scholarly journals Novel Low-Cost Power Divider for 5.8 GHz

Electronics ◽  
2020 ◽  
Vol 9 (4) ◽  
pp. 699
Author(s):  
Tso-Jung Chang ◽  
Krishna Pande ◽  
Heng-Tung Hsu
Keyword(s):  
Transmission Lines ◽  
Insertion Loss ◽  
Printed Circuit Board ◽  
Characteristic Impedance ◽  
Past Research ◽  
Size Reduction ◽  
Circuit Board ◽  
Superior Performance ◽  
Published Data ◽  
Coupled Line

This paper presents a new capacitive lump-free structure for power dividers using a printed-circuit board, while maintaining size reduction and physical isolation. The conventional lumped capacitors approach has self-resonant problem and cause worse S 22 and isolation at high frequencies. To overcome such technical issues, the coupled-line structures were introduced in the isolation network. After optimizing the distance between output ports and position of the isolation network, tuning the characteristic impedance and electrical length of transmission lines can decide the value of the lump resistor. The first example was designed at 1 GHz, and the resistor in the isolation network was 330 ohm, having 0.2-dB insertion loss and 19% total bandwidth, while maintaining 80-degree distance between split ports and 180-degree total length, providing 21% to 67% size reduction. The second example was designed at 5.8 GHz, which was five times greater than in past research, using an RO4003C substrate while maintaining a 0.24-dB insertion loss, 17% total bandwidth, and 0.06 dB amplitude imbalance, which was only 0.01 dB more than in recent research. Such superior performance is mainly attributed to the coupled transmission lines in the isolation network featuring a capacitive lump-free isolation network. Our data indicate that amplitude imbalance, bandwidth, and miniaturization are superior to any published data.

Miniaturized branch-line coupler based on slow-wave microstrip lines

2018 ◽  
Vol 10 (10) ◽  
pp. 1103-1106 ◽  
Author(s):  
H. Alhalabi ◽  
H. Issa ◽  
E. Pistono ◽  
D. Kaddour ◽  
F. Podevin ◽  
...  
Keyword(s):  
Slow Wave ◽  
Transmission Lines ◽  
Insertion Loss ◽  
Return Loss ◽  
Printed Circuit Board ◽  
Circuit Board ◽  
Wave Effect ◽  
Branch Line ◽  
Printed Circuit ◽  
Microstrip Lines

AbstractThis paper presents a miniaturized 3-dB branch-line coupler based on slow-wave microstrip transmission lines. The miniaturized coupler operating at 2.45 GHz is designed and implemented on a double-layer printed circuit board substrate with blind metallic vias embedded in the lower substrate layer providing the slow-wave effect. Based on this concept, a 43% size miniaturization is achieved as compared with a classical microstrip branch-line coupler prototype. The measured S parameters present a return loss of 25.5 dB and an average insertion loss equal to 0.05 dB at the operating frequency.

scholarly journals A compact low-noise frontend for interleaved Rx/Tx arrays at K-/Ka-Band

2021 ◽  
pp. 1-7
Author(s):  
Anton Sieganschin ◽  
Thomas Jaschke ◽  
Arne F. Jacob
Keyword(s):  
Insertion Loss ◽  
Printed Circuit Board ◽  
Noise Figure ◽  
Low Noise ◽  
Single Band ◽  
Circuit Board ◽  
Dual Band ◽  
Ka Band ◽  
Compression Properties ◽  
The Individual

Abstract This contribution deals with a frontend for interleaved receive (Rx)-/transmit (Tx)-integrated phased arrays at K-/Ka-band. The circuit is realized in printed circuit board technology and feeds dual-band Rx/Tx- and single-band Tx-antenna elements. The dual-band element feed is composed of a substrate-integrated waveguide (SIW) diplexer with low insertion loss, a low-noise amplifier (LNA), a bandpass filter, and several passive transitions. The compression properties of the LNA are identified through two-tone measurements. The results dictate the maximum allowable output power of the power amplifier. The single band feed consists of a SIW with several transitions. Simulation and measurement results of the individual components are presented. The frontend is assembled and measured. It exhibits an Rx noise figure of 2 dB, a Tx insertion loss of ~ 2.9 dB, and an Rx/Tx-isolation of 70 dB. The setup represents the unit cell of a full array and thus complies with the required half-wave spacing at both Rx and Tx.

scholarly journals A Novel Synthetization Approach for Multi Coupled Line Section Impedance Transformers in Wideband Applications

2022 ◽  
Vol 12 (2) ◽  
pp. 875
Author(s):  
Nan Zhang ◽  
Xiaolong Wang ◽  
Chunxi Bao ◽  
Bin Wu ◽  
Chun-Ping Chen ◽  
...  
Keyword(s):  
Transmission Lines ◽  
Return Loss ◽  
Circuit Simulation ◽  
Characteristic Impedance ◽  
Fractional Bandwidth ◽  
Coupled Line ◽  
Variable Parameters ◽  
Line Section ◽  
Original Topology ◽  
Impedance Parameters

In this paper, a novel synthetization approach is proposed for filter-integrated wideband impedance transformers (ITs). The original topology consists of N cascaded coupled line sections (CLSs) with 2N characteristic impedance parameters. By analyzing these characteristic impedances, a Chebyshev response can be derived to consume N + 2 design conditions. To optimize the left N − 2 variable parameters, CLSs were newly substituted by transmission lines (TLs) to consume the remaining variable parameters and simplify the circuit topology. Therefore, there are totally 2N − N − 2 substituting possibilities. To verify the proposed approach, 25 cases are listed under the condition of N = 5, and 7 selected cases are compared and discussed in detail. Finally, a 75–50 Ω IT with 100% fractional bandwidth and 20 dB bandpass return loss (RL) is designed and fabricated. The measured results meet the circuit simulation and the EM simulation accurately.

Electrical Characterization of Low-Profile Copper Foil for Reduced Surface Roughness Loss

2016 ◽  
Vol 2016 (1) ◽  
pp. 000358-000363 ◽  
Author(s):  
Qianfei Su ◽  
A. Ege Engin ◽  
Jerry Aguirre
Keyword(s):  
Surface Roughness ◽  
Cross Sections ◽  
Transmission Lines ◽  
High Frequency ◽  
Printed Circuit Board ◽  
Electrical Characterization ◽  
Cavity Resonator ◽  
Circuit Board ◽  
Low Profile ◽  
Measure Surface Roughness

Abstract Signal attenuation in transmission lines is a major issue for reliable transmission in high frequency range. Knowledge of the electrical parameters of printed circuit board (PCB), including dielectric constant and loss tangent, is critical. Moreover, surface roughness has a great effect on loss in high frequency. This paper demonstrates an effective simulation fitting method for electrical material characterization. Cavity resonator is chosen as the circuit for characterization. A methodology is presented to measure surface roughness from cross sections, and compared with values extracted from resonator measurements. Several materials and copper foils treatments, including low-profile, are analyzed in this paper.

scholarly journals Design Impedance Mismatch Physical Unclonable Functions for IoT Security

2017 ◽  
Vol 2017 ◽  
pp. 1-8 ◽  
Author(s):  
Xiaomin Zheng ◽  
Yuejun Zhang ◽  
Jiaweng Zhang ◽  
Wenqi Hu
Keyword(s):  
Transmission Line ◽  
Printed Circuit Board ◽  
Signal Transmission ◽  
Characteristic Impedance ◽  
Circuit Board ◽  
Physical Factors ◽  
Current Feedback ◽  
Impedance Mismatch ◽  
Feedback Amplifier ◽  
Current Feedback Amplifier

We propose a new design, Physical Unclonable Function (PUF) scheme, for the Internet of Things (IoT), which has been suffering from multiple-level security threats. As more and more objects interconnect on IoT networks, the identity of each thing is very important. To authenticate each object, we design an impedance mismatch PUF, which exploits random physical factors of the transmission line to generate a security unique private key. The characteristic impedance of the transmission line and signal transmission theory of the printed circuit board (PCB) are also analyzed in detail. To improve the reliability, current feedback amplifier (CFA) method is applied on the PUF. Finally, the proposed scheme is implemented and tested. The measure results show that impedance mismatch PUF provides better unpredictability and randomness.

Crosstalk Simulation Based on Full Wave S-Parameter Extraction Method between High-Speed Signals

2012 ◽  
Vol 433-440 ◽  
pp. 3514-3520
Author(s):  
Hong Tao Sun ◽  
Shu Guo Xie ◽  
Yan Liu ◽  
Bang Jun Chen
Keyword(s):  
Transmission Lines ◽  
High Speed ◽  
Printed Circuit Board ◽  
Simulation Method ◽  
Parameter Extraction ◽  
Circuit Board ◽  
Frequency Domain Method ◽  
Coupling Mechanism ◽  
Full Wave ◽  
S Parameter

Crosstalk between high speed parallel bus signals is one of the most important signal integrity(SI) issues. In this article, a crosstalk simulation method based on full-wave scattering parameters extraction for transmission lines is researched. First, the coupling mechanism between transmission lines is analyzed using S-Parameter network theory and a fast frequency-domain method for crosstalk calculation is introduced. Then based on this method, some basic rules of crosstalk are studied in details and the method is validated by simulation results which agree well with those of RLGC model. At the end of this paper, a practical crosstalk simulation example between high speed data bus signals on a 8-layered printed circuit board is demonstrated step by step.

scholarly journals Reconfigurable Negative Group Delay Circuit with a Low Insertion Loss Using a Coupled Line

2020 ◽  
Vol 20 (1) ◽  
pp. 73-79
Author(s):  
Girdhari Chaudhary ◽  
Yongchae Jeong
Keyword(s):  
Insertion Loss ◽  
Group Delay ◽  
Characteristic Impedance ◽  
Center Frequency ◽  
Pin Diode ◽  
Negative Group ◽  
Coupled Line ◽  
Coupled Lines ◽  
Low Insertion Loss ◽  
Negative Group Delay

This paper presents a design of a transmissive-type, low insertion loss (IL) negative group delay (NGD) circuit with a reconfigurable NGD. The proposed circuit consists of a series transmission lines (TLs) and shunt short-circuited coupled lines where an isolation port is terminated with a parasitic compensated PIN diode. Analytical design equations are derived to obtain the circuit parameters for the predefined NGD and IL. The low IL can be achieved because of the very high characteristic impedance of the short-circuited coupled lines. The TL terminated with a PIN diode is used to achieve the constant center frequency of reconfigurable NGD circuit. For experimental validation, the NGD circuit is designed and fabricated at a center frequency (<i>f</i><sub>0</sub>) of 2.14 GHz. In the measurement, the NGD varies from -0.5 ns to -2 ns with an IL variation of 2.08 to 3.60 dB at <i>f</i><sub>0</sub> = 2.14 GHz. The NGD bandwidth (bandwidth of GD less than 0 ns) varies from 90 MHz to 50 MHz. The minimum input/output return losses are higher than 10 dB for the overall tuning range.

Experimental and numerical investigations of the vibration reliability of BGA and LGA solder configurations and SAC105 and 63Sn37Pb solder alloys

2019 ◽  
Vol 31 (2) ◽  
pp. 77-84 ◽  
Author(s):  
Mohammad Gharaibeh ◽  
Aaron J. Stewart ◽  
Quang T. Su ◽  
James M. Pitarresi
Keyword(s):  
Printed Circuit Board ◽  
Compound Layer ◽  
Circuit Board ◽  
Published Data ◽  
Intermetallic Compound Layer ◽  
Solder Alloys ◽  
Content Type ◽  
Vibration Experiment ◽  
Vibration Reliability ◽  
Reliability Performance

Purpose This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder alloys, in vibration loading conditions. Design/methodology/approach Reliability tests were conducted using a sine dwell with resonance tracking vibration experiment. Finite element simulations were performed to help in understanding the observed failure trends. Findings Reliability results showed that the tin-lead solders out-perform lead-free solders in vibrations loading. Additionally, the LGA solder type could provide a better vibration reliability performance than BGA solders. Failure analysis results showed that in LGAs, the crack is initiated at the printed circuit board side and at the component side in BGAs. In both types, the crack is propagated throughout in the intermetallic compound layer. Originality/value In literature, there is a lack of published data in the comparison between LGA and BGA reliability performance in vibration loadings. This paper provides useful insights in the vibration reliability behavior of the two common solder joint types.

Signal Propagation and Multiplexing Challenges in Electronic Textiles

2002 ◽  
Vol 736 ◽  
Author(s):  
J. F. Muth ◽  
E. Grant ◽  
K. A. Luthy ◽  
L. S. Mattos ◽  
J. C. Braly ◽  
...  
Keyword(s):  
Optical Fibers ◽  
Transmission Lines ◽  
Large Scale ◽  
Printed Circuit Board ◽  
Signal Propagation ◽  
Circuit Board ◽  
Electrical Performance ◽  
Electronic Textiles ◽  
Electrical Transmission ◽  
Distributed Sensors

ABSTRACTWeaving, knitting or placing electronic circuits within a textile matrix offer exciting possibilities for large-scale conformal circuits where the circuit dimensions can be measured on the scale of yards instead of inches. However, compared with conventional printed circuit board circuits, the textile manufacturing process and the electrical/mechanical properties of the fibers used in making the textile place unusual constraints on the electrical performance of textile circuits. In the case of distributed sensors connected via an electronic fabric, signal attenuation and the ability to form reliable interconnections are major challenges. To explore these challenges we have woven and knitted a variety of electrical transmission lines and optical fibers in fabrics to analyze their performance. The formation of interconnects and disconnects between conductors woven in textiles is also discussed, and a passive acoustic array is described as a possible electronic textile application.

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