scholarly journals A Study of the Sulfidation Behavior on Palladium-Coated Copper Wire with a Flash-Gold Layer (PCA) after Wire Bonding

Electronics ◽  
2019 ◽  
Vol 8 (7) ◽  
pp. 792
Author(s):  
Chen ◽  
Hung ◽  
Chang
Keyword(s):  
Copper Wire ◽  
Gold Layer ◽  
Elemental Distribution ◽  
Alloying Effect ◽  
Enhanced Resistance ◽  
Fine Wire ◽  
Ball Bonding ◽  
Different Shapes ◽  
Oxidation Resistant ◽  
Coated Layer

Palladium-coated copper wire with a flash-gold layer (PCA) is an oxidation-resistant fine wire that simultaneously has the properties of palladium-coated copper wire (PCC) and gold-coated copper wire. This research used an extreme sulfidation test to compare corrosion resistance between the PCC and PCA wires. In addition to closely examining the morphology of the wires, the internal matrix after the sulfidation test is also discussed. In doing so, the PCA wire was bonded onto the aluminum pads and the sulfidation test was conducted. Then, we observed its morphology and elemental distribution and found that the flash-gold layer of the PCA wire effectively enhanced resistance to sulfidation corrosion. Because the copper ball had an alloying effect on the ball bonding, it produced different shapes of sulfide after the sulfidation test. The degree of corrosion on the wedge bond was different because of the presence or absence of the coated layer. In contrast, the flash-gold layer of the PCA wire enhanced the bonding force and retained low resistance characteristics after the sulfidation test.

Direct Palladium-Gold on copper as a Surface Finish for next generation Packages.

2013 ◽  
Vol 2013 (DPC) ◽  
pp. 001145-001184
Author(s):  
Mustafa Ozkok ◽  
Sven Lamprecht ◽  
Gustavo Ramos ◽  
Arnd Kilian
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Environmental Issues ◽  
Wire Bonding ◽  
Gold Layer ◽  
Test Results ◽  
Fine Line ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Bond Tests

A new surface finish is entering the market. The need for this finish comes from needs for new assembly technologies like copper wire bonding or chip assembly by thermo compression bond. Furthermore Nickel an element, which is the base of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element as of several disadvantages, such as for high frequency applications, for environmental issues or for fine line applications were a 5 μm Ni Layer is just simply too thick. All these concerns supporting the introduction of a new surface finish, a direct EP and direct EPAG finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint of view. In addition, the mentioned technological handicaps of nickel based finishes could be solved by applying a revolutionary surface finish – A Direct Palladium with an optional gold layer. The direct deposition of palladium on copper with an optional gold layer does have further technological, environmental and economical advantages. The suggested paper will describe and discuss the advantages and chances using this new surface finish, as well as demonstrate soldering on various wire bond tests on the Direct EP and EPAG finishes as well as soldering test results.

Numerical Analysis of the Bali. Forming Process in Copper Ball Bonding

1991 ◽  
Vol 226 ◽  
Author(s):  
Fang Iiongyuan ◽  
Oian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Temperature Field ◽  
Numerical Analysis ◽  
Displacement Field ◽  
Copper Wire ◽  
Regular Pattern ◽  
Forming Process ◽  
Ball Bonding ◽  
Ultrafine Copper

AbstractIn this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical analysis. By means of calculation of temperature field, speed field and displacement field for ultrafine copper wire under a miniarc, the regular pattern of copper wire ball formation has been clarified. In this paper, the calculating result of displacement field has also been tested and verified.

The Process Optimization of the First Ball Bonding for Copper Wire

2012 ◽  
Vol 503-504 ◽  
pp. 905-908
Author(s):  
Wei Zhang ◽  
Kang Wang ◽  
Chun Qing Wang
Keyword(s):  
Electrical Property ◽  
Process Optimization ◽  
Contact Force ◽  
Copper Wire ◽  
Gold Wire ◽  
Economic Advantage ◽  
Input Energy ◽  
Metallization Layer ◽  
Copper Wire Bonding ◽  
Ball Bonding

Copper wire bonding has obtained prevalent owning to its economic advantage and superior electrical property. However, the replacement of gold wire with copper wire introduces hardness related issues as copper is much harder than gold. This article reports investigations of the process optimization of ball bonding for 1.8mil copper wire. The results showed that the suitable ranges of the three key parameters were: contact force was 100~120gf, bond time was 15~25ms, and bond power was 100~110dac. When the input energy was too low, it was hard to get effective bonding. However, excessive input energy would cause chip crater and serious extrusion of metallization layer.

Advanced Surface Finishes for Ceramic Electronics for Soldering, Conductive Adhesive, Aluminum- , Gold-, and Copper Wire Bonding.

2013 ◽  
Vol 2013 (CICMT) ◽  
pp. 000257-000260
Author(s):  
Maren Bruder ◽  
Guenter Heinz ◽  
Mustafa Oezkoek
Keyword(s):  
Surface Finish ◽  
Copper Wire ◽  
Economic Benefits ◽  
Wire Bonding ◽  
Gold Layer ◽  
Ceramic Substrates ◽  
Main Layer ◽  
Surface Finishes ◽  
Copper Wire Bonding ◽  
Assembly Technology

Surface finishes for ceramic electronics are an important feature. . The suitable surface finish allows the appropriate assembly technology to be performed on the ceramic substrate. The paper will present the possible surface finish options for ceramic substrates and include the advantages and challenges of each surface finish. Furthermore it will show the potential of a new surface finish called “Direct EPAG”. The demand for these new finishes is based on needs for new assembly technologies like copper wire bonding and for high frequency applications. Furthermore Nickel which the main layer of many surface finishes like ENIG or ENEPIG, is more and more regarded as an unpleasant element due to several disadvantages. All these concerns are supporting the introduction of a new surface finish called “direct EPAG” (Electroless Palladium, Autocatalytic Gold) finish. In particular, its suitability for copper wire bonding and its fine line capability makes it very attractive from a cost standpoint. In addition, the mentioned technological drawbacks of nickel based finishes could be solved by applying a revolutionary surface finish: “direct palladium with an optional direct gold layer on copper”. The direct deposition of palladium on copper with an optional gold layer does have a number of technological, environmental and economic benefits. The suggested paper will describe and discuss the advantages and challenges using this new surface finish. It will also exhibit the results of various soldering and wire bond tests on the EPAG finish.

The Microelectronic Wire Bond: Past, Present, and Future

2010 ◽  
Vol 2010 (1) ◽  
pp. 000462-000469
Author(s):  
Harry K. Charles
Keyword(s):  
Copper Wire ◽  
Low Cost ◽  
Bond Formation ◽  
Wire Bonding ◽  
Testing Methods ◽  
Wire Bond ◽  
Fine Pitch ◽  
Wire Bonds ◽  
Ball Bonding

Since its very inception, the microelectronic wire bond has been the dominate form of first-level interconnection (chip to package or substrate). Wire bonds account for over 80% of first-level chip interconnections made by the microelectronic industry each year. Wire bonding is reliable, flexible, and low cost when compared to other forms of first-level interconnections. In this article a brief discussion of wire bonding is presented along with bond formation fundamentals. Aspects of wire bond reliability will be explored in conjunction with methods of wire bond testing. Particular attention is given to fine pitch bonding, bonding to stacked die, higher frequency bonding, ball bonding with copper wire, and advanced bond testing methods.

Cratering on Thermosonic Copper Wire Ball Bonding

2002 ◽  
Vol 11 (3) ◽  
pp. 283-287 ◽  
Author(s):  
Tan Chee Wei ◽  
Abdul Razak Daud
Keyword(s):  
Copper Wire ◽  
Ball Bonding

Advances in Wire Bonding Technology for Different Bonding Wire Material

2015 ◽  
Vol 2015 (1) ◽  
pp. 000406-000412 ◽  
Author(s):  
Ivy Qin ◽  
Aashish Shah ◽  
Hui Xu ◽  
Bob Chylak ◽  
Nelson Wong
Keyword(s):  
Flip Chip ◽  
Technology Development ◽  
Copper Wire ◽  
Low Cost ◽  
Wire Bonding ◽  
Bonding Wire ◽  
Wire Material ◽  
Ball Bonding ◽  
Bonding Technology ◽  
The Right

With all the advances in 2.5D and 3D packaging, wire bonding is still the most popular interconnect technology and the workhorse of the industry. Wire bonding technology has been the lower cost solution comparing to flip chip. Wire bonding package cost is much reduced with the introduction of Copper wire bonding. Technology development and innovation in wire bonding provides new packaging solutions that improves performance and reduces cost. This paper reviews the recent innovations in ball bonding technology to provide optimized ball bonding solutions targeted for different bonding wire material. It examines the different challenges for the alternative wire types including Cu wire, Pd coated, and AuPd coated Cu wire and Ag Alloy wire. We will discuss key development in ball bonding equipment, process and material to overcome the challenges and provide robust low cost solutions. The advantages of each wire type are outlined, and guidelines to select the right bonding wire type per application requirements are provided.

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