Fabrication and Characterization of Capacitive Micromachined Ultrasonic Transducers with Low-Temperature Wafer Direct Bonding
2000 ◽
2010 ◽
Vol 31
(5)
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pp. 443-445
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2014 ◽
Vol 10
(3)
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pp. 579-584
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2020 ◽
Vol 1535
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pp. 012009
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2011 ◽
Vol 371
(1-2)
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pp. 219-225
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2007 ◽
Vol 336-338
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pp. 1090-1092
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