scholarly journals Simulation and Modeling of Novel Electronic Device Architectures with NESS (Nano-Electronic Simulation Software): A Modular Nano TCAD Simulation Framework

Micromachines ◽  
2021 ◽  
Vol 12 (6) ◽  
pp. 680
Author(s):  
Cristina Medina-Bailon ◽  
Tapas Dutta ◽  
Ali Rezaei ◽  
Daniel Nagy ◽  
Fikru Adamu-Lema ◽  
...  
Keyword(s):  
Charge Transport ◽  
Semiconductor Device ◽  
Electronic Device ◽  
Semiconductor Devices ◽  
Electronic Devices ◽  
Cost Effective ◽  
Simulation Software ◽  
Electronic Simulation ◽  
Tcad Simulation ◽  
Quantum Mechanical Effects

The modeling of nano-electronic devices is a cost-effective approach for optimizing the semiconductor device performance and for guiding the fabrication technology. In this paper, we present the capabilities of the new flexible multi-scale nano TCAD simulation software called Nano-Electronic Simulation Software (NESS). NESS is designed to study the charge transport in contemporary and novel ultra-scaled semiconductor devices. In order to simulate the charge transport in such ultra-scaled devices with complex architectures and design, we have developed numerous simulation modules based on various simulation approaches. Currently, NESS contains a drift-diffusion, Kubo–Greenwood, and non-equilibrium Green’s function (NEGF) modules. All modules are numerical solvers which are implemented in the C++ programming language, and all of them are linked and solved self-consistently with the Poisson equation. Here, we have deployed some of those modules to showcase the capabilities of NESS to simulate advanced nano-scale semiconductor devices. The devices simulated in this paper are chosen to represent the current state-of-the-art and future technologies where quantum mechanical effects play an important role. Our examples include ultra-scaled nanowire transistors, tunnel transistors, resonant tunneling diodes, and negative capacitance transistors. Our results show that NESS is a robust, fast, and reliable simulation platform which can accurately predict and describe the underlying physics in novel ultra-scaled electronic devices.

Multiphysics Design and Analysis Simulations for Power Electronic Device Wirebonds

2003 ◽  
Author(s):  
Patrick W. Wilkerson ◽  
Andrzej J. Przekwas ◽  
Chung-Lung Chen
Keyword(s):  
Heat Dissipation ◽  
Electronic Device ◽  
Electronic Devices ◽  
Thermal Conditions ◽  
Simulation Software ◽  
Operating Conditions ◽  
Power Electronic ◽  
Stress Concentrations ◽  
Multiphysics Simulation ◽  
Multiphysics Simulations

Multiscale multiphysics simulations were performed to analyze wirebonds for power electronic devices. Modern power-electronic devices can be subjected to extreme electrical and thermal conditions. Fully coupled electro-thermo-mechanical simulations were performed utilizing CFDRC’s CFD-ACE+ multiphysics simulation software and scripting capabilities. Use of such integrated multiscale multiphysics simulation and design tools in the design process can cut cost, shorten product development cycle time, and result in optimal designs. The parametrically designed multiscale multiphysics simulations performed allowed for a streamlined parametric analysis of the electrical, thermal, and mechanical effects on the wirebond geometry, bonding sites and power electronic device geometry. Multiscale analysis allowed for full device thermo-mechanical analysis as well as detailed analysis of wirebond structures. The multiscale simulations were parametrically scripted allowing for parametric simulations of the device and wirebond geometry as well as all other simulation variables. Analysis of heat dissipation from heat generated in the power-electronic device and through Joule heating were analyzed. The multiphysics analysis allowed for investigation of the location and magnitude of stress concentrations in the wirebond and device. These stress concentrations are not only investigated for the deformed wirebond itself, but additionally at the wirebond bonding sites and contacts. Changes in the wirebond geometry and bonding geometry, easily changed through the parametrically designed simulation scripts, allows for investigation of various wirebond geometries and operating conditions.

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

2010 ◽  
Vol 132 (3) ◽  
Author(s):  
Varghese Panthalookaran
Keyword(s):  
Heat Transfer ◽  
Natural Convection ◽  
Energy Efficient ◽  
Electronic Device ◽  
Cooling System ◽  
Electronic Devices ◽  
Cost Effective ◽  
Transfer Rates ◽  
Slot Opening ◽  
Convection Cooling

Natural convection cooling provides a reliable, cost-effective, energy-efficient and noise-free method to cool electronic equipment. However, the heat transfer coefficient associated with natural convection mode is usually insufficient for electronic cooling and it requires enhancement. Chimneylike flows developed within the cabinets of electronic devices can provide better mass flow and heat transfer rates and can lead to greater cooling efficiency. Constraints in the design of natural convection cooling systems include efficiency of packing, aesthetics, and concerns of material reduction. In this paper, methods based on computational fluid dynamics are used to study the effects of parameters such as (1) vertical alignment of the slots, (2) horizontal alignment of slots, (3) area of slots, (4) differential slot opening, and (5) zonal variation in heat generation on natural convection cooling within such design constraints. Insights thus derived are found useful for designing an energy-efficient and ecofriendly cooling system for electronic devices.

scholarly journals Nano-Electronic Simulation Software (NESS): A Novel Open-Source TCAD Simulation Environment

2020 ◽  
Vol 3 (4) ◽  
pp. 1-8
Author(s):  
Cristina Medina-Bailon ◽  
◽  
Tapas Dutta ◽  
Fikru Adamu-Lema ◽  
Ali Rezaei ◽  
...  
Keyword(s):  
Open Source ◽  
Simulation Software ◽  
Simulation Environment ◽  
Electronic Simulation ◽  
Tcad Simulation

Peculiarities of the charge transport in the gas discharge electronic device with irradiated porous zeolite

2015 ◽  
Vol 29 (31) ◽  
pp. 1550195 ◽  
Author(s):  
Sevgul Ozturk ◽  
Kivilcim Koseoglu ◽  
Metin Ozer ◽  
Bahtiyar G. Salamov
Keyword(s):  
Charge Transport ◽  
Electronic Device ◽  
Electronic Devices ◽  
Charge Trapping ◽  
Gas Discharge ◽  
Energy Storage Devices ◽  
Storage Devices ◽  
Defect Centers ◽  
Field Emission Displays ◽  
First Time

The influence of pressure and [Formula: see text]-radiation (1 kGy [Formula: see text] doses) on the charge transport mechanism, charge trapping effects in porous zeolite surfaces and breakdown voltage [Formula: see text] are discussed in atmospheric microplasmas for the first time. This is due to exposure the zeolite cathode (ZC) to [Formula: see text]-radiation resulting in substantial decreases in the [Formula: see text], discharge currents and conductivity due to increase in porosity of the material. Results indicated that the enhancement of plasma light intensity and electron emission from the ZC surface with the release of trapped electrons which are captured by the defect centers following [Formula: see text]-irradiation. The porosity of the ZC and radiation defect centers has significant influence on the charge transport of the microstructure and optical properties of the devices manufactured on its base. Thus, we confirm that the [Formula: see text] is a suitable cathode material for plasma light source, field emission displays, energy storage devices and low power gas discharge electronic devices.

Fiber reinforced thermoplastics compounds for electromagnetic interference shielding applications

2021 ◽  
pp. 073168442110517
Author(s):  
Luís C Martins ◽  
António J Pontes
Keyword(s):  
Electromagnetic Interference ◽  
Steel Sheet ◽  
Electronic Device ◽  
Electronic Devices ◽  
Cost Effective ◽  
Second Phase ◽  
Fiber Reinforced ◽  
Shielding Effectiveness ◽  
Emi Shielding ◽  
Wide Range

Market demands for lightweight and lower cost products drive manufacturers to improve current product portfolios. In the case of electronic devices, the most significant weight originates from the enclosure, traditionally in steel or aluminum, that ensures excellent mechanical and electromagnetic shielding performance. The use of thermoplastics filled with electrically conductive fibers, such as carbon or stainless steel, was investigated as a lightweight and cost-effective alternative to steel sheet for creating electromagnetic interference (EMI) shielding enclosures for electronic devices. This paper presents an EMI shielding analysis workflow for the development of plastic enclosures for an electronic device. The workflow starts by measuring the fiber-reinforced thermoplastic compounds shielding effectiveness (SE) with an experimental method in the 30 MHz–3 GHz frequency band. This analysis helps to filter a vast list of materials with a wide range of shielding performance, 20–100 dB, and allows to obtain empirical data for the second phase of the workflow, computer simulations. Simulations with experimentally adjusted material properties were used to validate the design concept of an enclosure in its early development phase. Results from this study showed that the selected material has better EMI SE performance than a steel sheet venting grid.

Comparative analysis of existing methods for improving reliability of vacuum electronic devices

2019 ◽  
pp. 38-41
Author(s):  
A. A. Korneev
Keyword(s):  
Comparative Analysis ◽  
Electronic Device ◽  
Electronic Devices ◽  
Import Substitution ◽  
Electronic Control ◽  
Electronic Control System ◽  
Vacuum Electronic Devices ◽  
Electric Vacuum ◽  
Rational Control ◽  
Complex Technical Systems

The article presents the results of the study of the filament modes of electronic lamps and ensuring the rational temperature of the cathode. A brief description and comparative analysis of existing methods with the proposed author are given. The dependence diagrams obtained as a result of a real experiment are presented. A new method of rational control of the electric vacuum devices (EVP) filament mode is proposed, thereby increasing the reliability and increasing the durability of the EVP during operation in high-quality and expensive complex technical systems. According to the results of the study, a new specialized electronic device was developed, which allowed to smoothly regulate the supply of the filament voltage, thereby ensuring the rational control of the operation of the EVP. The technique and specialized electronic device are developed on the basis of modern scientific and technical achievements. This made it possible to increase the reliability and efficiency of the electronic control system for solving critical tasks. When implementing the developed device, the problem of import substitution was solved.

scholarly journals Topologically Rectangular Grids in the Parallel Simulation of Semiconductor Devices

VLSI Design ◽  
1998 ◽  
Vol 6 (1-4) ◽  
pp. 91-95 ◽  
Author(s):  
A. Asenov ◽  
A. R. Brown ◽  
S. Roy ◽  
J. R. Barker
Keyword(s):  
Simulated Annealing Algorithm ◽  
Semiconductor Device ◽  
Electronic Device ◽  
Device Simulation ◽  
Power Electronic ◽  
Two Dimensional ◽  
Solution Strategy ◽  
Rectangular Grids ◽  
Annealing Algorithm ◽  
2D And 3D

Topologically rectangular grids offer simplicity and efficiency in the design of parallel semiconductor device simulators tailored for mesh connected MIMD platforms. This paper presents several approaches to the generation of topologically rectangular 2D and 3D grids. The effects of the partitioning of such grids on different processor configurations are studied. A simulated annealing algorithm is used to optimise the partitioning of 2D and 3D grids on two dimensional arrays of processors. Problems related to the discretization, parallel matrix generation and solution strategy are discussed. The use of topologically rectangular grids is illustrated through the example of power electronic device simulation.

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