scholarly journals Miniaturization of CMOS

Micromachines ◽  
2019 ◽  
Vol 10 (5) ◽  
pp. 293 ◽  
Author(s):  
Henry H. Radamson ◽  
Xiaobin He ◽  
Qingzhu Zhang ◽  
Jinbiao Liu ◽  
Hushan Cui ◽  
...  

When the international technology roadmap of semiconductors (ITRS) started almost five decades ago, the metal oxide effect transistor (MOSFET) as units in integrated circuits (IC) continuously miniaturized. The transistor structure has radically changed from its original planar 2D architecture to today’s 3D Fin field-effect transistors (FinFETs) along with new designs for gate and source/drain regions and applying strain engineering. This article presents how the MOSFET structure and process have been changed (or modified) to follow the More Moore strategy. A focus has been on methodologies, challenges, and difficulties when ITRS approaches the end. The discussions extend to new channel materials beyond the Moore era.

Doklady BGUIR ◽  
2021 ◽  
Vol 19 (5) ◽  
pp. 52-60
Author(s):  
O. V. Dvornikov ◽  
V. A. Tchekhovski ◽  
V. L. Dziatlau ◽  
A. V. Kunts ◽  
N. N. Prokopenko

A multi-differential operational amplifier, called OAmp3, designed for operation at temperatures up to minus 197 °С and developed on bipolar transistors and junction field-effect transistors of the master slice array МН2ХА030, is considered in the article. The circuitry features of the OAmp3 allow, due to the use of various negative feedback circuits, to implement a set of functions necessary for signal processing on a single amplifier: amplification (or current – voltage conversion), filtering, shift of the constant output voltage level. The performed measurements of OAmp3, connected as instrumentation amplifier circuit, showed that all manufactured products retain their performance in the temperature range from minus 150 °С to 20 °С, and individual samples – at minus 197 °С. It was found that the main reason for the loss of OAmp3 performance is an increase of the resistance of semiconductor resistors by almost 5.4 times at minus 197 °С compared to normal conditions and decrease in the junction field-effect transistor drain current. Together, these factors lead to decrease in the current consumption of the OAmp3 by almost 31 times at minus 180 °С compared to normal conditions. To reduce the temperature dependence of the current consumption and, thus, save the OAmp3 operability at low temperatures without changing the technological route of integrated circuits manufacturing, it is proposed to replace high-resistance semiconductor resistors with “pinch-resistors” formed on a small-signal p-junction field-effect transistor. The article presents the OAmp3 connection circuit in the form of an instrumental amplifier, the method and results of low-temperature measurements of experimental samples.


Author(s):  
Christofer Toumazou ◽  
Tan Sri Lim Kok Thay ◽  
Pantelis Georgiou

Semiconductor genetics is now disrupting the field of healthcare owing to the rapid parallelization and scaling of DNA sensing using ion-sensitive field-effect transistors (ISFETs) fabricated using commercial complementary metal -oxide semiconductor technology. The enabling concept of DNA reaction monitoring introduced by Toumazou has made this a reality and we are now seeing relentless scaling with Moore's law ultimately achieving the $100 genome. In this paper, we present the next evolution of this technology through the creation of the gene-sensitive integrated cell (GSIC) for label-free real-time analysis based on ISFETs. This device is derived from the traditional metal-oxide semiconductor field-effect transistor (MOSFET) and has electrical performance identical to that of a MOSFET in a standard semiconductor process, yet is capable of incorporating DNA reaction chemistries for applications in single nucleotide polymorphism microarrays and DNA sequencing. Just as application-specific integrated circuits, which are developed in much the same way, have shaped our consumer electronics industry and modern communications and memory technology, so, too, do GSICs based on a single underlying technology principle have the capacity to transform the life science and healthcare industries.


1991 ◽  
Vol 69 (3-4) ◽  
pp. 174-176 ◽  
Author(s):  
Ian W. Wylie ◽  
N. Garry Tarr

A new lightly doped drain (LDD) metal oxide semiconductor field effect transistor structure is presented that provides substantial overlap of the gate over the n− region independent of the n− junction depth. This structure uses polysilicon spacers to replace the oxide sidewall spacers used in a conventional LDD device. The structure has been given the acronym "AGAIN," for added gate after implantation of n−.


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