Numerical Analysis of the Bali. Forming Process in Copper Ball Bonding

1991 ◽  
Vol 226 ◽  
Author(s):  
Fang Iiongyuan ◽  
Oian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Temperature Field ◽  
Numerical Analysis ◽  
Displacement Field ◽  
Copper Wire ◽  
Regular Pattern ◽  
Forming Process ◽  
Ball Bonding ◽  
Ultrafine Copper

AbstractIn this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical analysis. By means of calculation of temperature field, speed field and displacement field for ultrafine copper wire under a miniarc, the regular pattern of copper wire ball formation has been clarified. In this paper, the calculating result of displacement field has also been tested and verified.

Numerical Analysis of the Ball Forming Process in Copper Ball Bonding

1991 ◽  
Vol 225 ◽  
Author(s):  
Fang Hongyuan ◽  
Qian Yiyu ◽  
Jiang Yihong
Keyword(s):  
Temperature Field ◽  
Numerical Analysis ◽  
Displacement Field ◽  
Copper Wire ◽  
Regular Pattern ◽  
Forming Process ◽  
Ball Bonding ◽  
Ultrafine Copper

ABSTRACTIn this paper, the forming process of copper wire ball in copper ball bonding has been studied by numerical analysis. By means of calculation of temperature field, speed field and displacement field for ultrafine copper wire under a miniarc, the regular pattern of copper wire ball formation has been clarified. In this paper, the calculating result of displacement field has also been tested and verified.

Numerical Analysis of the Ball Forming Process in Copper Ball Bonding

1993 ◽  
Vol 5 (3) ◽  
pp. 50-52
Author(s):  
F. Hongyuan ◽  
Q. Yiyu ◽  
J. Yihong
Keyword(s):  
Numerical Analysis ◽  
Forming Process ◽  
Ball Bonding

Analysis on Temperature Field of Work-Piece during Cross Wedge Rolling

2011 ◽  
Vol 230-232 ◽  
pp. 352-356
Author(s):  
Wen Ke Liu ◽  
Kang Sheng Zhang ◽  
Zheng Huan Hu
Keyword(s):  
Finite Element ◽  
Temperature Field ◽  
Metal Flow ◽  
Work Piece ◽  
Contact Deformation ◽  
Cross Wedge Rolling ◽  
Forming Process ◽  
Rigid Plastic ◽  
Finite Element Software ◽  
Deform 3D

Based on the rigid-plastic deformation finite element method and the heat transfer theories, the forming process of cross wedge rolling was simulated with the finite element software DEFORM-3D. The temperature field of the rolled piece during the forming process was analyzed. The results show that the temperature gradient in the outer of the work-piece is sometimes very large and temperature near the contact deformation zone is the lowest while temperature near the center of the rolled-piece keeps relatively stable and even rises slightly. Research results provide a basis for further study on metal flow and accurate shaping of work-piece during cross wedge rolling.

scholarly journals The influence of gelatine on the corrosion behaviour of cold worked copper wire in alkaline media

2006 ◽  
Vol 42 (1) ◽  
pp. 33-43 ◽  
Author(s):  
Svetlana Ivanov ◽  
Mirjana Rajcic-Vujasinovic ◽  
Zoran Stevic
Keyword(s):  
Corrosion Rate ◽  
Corrosion Behaviour ◽  
Copper Wire ◽  
Positive Influence ◽  
Open Circuit ◽  
Alkaline Media ◽  
Forming Process ◽  
Deformation Degree ◽  
Cold Worked ◽  
Potentiodynamic Method

Copper wire obtained by dip-forming process was cold worked to the deformation degrees of 83, 87, 91, 95 and 99 %. Electrochemical potentiodynamic method was used to investigate corrosion behavior of these wires in aqueous solutions of Na2CO3 (1 mol/dm3). Open circuit potentials as well as peak potentials are given as a function of deformation degree in Na2CO3 without and with addition of gelatine in concentration between 0.1 and 0.5 g/l. It was found that the addition of gelatine does not change the mechanism of the process, but influences on current density. Small concentrations of gelatine (0.1 g/l or less) have positive influence on the corrosion protection of copper in alkaline solution, but the addition of gelatine in concentration 0.5 g/l causes the increasing of its corrosion rate.

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