Development of Electronic Substrates for Medical Device Applications

2012 ◽  
Vol 2012 (DPC) ◽  
pp. 001527-001546 ◽  
Author(s):  
Frank D. Egitto ◽  
Rabindra N. Das ◽  
Francesco Marconi ◽  
Bill Wilson ◽  
Voya R. Markovich
Keyword(s):  
Flexible Electronics ◽  
High Speed ◽  
High Performance ◽  
Electronic Materials ◽  
High Reliability ◽  
Fine Line ◽  
Flexible Materials ◽  
Novel Approach ◽  
Micro Pillars ◽  
Electronic Substrates

There is a strong desire to develop advanced electronic substrates that can meet the growing demand for miniaturization, high-speed performance, and flexibility for medical devices. To accomplish this, new packaging structures need to be able to integrate more dies with greater function, higher I/O counts, smaller pitches, and high reliability, while being pushed into smaller and smaller footprints. As a result, the microelectronics industry is moving toward alternative, innovative approaches as solutions for squeezing more function into smaller packages. In the present study, we are developing flexible packages for a variety of medical applications. Here we discuss several classes of flexible materials that can be used to form high-performance flexible packaging. In addition, copper thinner than 5 μm is routinely used, with copper layers as thin as 0.2 μm used as a seed layer for semi-additive approaches. The use of semi-additive circuitization facilitates manufacture of fine-line circuit features, and traces narrower than 12μm have been produced routinely. A smooth copper-polymer interface is ideal for high speed applications and for fine line etching. Selection of an appropriate material provides good copper adhesion to the base film. Flexible materials with 1 or 2 metal layers provide the smallest possible roll diameter for systems such as catheters. Compatibility with well developed, high performance electronic materials represents a key advantage of flexible electronics systems that are enabled by high density fine line structures rather than unusual materials. Electrical interconnection between the chip and package can be made by a number of means. Solder-coated Cu-micro pillars for a variety of finer pitch applications are being developed. Cu micro pillars are grown through the dielectric or silicon and subsequently coated with solder to produce finer pitch 3D-interconnects. The paper also describes a novel approach for the fabrication of flexible electronics on PDMS substrates. The paper discusses the fabrication of PDMS substrates using different circuit patterns and geometries. Rozalia/Ron ok move from 2.5/3D to FC/WLP 12-21-11.

scholarly journals Tracking by Deblatting

2021 ◽  
Author(s):  
Denys Rozumnyi ◽  
Jan Kotera ◽  
Filip Šroubek ◽  
Jiří Matas
Keyword(s):  
High Speed ◽  
High Performance ◽  
Motion Blur ◽  
Velocity Estimation ◽  
High Speed Camera ◽  
Trajectory Function ◽  
Novel Approach ◽  
Blind Deblurring ◽  
Object Trajectories ◽  
Complex Trajectories

AbstractObjects moving at high speed along complex trajectories often appear in videos, especially videos of sports. Such objects travel a considerable distance during exposure time of a single frame, and therefore, their position in the frame is not well defined. They appear as semi-transparent streaks due to the motion blur and cannot be reliably tracked by general trackers. We propose a novel approach called Tracking by Deblatting based on the observation that motion blur is directly related to the intra-frame trajectory of an object. Blur is estimated by solving two intertwined inverse problems, blind deblurring and image matting, which we call deblatting. By postprocessing, non-causal Tracking by Deblatting estimates continuous, complete, and accurate object trajectories for the whole sequence. Tracked objects are precisely localized with higher temporal resolution than by conventional trackers. Energy minimization by dynamic programming is used to detect abrupt changes of motion, called bounces. High-order polynomials are then fitted to smooth trajectory segments between bounces. The output is a continuous trajectory function that assigns location for every real-valued time stamp from zero to the number of frames. The proposed algorithm was evaluated on a newly created dataset of videos from a high-speed camera using a novel Trajectory-IoU metric that generalizes the traditional Intersection over Union and measures the accuracy of the intra-frame trajectory. The proposed method outperforms the baselines both in recall and trajectory accuracy. Additionally, we show that from the trajectory function precise physical calculations are possible, such as radius, gravity, and sub-frame object velocity. Velocity estimation is compared to the high-speed camera measurements and radars. Results show high performance of the proposed method in terms of Trajectory-IoU, recall, and velocity estimation.

Multiple CMOS Intersection Measuring System Modeling and Analysis

2012 ◽  
Vol 614-615 ◽  
pp. 1299-1302
Author(s):  
Ming Jing Li ◽  
Yu Bing Dong ◽  
Guang Liang Cheng
Keyword(s):  
High Speed ◽  
High Performance ◽  
High Reliability ◽  
System Modeling ◽  
Position Effect ◽  
Field Of View ◽  
Measuring System ◽  
Price Ratio ◽  
Matlab Simulation ◽  
Modeling And Analysis

Multiple high speed CMOS cameras composing intersection system to splice large effect field of view(EFV). The key problem of system is how to locate multiple CMOS cameras in suitable position. Effect field of view was determined according to size, quantity and dispersion area of objects, so to determine camera position located on below, both sides and ahead to moving targets. This paper analyzes effect splicing field of view, operating range etc through establishing mathematical model and MATLAB simulation. Location method of system has advantage of flexibility splicing, convenient adjustment, high reliability and high performance-price ratio.

scholarly journals Hybrid Polymer/Metal Oxide Thin Films for High Performance, Flexible Transistors

Micromachines ◽  
2020 ◽  
Vol 11 (3) ◽  
pp. 264 ◽  
Author(s):  
Jae Jeong ◽  
Hye Hwang ◽  
Dalsu Choi ◽  
Byung Ma ◽  
Jaehan Jung ◽  
...  
Keyword(s):  
Electronic Properties ◽  
Polymer Nanocomposites ◽  
Flexible Electronics ◽  
High Performance ◽  
Electronic Materials ◽  
Polymer Nanocomposite ◽  
Metal Oxide Thin Films ◽  
Research Fields ◽  
Recent Developments ◽  
Polymer Metal

Metal oxides (MOs) have garnered significant attention in a variety of research fields, particularly in flexible electronics such as wearable devices, due to their superior electronic properties. Meanwhile, polymers exhibit excellent mechanical properties such as flexibility and durability, besides enabling economic solution-based fabrication. Therefore, MO/polymer nanocomposites are excellent electronic materials for use in flexible electronics owing to the confluence of the merits of their components. In this article, we review recent developments in the synthesis and fabrication techniques for MO/polymer nanocomposite-based flexible transistors. In particular, representative MO/polymer nanocomposites for flexible and transparent channel layers and gate dielectrics are introduced and their electronic properties—such as mobilities and dielectric constant—are presented. Finally, we highlight the advances in interface engineering and its influence on device electronics.

Effective Friction Control for Optimization of High Speed Rail Operations

2010 ◽  
Author(s):  
Donald T. Eadie ◽  
Kevin Oldknow ◽  
Yasushi Oka ◽  
Ron Hui ◽  
Peter Klauser ◽  
...  
Keyword(s):  
High Speed ◽  
High Performance ◽  
High Reliability ◽  
Ride Quality ◽  
Oil And Grease ◽  
High Speed Rail ◽  
Wear Rates ◽  
Friction Control ◽  
Very High ◽  
Effective Friction

Expected growth of High Speed Rail (HSR) in North America will in many instances involve operation on existing infrastructure, shared with other traffic. This will pose many challenges, not least of which will be wheel and rail wear, and ride quality. This paper addresses how effective friction control can be employed to mitigate these factors and provide an important tool to the designers of new systems. Case studies describe successful use of train mounted solid stick LCF flange lubrication on high speed trains in East Asia and Japan. In each case, higher speed train operation has involved operation on areas of track with greater curvature than usual on dedicated high speed track. Appropriately designed LCF systems provide an inherently very high level of reliability and very low flange wear rates. Use of dry thin film lubricant technology has advantages over use of liquid lubricants (oil and grease) which can experience splash and fling off at high train speeds. Train mounted solid sticks provide greater consistency / reliability and ease of maintenance compared with wayside gauge face lubrication. Complementing practical field experience, modeling studies are presented which show the potential of high performance flange lubrication to allow for additional flexibility in designing wheel profiles for high speed rail. The ideal profile will balance vehicle stability (benefiting from lower conicity) and curving performance (benefiting from higher conicity). In a high speed train with long wheel base and high suspension stiffness operating in areas with significant curvature, finding an appropriate compromise becomes even more challenging than usual. Controlling flange wear at low rates with highly effective solid stick lubrication offers the opportunity to use wheel profiles providing lower effective conicity and therefore better ride quality, without compromising wheel life. This approach will be practical only in a scenario where a very high reliability wheel / rail lubrication system is employed.

High Temperature Silicon Carbide Power Modules for High Performance Systems

2011 ◽  
Vol 2011 (HITEN) ◽  
pp. 000159-000166 ◽  
Author(s):  
J. Hornberger ◽  
B. McPherson ◽  
J. Bourne ◽  
R. Shaw ◽  
E. Cilio ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
High Speed ◽  
High Performance ◽  
High Reliability ◽  
Extreme Environment ◽  
High Energy ◽  
Energy Applications ◽  
Power Modules ◽  
Reliability Systems

The demands of modern high-performance power electronics systems are rapidly surpassing the power density, efficiency, and reliability limitations defined by the intrinsic properties of silicon-based semiconductors. The advantages of silicon carbide (SiC) are well known, including high temperature operation, high voltage blocking capability, high speed switching, and high energy efficiency. In this discussion, APEI, Inc. presents two newly developed high performance SiC power modules for extreme environment systems and applications. These power modules are rated to 1200V, are operational at currents greater than 100A, can perform at temperatures in excess of 250 °C, and are designed to house various SiC devices, including MOSFETs, JFETs, or BJTs. One newly developed module is designed for high performance, ultra-high reliability systems such as aircraft and spacecraft, and features a hermetically sealed package with a ring seal technology capable of sustaining temperatures in excess of 400°C. The second module is designed for high performance commercial and industrial systems such as hybrid electric vehicles or renewable energy applications, implements a novel ultra-low parasitic packaging approach that enables high switching frequencies in excess of 100 kHz, and weighs in at just over 130 grams (offering ~5× mass reduction and ~3× size reduction in comparison with industry standard power brick packaging technology). It is configurable as either a half or full bridge converter. In this discussion, APEI, Inc. introduces these products and presents practical testing of each.

Development of a Non-Contacting Mechanical Seal for High Performance Turbocharger Applications

2018 ◽  
Author(s):  
Daniel A. Nelson
Keyword(s):  
High Speed ◽  
High Performance ◽  
Piston Ring ◽  
Fuel Efficiency ◽  
Thermal Response ◽  
Operating Conditions ◽  
Mechanical Seal ◽  
Tribological Surfaces ◽  
Novel Approach ◽  
Automobile Engines

This paper presents the design and development of a non-contacting dry-gas mechanical seal for high performance automotive turbocharger applications. Turbochargers are increasingly being incorporated into high performance automobile engines to improve fuel efficiency, enhance energy recovery, and increase horsepower as compared with similar sized naturally aspirated engines. Minimizing the wear rate of tribological surfaces in the turbomachinery is critical to maximizing the reliability and durability of the turbocharger. A dry-gas seal for turbochargers and related technologies with 2 to 4 cm shafts has been developed. The seal provides a complete barrier between the bearing oil and compressor flow path and is capable of reverse pressure and high speed. The seal performance was evaluated for speeds between 60,000 to 80,000 RPM, pressure differentials between −0.8 (reverse pressure) to 6 bar, and temperatures between 20 to 200 °C. Structural and thermal response of the seal components to the operating conditions are analyzed using finite element methods and the tribological behavior of the seal rings are analyzed using computational fluid dynamics. The design is experimentally validated in a seal test stand. This novel approach reduces turbocharger blowby and shows no measurable wear when compared with piston ring seals.

A Magnetic Bearing System for More-Electric Engines

2000 ◽  
Author(s):  
R. Jett Field ◽  
Christopher K. Sortore ◽  
Victor Iannello
Keyword(s):  
High Speed ◽  
High Performance ◽  
Fault Tolerant ◽  
High Reliability ◽  
Industrial Applications ◽  
Magnetic Bearing ◽  
Tip Clearance ◽  
Critical Components ◽  
Maintenance Requirements ◽  
Bearing System

Magnetic bearing systems for more-electric engines (MEEs) are under development for aircraft and industrial applications to improve performance and reduce maintenance requirements. Key features of the magnetic bearing system are high performance, high temperature actuators with integrated sensors; a high speed digital controller; a high reliability, fault-tolerant system architecture; modular amplifiers; active control of tip clearance; and adaptive control algorithms. Critical components of the magnetic bearing system have been demonstrated in an engine manufacturer’s rotordynamic test stand and other components are in various stages of development.

High Performance Conductive Adhesives for Lead-Free Interconnects

2006 ◽  
Vol 968 ◽  
Author(s):  
Yi Li ◽  
ChingPing Wong
Keyword(s):  
High Power ◽  
High Performance ◽  
High Current Density ◽  
High Reliability ◽  
Nano Particles ◽  
Electrical Performance ◽  
Conductive Adhesives ◽  
Molecular Monolayers ◽  
Fine Pitch ◽  
Novel Approach

ABSTRACTTin-lead solder alloys are widely used in the electronic industry. With the recognition of toxicity of lead, however, electrically conductive adhesives (ECAs) have been considered as one of the most promising alternatives of tin-lead solder. While silver is the most widely used conductive fillers for ECA, silver migration has been the major concern for the high power and fine pitch applications. In this paper, a novel approach of using self-assembled monolayers (SAMs) passivation has been introduced to control the silver migration in nano-Ag ECAs. The protection of silver nano particles with SAMs reduced the silver migration dramatically and no migration was observed upon application of high voltages (up to 500 V) due to the formation of surface chelating compounds between the SAM and nano silver fillers. Unlike other migration control approaches which sacrifice electrical performance, the SAM passivated nano Ag fillers also enhanced the electrical conductivity and current carrying capability of adhesive joints significantly due to the improved interfacial properties and high current density of those molecular monolayers. The joint resistance of the SAM incorporated nano-Ag conductive adhesive could be achieved as low as 10−5 Ohm (the contact area is 100 ×100 μm2) and the maximum allowable current was higher than 3500 mA. As such, a fine pitch, high performance, non-migration and high reliability adhesives are developed for potential solder replacement in high voltage, high power device applications.

Development of a Noncontacting Mechanical Seal for High Performance Turbocharger Applications

2018 ◽  
Vol 141 (3) ◽  
Author(s):  
Daniel A. Nelson
Keyword(s):  
High Speed ◽  
High Performance ◽  
Piston Ring ◽  
Fuel Efficiency ◽  
Thermal Response ◽  
Operating Conditions ◽  
Mechanical Seal ◽  
Tribological Surfaces ◽  
Novel Approach ◽  
Automobile Engines

This paper presents the design and development of a noncontacting dry-gas mechanical seal for high performance automotive turbocharger applications. Turbochargers are increasingly being incorporated into high performance automobile engines to improve fuel efficiency, enhance energy recovery, and increase horsepower as compared with similar sized naturally aspirated engines. Minimizing the wear rate of tribological surfaces in the turbomachinery is critical to maximizing the reliability and durability of the turbocharger. A dry-gas seal for turbochargers and related technologies with 2–4 cm shafts has been developed. The seal provides a complete barrier between the bearing oil and compressor flow path and is capable of reverse pressure and high speed. The seal performance was evaluated for speeds between 60,000 and 80,000 rpm, pressure differentials between −0.8 (reverse pressure) to 6 bar, and temperatures between 20 and 200 °C. Structural and thermal response of the seal components to the operating conditions are analyzed using finite element methods and the tribological behavior of the seal rings are analyzed using computational fluid dynamics. The design is experimentally validated in a seal test stand. This novel approach reduces turbocharger blowby and shows no measurable wear when compared with piston ring seals.

Remote Status Monitoring and Fault Diagnosis for Manufacturing System

2011 ◽  
Vol 103 ◽  
pp. 229-233
Author(s):  
Tao Zan ◽  
Min Wang ◽  
Jian Zhong Hu ◽  
Xiao Liu
Keyword(s):  
Fault Diagnosis ◽  
High Performance ◽  
Production Efficiency ◽  
Manufacturing System ◽  
High Reliability ◽  
Status Monitoring ◽  
Intelligent Technique ◽  
Novel Approach ◽  
The Cost ◽  
Artificial Intelligent Technique

This paper introduces a novel approach for mechanical manufacturing system to implement status monitoring and fault diagnosis. The embedded hardware and software framework for terminal device is discussed to ensure high performance, high reliability, high expansibility, low power and small volume. According to the demand of remote status monitoring, the strategy of data transmission and information sharing is applied to provide the analyzing and diagnosing service based on intranet/internet. The artificial intelligent technique is used for information fusion and fault diagnosis of manufacturing system. The proposed approach shows great potential for improving overall production efficiency, while reducing the cost of maintenance.

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