Control and Testing of Epoxy Resins Used for Printed Circuit Boards

2009 ◽  
pp. 533-533-8 ◽  
Author(s):  
TD Zucconi
Keyword(s):  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit

Composition-dependent curing behavior and peel strength of epoxy resins for printed circuit boards (PCBs)

2010 ◽  
Vol 18 (1) ◽  
pp. 47-52 ◽  
Author(s):  
Jae-Choon Cho ◽  
Hwa-Young Lee ◽  
Sung-Taek Lim ◽  
Moon-Soo Park ◽  
Yong-Soo Oh ◽  
...  
Keyword(s):  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Peel Strength ◽  
Circuit Boards ◽  
Curing Behavior ◽  
Printed Circuit

scholarly journals Copper/Epoxy Joints in Printed Circuit Boards: Manufacturing and Interfacial Failure Mechanisms

Materials ◽  
2019 ◽  
Vol 12 (3) ◽  
pp. 550 ◽  
Author(s):  
Philipp Nothdurft ◽  
Gisbert Riess ◽  
Wolfgang Kern
Keyword(s):  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Failure Mechanisms ◽  
Electric Signal ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Wide Range ◽  
Pcb Manufacturing ◽  
Common Coupling ◽  
New Strategies

Printed circuit boards (PCBs) have a wide range of applications in electronics where they are used for electric signal transfer. For a multilayer build-up, thin copper foils are alternated with epoxy-based prepregs and laminated to each other. Adhesion between copper and epoxy composites is achieved by technologies based on mechanical interlocking or chemical bonding, however for future development, the understanding of failure mechanisms between these materials is of high importance. In literature, various interfacial failures are reported which lead to adhesion loss between copper and epoxy resins. This review aims to give an overview on common coupling technologies and possible failure mechanisms. The information reviewed can in turn lead to the development of new strategies, enhancing the adhesion strength of copper/epoxy joints and, therefore, establishing a basis for future PCB manufacturing.

Dissolution of Brominated Epoxy Resins by Dimethyl Sulfoxide To Separate Waste Printed Circuit Boards

2013 ◽  
Vol 47 (6) ◽  
pp. 2654-2660 ◽  
Author(s):  
Ping Zhu ◽  
Yan Chen ◽  
Liangyou Wang ◽  
Guangren Qian ◽  
Wei Jie Zhang ◽  
...  
Keyword(s):  
Dimethyl Sulfoxide ◽  
Epoxy Resins ◽  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Waste Printed Circuit Boards
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