scholarly journals Design of an Ultra-Wideband Microstrip-to-Slotline Transition on Low-Permittivity Substrate

Electronics ◽  
2020 ◽  
Vol 9 (8) ◽  
pp. 1329
Author(s):  
Jung Seok Lee ◽  
Gwan Hui Lee ◽  
Wahab Mohyuddin ◽  
Hyun Chul Choi ◽  
Kang Wook Kim

Analysis and design of an ultra-wideband microstrip-to-slotline transition on a low permittivity substrate is presented. Cross-sectional structures along the proposed transition are analyzed using conformal mapping assuming quasi-TEM modes, attaining one analytical line impedance formula with varying design parameters. Although the slotline is a non-TEM transmission line, the transitional structures are configured to have quasi-TEM modes before forming into the slotline. The line impedance is optimally tapered using the Klopfenstein taper, and the electric field shapes are smoothly transformed from microstrip line to slotline. The analytical formula is accurate within 5% difference, and the final transition configuration can be designed without parameter tuning. The implemented microstrip-to-slotline transition possesses insertion loss of less than 1.5 dB per transition and return loss of more than 10 dB from 4.4 to over 40 GHz.

In this article, a novel offset microstrip line feed Rectangular Dielectric Resonator Antenna is used for bandwidth enhancement. The parameters such as Bandwidth, Return Loss and Radiation efficiency are improved in the proposed antenna. A comparison is also shown for the proposed feed structure with and without conformal strips. The improvement in the bandwidth is observed from 25% to 65% by optimizing the antenna design parameters. It works in three frequency bands, that is, 2.03-3.69 GHz, 3.86-7.26 GHz, and 7.32-9.26 GHz. The proposed antenna is appropriate for WIMAX/WLAN applications.


2017 ◽  
Vol 7 (1.1) ◽  
pp. 525
Author(s):  
P Saleem Akram ◽  
B T P Madhav ◽  
G Jeevana Sravya ◽  
V Sudhakar ◽  
G Lakshmi Sirisha ◽  
...  

This article studies about the design and analysis of serrated patch antenna with a slot at the ground with microstrip line feed. Comparative analysis has been carried in five and ten serrated patches at top and side edges of the square patch. All design iterations have been carried out using commercially equipped tool HFSS 13. For bandwidth enhancement a slot has been placed at the ground in all iterations in common, later the return loss and gain have been analyzed and compared for all models. Finally, the proposed modal consists of ten serrations at the three edges of the square patch where it works on the ultrawide band region with high gain when compared to all models. The proposed antenna has its applications at WiMAX, WLAN 802.11, LTE 42/43 bands and works in the region of ultrawide band(3.1GHz-10.6GHz).and having rejection at 5-6GHz


Electronics ◽  
2021 ◽  
Vol 10 (11) ◽  
pp. 1272
Author(s):  
Gwan Hui Lee ◽  
Wahab Mohyuddin ◽  
Sachin Kumar ◽  
Hyun Chul Choi ◽  
Kang Wook Kim

A design of a compact coplanar strip (CPS)-to-microstrip line (MSL) transition using a bended structure on a two-layered substrate is presented. The proposed transition consists of a CPS taper and a bended CPS-to-MSL transition on a two-layered substrate. The CPS taper is formed on the lower substrate with low permittivity (εr = 3.38), and the bended CPS-to-MSL transition is formed on the upper substrate with high permittivity (εr= 10.2). The proposed transition is designed with analytical formulas obtained by applying EM-based conformal mapping without parametric tuning trials. The conductor shape of the bended CPS-to-MSL transition is adjusted to form an optimal Klopfenstein impedance taper. The proposed CPS-to-MSL transition optimally connects between a high impedance CPS line (~160 Ω) and a 50 Ω MSL, which typically results in a long transition length for ultra-wideband performance. The implemented transition bended in a sinusoid shape on the two-layered substrate provides good performance from 2 GHz to 17 GHz with the maximum 2 dB insertion loss per transition, and the horizontal length of the bended transition is reduced to 42.9% of the straight transition length. This bended transition is developed for use in mm-wave balanced antenna/detector feeds but can be applied to a variety of wideband balanced circuit modules, where compact circuit size is critical.


2018 ◽  
Vol 31 (4) ◽  
pp. 641-650 ◽  
Author(s):  
Seyed Naghdehforushha ◽  
Mahdi Bahaghighat ◽  
Mohammad Salehifar ◽  
Hossein Kazemi

In this paper, a novel design for planar plate monopole antennas is proposed with applications to ultra-wide band (UWB) communications. To verify the proposed antenna design, simulations are performed by means of CST and HFSS software tools, showing that the impedance bandwidth is significantly increased by vertical cross-sections. By adding a series of parameters to the vertical cross sections, the antenna efficiency is effectively enhanced by achieving a return loss of 10 dB over the bandwidth range between 3.1 GHz and 10.6 GHz. In addition, our experimental results demonstrate that the fabricated antenna has a return loss performance similar to that obtained by the simulation results.


2020 ◽  
Vol 14 ◽  
Author(s):  
Osama Bedair

Background: Modular steel buildings (MSB) are extensively used in petrochemical plants and refineries. Limited guidelines are available in the industry for analysis and design of (MSB) subject to accidental vapor cloud explosions (VCEs). Objectives: The paper presents simplified engineering model for modular steel buildings (MSB) subject to accidental vapor cloud explosions (VCEs) that are extensively used in petrochemical plants and refineries. Method: A Single degree of freedom (SDOF) dynamic model is utilized to simulate the dynamic response of primary building components. Analytical expressions are then provided to compute the dynamic load factors (DLF) for critical building elements. Recommended foundation systems are also proposed to install the modular building with minimum cost. Results: Numerical results are presented to illustrate the dynamic response of (MSB) subject to blast loading. It is shown that (DLF)=1.6 is attained at (td/t)=0.4 for front wall (W1) with (td/T)=1.25. For side walls (DLF)=1.41 and is attained at (td/t)=0.6. Conclusions: The paper presented simplified tools for analysis and design of (MSB) subject accidental vapor cloud blast explosions (VCEs). The analytical expressions can be utilized by practitioners to compute the (MSB) response and identify the design parameters. They are simple to use compared to Finite Element Analysis.


2017 ◽  
Vol 2017 ◽  
pp. 1-13
Author(s):  
Xin Wan ◽  
Ximing Liu ◽  
Jichen Miao ◽  
Peng Cong ◽  
Yuai Zhang ◽  
...  

Pebble dynamics is important for the safe operation of pebble-bed high temperature gas-cooled reactors and is a complicated problem of great concern. To investigate it more authentically, a computed tomography pebble flow detecting (CT-PFD) system has been constructed, in which a three-dimensional model is simulated according to the ratio of 1 : 5 with the core of HTR-PM. A multislice helical CT is utilized to acquire the reconstructed cross-sectional images of simulated pebbles, among which special tracer pebbles are designed to indicate pebble flow. Tracer pebbles can be recognized from many other background pebbles because of their heavy kernels that can be resolved in CT images. The detecting principle and design parameters of the system were demonstrated by a verification experiment on an existing CT system in this paper. Algorithms to automatically locate the three-dimensional coordinates of tracer pebbles and to rebuild the trajectory of each tracer pebble were presented and verified. The proposed pebble-detecting and tracking technique described in this paper will be implemented in the near future.


2018 ◽  
Vol 7 (2.8) ◽  
pp. 529 ◽  
Author(s):  
Ch Ramakrishna ◽  
G A.E.Satish Kumar ◽  
P Chandra Sekhar Reddy

This paper presents a band notched WLAN self complementaryultra wide band antenna for wireless applications. The proposed antenna encounters a return loss (RL) less than -10dB for entire ultra wideband frequency range except band notched frequency. This paper proposes a hexagon shape patch, edge feeding, self complementary technique and defective ground structure. The antenna has an overall dimensionof 28.3mm × 40mm × 2mm, builton  substrate FR4 with a relative dielectric permittivity 4.4. And framework is simulated finite element method with help of high frequency structured simulator HFSSv17.2.the proposed antenna achieves a impedance bandwidth of 8.6GHz,  band rejected WLAN frequency range 5.6-6.5 GHz with  vswr is less than 2.


2017 ◽  
Vol 24 (1) ◽  
pp. 73-79
Author(s):  
Md. Moinul Islam ◽  
Mohammad Tariqul Islam ◽  
Mohammad Rashed Iqbal Faruque ◽  
Rabah W. Aldhaheri ◽  
Md. Samsuzzaman

AbstractA compact ultra-wideband (UWB) antenna is presented in this paper with a partial ground plane on epoxy woven glass material. The study is discussed to comprehend the effects of various design parameters with explicit parametric analyses. The overall antenna dimension is 0.22×0.26×0.016 λ. A prototype is made on epoxide woven glass fabric dielectric material of 1.6 mm thickness. The measured results point out that the reported antenna belongs to a wide bandwidth comprehending from 3 GHz to more than 11 GHz with VSWR<2. It has a peak gain of 5.52 dBi, where 3.98 dBi is the average gain. Nearly omnidirectional radiation patterns are observed within the operating frequency bands. A good term exists between simulation and measurement results, which lead the reported antenna to be an appropriate candidate for UWB applications.


Author(s):  
Gaurav Saxena ◽  
Priyanka Jain ◽  
Y. K. Awasthi

Abstract In this paper, a ultra-wideband (UWB) bandpass filter with stopband characteristics is presented using a multi-mode resonator (MMR) technique. An MMR is formed by loading three dumbbell-shaped (Mickey and circular) shunt stubs placed in the center and two symmetrical locations from ports, respectively. Three circular and arrowhead defected ground structures on the ground plane are introduced to achieve UWB bandwidth with a better roll-off rate. The proposed filter exhibits stopband characteristics from 10.8 to 20 GHz with a 0.4 dB return loss. The group delay and roll-off rate of the designed filter are <0.30 ns in the passband and 16 dB/GHz at lower and higher cut-off frequencies, respectively. The dimension of the filter is 0.74λg × 0.67λg mm2 and was fabricated on a cost-effective substrate. All simulated results are verified through the experimental results.


Author(s):  
Pushkraj Tumne ◽  
Vikram Venkatadri ◽  
Santosh Kudtarkar ◽  
Michael Delaus ◽  
Daryl Santos ◽  
...  

Today’s consumer market demands electronics that are smaller, faster and cheaper. To cater to these demands, novel materials, new designs, and new packaging technologies are introduced frequently. Wafer Level Chip Scale Package (WLCSP) is one of the emerging package technologies that have the key advantages of reduced cost and smaller footprint. The portable consumer electronics are frequently dropped; hence the emphasis of reliability is shifting towards study of effects of mechanical shock loading increasingly. Mechanical loading typically induces brittle fractures (also known as intermetallic failures) between the solder bumps and bond pads at the silicon die side. This type of failure mechanism is typically characterized by the board level drop test. WLCSP is a variant of the flip-chip interconnection technique. In WLCSPs, the active side of the die is inverted and connected to the PCB by solder balls. The size of these solder balls is typically large enough (300μm pre-reflow for 0.5mm pitch and 250μm pre-reflow for 0.4mm pitch) to avoid use of underfill that is required for the flip-chip interconnects. Several variations are incorporated in the package design parameters to meet the performance, reliability, and footprint requirements of the package assembly. The design parameters investigated in this effort are solder ball compositions with different Silver (Ag) content, backside lamination with different thickness, WLCSP type –Direct and Re-Distribution Layer (RDL), bond pad thickness, and sputtered versus electroplated Under Bump Metallurgy (UBM) deposition methods for 8×8, 9×9, and 10×10 array sizes. The test vehicles built using these design parameters were drop tested using JEDEC recommended test boards and conditions as per JESD22-B11. Cross sectional analysis was used to identify, confirm, and classify the intermetallic, and bulk solder failures. The objective of this research was to quantify the effects and interactions of WLCSP design parameters through drop test. The drop test data was collected and treated as a right censored data. Further, it was analyzed by fitting empirical distributions using the grouped and un-grouped data approach. Data analysis showed that design parameters had a significant effect on the drop performance and played a vital role in influencing the package reliability.


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