scholarly journals Synthesis and Characterization of Polyaniline-Based Composites for Electromagnetic Compatibility of Electronic Devices

Electronics ◽  
2020 ◽  
Vol 9 (5) ◽  
pp. 734
Author(s):  
Kamil G. Gareev ◽  
Vladislava S. Bagrets ◽  
Vladimir A. Golubkov ◽  
Maria G. Ivanitsa ◽  
Ivan K. Khmelnitskiy ◽  
...  
Keyword(s):  
Absorption Coefficient ◽  
Electromagnetic Compatibility ◽  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Composite Films ◽  
Circuit Boards ◽  
Pani Composite ◽  
Bending Radius ◽  
Surface Morphologies

Polyaniline-based composites designed to ensure the electromagnetic compatibility of electronic devices were obtained. The surface morphologies of the obtained films were studied using optical and electron microscopy. The electrical resistivity of polyaniline (PANI) films were measured at various thicknesses. For films of various compositions and various thicknesses, the frequency dependencies of the complex dielectric permittivity, in the range of 100–2000 kHz, as well as the electromagnetic radiation (EMR) absorption coefficient in the frequency range 0.05–2 GHz were obtained. It was found that flexible gelatin-PANI composite films with a thickness of 200–400 μm, a bending radius of about 5 cm, and a real part of complex permittivity of not more than 10 provide an EMR absorption coefficient of up to 5 dB without introducing additional EMR absorbing or reflecting fillers. The resulting gelatin-PANI composite films do not possess a through electrical conductivity and can be applied directly to the surface of protected printed circuit boards.

Advanced Build-up Materials and Processes for Packages with Fine Line and Space

2014 ◽  
Vol 2014 (1) ◽  
pp. 000444-000447 ◽  
Author(s):  
Yoshio Nishimura ◽  
Hirohisa Narahashi ◽  
Shigeo Nakamura ◽  
Tadahiko Yokota
Keyword(s):  
Printed Circuit Boards ◽  
Coefficient Of Thermal Expansion ◽  
High Reliability ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Additive Process ◽  
Fine Line ◽  
Printed Circuit ◽  
Low Dielectric ◽  
Line Space

Printed circuit boards manufactured by a semi-additive process are widely used for packaging substrates. Along with increasing demands of downsizing electronic devices with high functionality, packaging substrates installed with semiconductors in such devices are strongly required to be miniaturized with high density of circuit wirings. We report our insulation build-up materials and processes for advanced packages with fine line/space and high reliability. The insulation materials we developed show low coefficient of thermal expansion (CTE), low dielectric loss tangent and good thinner insulation reliability. They can produce fine line and space (FLS) under 10μm pitch by a semi-additive process.

Modular Printed Circuit Boards for Broadband Characterization of Nanoelectronic Quantum Devices

2016 ◽  
Vol 65 (8) ◽  
pp. 1827-1835 ◽  
Author(s):  
Marco Lorenzo Valerio Tagliaferri ◽  
Alessandro Crippa ◽  
Simone Cocco ◽  
Marco De Michielis ◽  
Marco Fanciulli ◽  
...  
Keyword(s):  
Printed Circuit Boards ◽  
Circuit Boards ◽  
Quantum Devices ◽  
Printed Circuit

Time-Dependent Rheological Behavior of Fluids For Electronics Packaging

2005 ◽  
Vol 127 (4) ◽  
pp. 370-374 ◽  
Author(s):  
X. B. Chen
Keyword(s):  
Rheological Behavior ◽  
Printed Circuit Boards ◽  
Flow Behavior ◽  
Electronics Packaging ◽  
Time Dependent ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Fluid Behavior ◽  
Surface Mounting

In electronics packaging, one of the key processes is dispensing fluid materials, such as adhesive, epoxy, encapsulant, onto substrates or printed circuit boards for the purpose of surface mounting or encapsulation. In order to precisely control the dispensing process, the understanding and characterization of the flow behavior of the fluid being dispensed is very important, as the behavior can have a significant influence on the dispensing process. However, this task has proven to be very challenging due to the fact that the fluids for electronics packaging usually exhibit the time-dependent rheological behavior, which has not been well defined in literature. In the paper a study on the characterization of the time-dependent rheological behavior of the fluids for electronics packaging is presented. In particular, a model is developed based on structural theory and then applied to the characterization of the decay and recovery of fluid behavior, which happen in the dispensing process due to the interruption of process. Experiments are carried out to verify the effectiveness of the model developed.

Development of a versatile analytical protocol for the comprehensive determination of the elemental composition of smartphone compartments on the example of printed circuit boards

2018 ◽  
Vol 10 (31) ◽  
pp. 3864-3871 ◽  
Author(s):  
B. Bookhagen ◽  
W. Obermaier ◽  
C. Opper ◽  
C. Koeberl ◽  
T. Hofmann ◽  
...  
Keyword(s):  
Elemental Composition ◽  
Printed Circuit Boards ◽  
Electronic Devices ◽  
Circuit Boards ◽  
Printed Circuit ◽  
Comprehensive Method ◽  
Analytical Protocol ◽  
Comprehensive Determination

A comprehensive method for the determination of metals in electronic devices was developed and tested on smartphones.

Characterization of Laser Cleaning of Copper for Soldering Processes

2000 ◽  
Vol 123 (3) ◽  
pp. 521-527 ◽  
Author(s):  
J. M. Lee ◽  
K. G. Watkins ◽  
W. M. Steen
Keyword(s):  
Laser Pulse ◽  
Printed Circuit Boards ◽  
Acoustic Monitoring ◽  
Mechanical Effect ◽  
Laser Cleaning ◽  
Process Window ◽  
Circuit Boards ◽  
Copper Surfaces ◽  
532 Nm

The laser cleaning of copper surfaces with a Nd:YAG Q-switched laser pulse for the improvement of solder quality on printed circuit boards (PCBs) has been monitored and characterized by sensing the acoustic emission during the process and one-dimensional mathematical model analysis. It was found that selective removal of copper oxides from the surface was achieved by the laser operation, which was described theoretically by the model and was confirmed experimentally by the acoustic monitoring. The acoustic monitoring provided not only threshold laser fluence and optimal process window for the cleaning of copper but also the clear possibility for real-time surface monitoring of the process. Different features at the two laser wavelengths used (1064 nm and 532 nm) were observed in the surface morphology, i.e., the laser pulse with 532 nm wavelength produced a lightly sputtered wide area around the laser crater. From the theoretical and experimental investigation of laser cleaning mechanisms at different wavelengths, it was found that the mechanical effect induced by the intense shock waves was much more dominant at 532 nm wavelength than at 1064 nm.

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