  
Microelectronics Packaging ◽  
Electrodeposition Process ◽  
Tall Structures ◽  
Novel Approach ◽  
Development Processes ◽  
Thick Photoresist ◽  
Vertical Walls

Fabrication of tall features using selective electrodeposition is well known process and has several applications in microelectronics packaging. The use of conventional exposure and development processes is limited by the aspect ratio and sizes of the features obtained. This paper describes a novel approach to fabricated tall structures featured in thick photoresist . Tin and copper tall structures were made by selective electrodeposition. Also presented are results from experiments performed to fabricate tall tin and copper pillars with nearly vertical walls on bare dices to form interconnect.

A thick photoresist process for high aspect ratio MEMS applications

2016 ◽  
Author(s):  
Elias Laforge ◽  
Ricky Anthony ◽  
Paul McCloskey ◽  
Cian O'Mathúna
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Thick Photoresist

Investigation of the properties of thick photoresist films

1994 ◽  
Author(s):  
Gary E. Flores ◽  
Warren W. Flack ◽  
Elizabeth Tai
Keyword(s):  
Thick Photoresist

Design and Fabrication of Micro Hot Embossing Mold for Microfluidic Chip Used in Flow Cytometry

2007 ◽  
Vol 339 ◽  
pp. 246-251
Author(s):  
L.Q. Du ◽  
C. Liu ◽  
H.J. Liu ◽  
J. Qin ◽  
N. Li ◽  
...  
Keyword(s):  
Flow Cytometry ◽  
Microfluidic Chip ◽  
Low Cost ◽  
Hot Embossing ◽  
Microfluidic Chips ◽  
Metal Mold ◽  
Nickel Electroforming ◽  
Thick Photoresist ◽  
Nickel Base ◽  
Microfabrication Technology

Micro hot embossing mold of microfluidic chip used in flow cytometry is designed and microfabricated. After some kinds of microfabrication processes are tried, this paper presents a novel microfabrication technology of micro hot embossing metal mold. Micro metal mold is fabricated by low-cost UV-LIGA surface micro fabrication process using negative thick photoresist, SU-8. Different from other micro hot embossing molds, the micro mold with vertical sidewalls is fabricated by micro nickel electroforming directly on Nickel base. Based on the micro Nickel mold and automation fabrication system, high precision and mass-producing microfluidic chips have been fabricated and they have been used in flow cytometry

Constrained Layer Damping Treatments for Microstructures

2002 ◽  
Vol 124 (4) ◽  
pp. 612-616 ◽  
Author(s):  
Yi-Chu Hsu ◽  
I. Y. Shen
Keyword(s):  
Laser Doppler Vibrometer ◽  
Viscoelastic Layer ◽  
Constrained Layer Damping ◽  
Element Analysis ◽  
Resonance Modes ◽  
Thick Photoresist ◽  
Measured Frequency Response ◽  
Damping Treatments ◽  
Base Structure ◽  
Silicon Beams

This paper presents a bulk micromachining process to fabricate micro-constrained layer treatments (MCLT) on a microstructure to increase its damping, and demonstrates the damping improvement through calibrated experiments. MCLT consists of a silicon base structure (e.g., beams or plates), a viscoelastic photoresist layer, and an aluminum constraining layer. Silicon base beams and plates are fabricated from {100} wafer through Ethylene-Diamine-Pyrocatechol etch and buffered oxide etch. A 4.5-μm thick photoresist AZ4620 is spun on the silicon base beam as the viscoelastic layer. Finally, an aluminum layer is deposited through low-pressure vapor deposition as the constraining layer. To evaluate damping performance of MCLT, silicon beams with and without MCLT are subjected to swept-sine excitations by PZT from 0 to 100 kHz. In addition, a laser Doppler vibrometer and a spectrum analyzer measured frequency response functions (FRF) of the specimen. A finite element analysis identifies the resonance modes measured in FRF. Experimental results confirm that MCLT can increase damping of silicon beams by at least 40%. Significantly better damping performance is expected, if the loss factor of the viscoelastic layer is increased.

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