scholarly journals Effects of Extreme Thermal Shock on Microstructure and Mechanical Properties of Au-12Ge/Au/Ni/Cu Solder Joint

Metals ◽  
2020 ◽  
Vol 10 (10) ◽  
pp. 1373
Author(s):  
Ziyi Wang ◽  
Songbai Xue ◽  
Weimin Long ◽  
Bo Wang ◽  
Jianhao Wang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Shock ◽  
Fracture Mode ◽  
Extreme Temperature ◽  
Interface Layer ◽  
Thin Layers ◽  
Thermal Shock Test ◽  
Micro Cracks ◽  
Microstructure Morphology ◽  
Interface Layers

Extreme temperature change has generally been the great challenge to spacecraft electronic components, particularly in long, periodic, deep-space exploration missions. Hence, researchers have paid more attention to the reliability of component packaging materials. In this study, the microstructure evolution on the interface of Cu/Ni/Au/Au-12Ge/Au/Ni/Cu joints, as well as the effects of extreme thermal shock on mechanical properties and the fracture mode in the course of extreme thermal changes between −196 and 150 °C, have been investigated. Results revealed that the interface layers comprised of two thin layers of NiGe and Ni5Ge3 compounds after Au-12Ge solder alloy was soldered on the Au/Ni/Cu substrate. After extreme thermal shock tests, the microstructure morphology converted from scallop type to planar one due to the translation from NiGe to Ni5Ge3. Meanwhile, the thickness of interface layer hardly changed. The shear strength of the joints after 300 cycles of extreme thermal shock was 35.1 MPa, which decreased by 19.61%. The fracture location changed from the solder to solder/NiGe interface, and then to the interface of NiGe/Ni5Ge3 IMC layer. Moreover, the fracture type of the joints gradually transformed from ductile fracture mode to brittle mode during thermal shock test. Simultaneously, the formation and extension of defects, such as micro-voids and micro-cracks, were found during the process of thermal shock due to the different thermal expansion coefficient among the solder, interface layer and substrate.

Microstructure and Mechanical Properties of TiAlNb Coating Deposited by APS and HVOF Spraying

2013 ◽  
Vol 747-748 ◽  
pp. 139-145
Author(s):  
Hong Jie Zeng ◽  
Lai Qi Zhang ◽  
Xin Yu He ◽  
You Cha Zhang ◽  
Pen Jia ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Bond Strength ◽  
Thermal Shock ◽  
Steel Substrate ◽  
Thermal Spraying ◽  
Atmospheric Plasma ◽  
Oxide Content ◽  
Thermal Shock Test ◽  
Hvof Spraying ◽  
Lower Porosity

As a material intended for application in hot-dip galvanization, Ti28.15Al63.4Nb8.25Y (at %) coatings were deposited onto 316L stainless steel substrate using high velocity oxygen fuel (HVOF) and atmospheric plasma spray (APS), respectively. The influence of different thermal spraying techniques on the microstructure, phase transformation, porosity, bond strength and hardness values of Ti28.15Al63.4Nb8.25Y coatings was analyzed by scanning electron microscopy (SEM), X-ray diffraction, tensile test and other analysis methods. In addition, the thermal shock test of Ti28.15Al63.4Nb8.25Y coatings was carried out to evaluate the desquamation resistance and the model of invalidation. The results indicated that HVOF Ti28.15Al63.4Nb8.25Y coatings had more uniform and compact morphology than APS Ti28.15Al63.4Nb8.25Y coating and HVOF Ti28.15Al63.4Nb8.25Y coatings have lower porosity and oxide content. The coatings processed by HVOF had higher bond strength, microhardness and thermal shock resistance and displayed better mechanical properties than that prepared by APS.

scholarly journals Influence of Interfacial Intermetallic Growth on the Mechanical Properties of Sn-37Pb Solder Joints under Extreme Temperature Thermal Shock

2018 ◽  
Vol 8 (11) ◽  
pp. 2056 ◽  
Author(s):  
Chunjin Hang ◽  
Ruyu Tian ◽  
Liyou Zhao ◽  
Yanhong Tian
Keyword(s):  
Thermal Shock ◽  
Solder Joints ◽  
Extreme Temperature ◽  
Bulk Diffusion ◽  
Thermal Shock Test ◽  
Interfacial Imcs ◽  
Deep Space Exploration ◽  
Pull Strength ◽  
Quad Flat Package ◽  
Interfacial Intermetallic Compounds

Solder joints in thermally uncontrolled microelectronic assemblies have to be exposed to extreme temperature environments during deep space exploration. In this study, extreme temperature thermal shock test from −196 °C to 150 °C was performed on quad flat package (QFP) assembled with Sn-37Pb solder joints to investigate the evolution and growth behavior of interfacial intermetallic compounds (IMCs) and their effect on the pull strength and fracture behavior of Sn-37Pb solder joints under extreme temperature environment. Both the scallop-type (Cu, Ni)6Sn5 IMCs at the Cu lead side and the needle-type (Ni, Cu)3Sn4 IMCs at the Ni-P layer side changed to plane-type IMCs during extreme temperature thermal shock. A thin layer of Cu3Sn IMCs was formed between the Cu lead and (Cu, Ni)6Sn5 IMC layer after 150 cycles. The growth of the interfacial IMCs at the lead side and the Ni-P layer side was dominated by bulk diffusion and grain-boundary diffusion, respectively. The pull strength was reduced about 31.54% after 300 cycles. With increasing thermal shock cycles, the fracture mechanism changed from ductile fracture to mixed ductile–brittle fracture, which can be attributed to the thickening of the interfacial IMCs, and the stress concentration near the interface caused by interfacial IMC growth.

Reliability Evaluation of QFP Solder Joint Using Sn-8Zn-3Bi Solder Paste during the Thermal Shock Test

2008 ◽  
Vol 580-582 ◽  
pp. 247-250
Author(s):  
S.W. Han ◽  
Kyong Ho Chang ◽  
J.G. Han ◽  
Il Je Cho ◽  
Jong Min Kim ◽  
...  
Keyword(s):  
Fracture Surface ◽  
Solder Joint ◽  
Thermal Shock ◽  
Fracture Mode ◽  
Lead Free ◽  
Composition Analysis ◽  
Thermal Shock Test ◽  
Solder Paste ◽  
Shock Test ◽  
Pull Strength

The reliability of QFP (Quad flat package) solder joint using Sn-8Zn-3Bi solder paste under the thermal shock test was investigated. Considering the environmental restriction such as ROHS, the QFP Cu LF (Lead-frame) was coated with lead-free materials (Sn, Sn-3Bi). To analyze the reliability under thermal shock treatment, the samples were placed in the thermal shock chamber (248K/423K, Dwell time: 30min). During the thermal shock test, the solder joint cross-sections were observed every 500 cycles. No crack initiation and propagation was observed through all type of plated Cu LF. The measured pull strength slightly decreased, as the number of cycles increased. After 1000 cycles, the pull strength of Sn and SnBi plated Cu LF reduced by 30% and 20%, respectively, compared with that of initial condition. Observing the fracture surface morphology by FE-SEM, the fracture mode changed and the IMC fractured area on the both fracture surface was increased. The IMC was identified as γ-Cu5Zn8 by chemical composition analysis using EDS. The reduced pull strength was affected by IMC fracture and fracture mode change. However, the pull strength does not decrease steeply but gradually. Consequently, the Sn-8Zn-3Bi solder joint shows the reliable solder joint strength, fracture mechanism, and compatibility with lead-free plated Cu LF during the thermal shock temperature of 248K to 423K.

Degradation Behavior of TiN Coatings with Different Thicknesses after a Pulsed Laser Thermal Shock Test

2013 ◽  
Vol 51 (10) ◽  
pp. 729-734 ◽  
Author(s):  
Seol Jeon ◽  
Youngkue Choi ◽  
Hyun-Gyoo Shin ◽  
Hyun Park ◽  
Heesoo Lee ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Pulsed Laser ◽  
Thermal Shock Test ◽  
Degradation Behavior ◽  
Shock Test ◽  
Tin Coatings

Dependence of the Deformation of 128×128 InSb Focal-plane Arrays on the Silicon Readout Integrated Circuit Thickness

2015 ◽  
Vol 9 (1) ◽  
pp. 170-174 ◽  
Author(s):  
Xiaoling Zhang ◽  
Qingduan Meng ◽  
Liwen Zhang
Keyword(s):  
Thermal Shock ◽  
Indium Antimonide ◽  
Integrated Circuit ◽  
Focal Plane ◽  
Three Dimensional ◽  
Fracture Probability ◽  
Focal Plane Arrays ◽  
Thermal Shock Test ◽  
Readout Integrated Circuit ◽  
Three Dimensional Modeling

The square checkerboard buckling deformation appearing in indium antimonide infrared focal-plane arrays (InSb IRFPAs) subjected to the thermal shock tests, results in the fracturing of the InSb chip, which restricts its final yield. In light of the proposed three-dimensional modeling, we proposed the method of thinning a silicon readout integrated circuit (ROIC) to level the uneven top surface of InSb IRFPAs. Simulation results show that when the silicon ROIC is thinned from 300 μm to 20 μm, the maximal displacement in the InSb IRFPAs linearly decreases from 7.115 μm to 0.670 μm in the upward direction, and also decreases linearly from 14.013 μm to 1.612 μm in the downward direction. Once the thickness of the silicon ROIC is less than 50 μm, the square checkerboard buckling deformation distribution presenting in the thicker InSb IRFPAs disappears, and the top surface of the InSb IRFPAs becomes flat. All these findings imply that the thickness of the silicon ROIC determines the degree of deformation in the InSb IRFPAs under a thermal shock test, that the method of thinning a silicon ROIC is suitable for decreasing the fracture probability of the InSb chip, and that this approach improves the reliability of InSb IRFPAs.

Impact of thermal shock cycles on mechanical properties and microstructure of lithium disilicate dental glass-ceramic

2018 ◽  
Vol 44 (2) ◽  
pp. 1589-1593 ◽  
Author(s):  
Dongdong Qian ◽  
Lei Zhang ◽  
Ying Zhang ◽  
Pingying Liu ◽  
Xizhang Wang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Thermal Shock ◽  
Glass Ceramic ◽  
Lithium Disilicate

scholarly journals Microstructural Characteristics and Mechanical Properties of Friction Stir Spot Welded 2A12-T4 Aluminum Alloy

2013 ◽  
Vol 2013 ◽  
pp. 1-10 ◽  
Author(s):  
Huijie Liu ◽  
Yunqiang Zhao ◽  
Xingye Su ◽  
Lilong Yu ◽  
Juncai Hou
Keyword(s):  
Mechanical Properties ◽  
Aluminum Alloy ◽  
Fracture Mode ◽  
Heat Input ◽  
Tensile Shear ◽  
Microstructural Characteristics ◽  
Friction Stir ◽  
Welding Heat Input ◽  
Mixed Fracture ◽  
Spot Welded

2A12-T4 aluminum alloy was friction stir spot welded, and the microstructural characteristics and mechanical properties of the joints were investigated. A softened microstructural region existed in the joint, and it consisted of stir zone (SZ), thermal mechanically affected zone (TMAZ), and heat affected zone (HAZ). The minimum hardness was located in TMAZ, and the average hardness value in SZ can be improved by appropriately increasing welding heat input. The area of complete bonding region at the interface increased with increasing welding heat input because more interface metals were mixed. In a certain range of FSSW parameters, the tensile shear failure load of the joint increased with increasing rotation speed, but it decreased with increasing plunge rate or decreasing shoulder plunging depth. Two kinds of failure modes, that is, shear fracture mode and tensile-shear mixed fracture mode, can be observed in the tensile shear tests, and the joint that failed in the tensile-shear mixed fracture mode possessed a high carrying capability.

Analysis of the electrical characteristics and structure of Cu-Filled TSV with thermal shock test

2014 ◽  
Vol 10 (3) ◽  
pp. 649-653 ◽  
Author(s):  
Il Ho Jeong ◽  
Myong Hoon Roh ◽  
Flora Jung ◽  
Wan Ho Song ◽  
Michael Mayer ◽  
...  
Keyword(s):  
Thermal Shock ◽  
Thermal Shock Test ◽  
Electrical Characteristics ◽  
Shock Test
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