scholarly journals A Semi-Floating Gate Memory with Tensile Stress for Enhanced Performance

Electronics ◽  
2019 ◽  
Vol 8 (4) ◽  
pp. 414
Author(s):  
Yuan ◽  
Jiang ◽  
Sun ◽  
Chen ◽  
Zhu ◽  
...  

With the continuous scaling down of devices, traditional one-transistor one-capacitor dynamic random access memory (1T-1C DRAM) has encountered great challenges originated from the large-volume capacitor and high leakage current. A semi-floating gate transistor has been proposed as a capacitor-less memory with ultrafast speed and silicon-compatible technology. In this work, a U-shaped semi-floating gate memory with strain technology has been demonstrated through TCAD simulation. Ultra-high operation speed on a timescale of 5 ns at low operation voltages (≤ 2.0 V) has been obtained. And the tensile stress induced in its channel region by using contact etch stop layer (Si3N4 capper layer) was found to significantly improve the drain current by 12.07%. Furthermore, this device demonstrated a favorable retention performance with a retention time over 1 s, and its immunity to disturbance from bit-line has also been investigated that could maintain data under the continuous worst writing disturbance operation over 10 ms.

2006 ◽  
Vol 45 (4B) ◽  
pp. 3170-3175
Author(s):  
Bogdan Govoreanu ◽  
Robin Degraeve ◽  
Thomas Kauerauf ◽  
Wim Magnus ◽  
Dirk Wellekens ◽  
...  

Electronics ◽  
2019 ◽  
Vol 8 (10) ◽  
pp. 1198
Author(s):  
Han Li ◽  
Chen Wang ◽  
Lin Chen ◽  
Hao Zhu ◽  
Qingqing Sun

Over the past decade, the dimensional scaling of semiconductor electronic devices has been facing fundamental and physical challenges, and there is currently an urgent need to increase the ability of dynamic random-access memory (DRAM). A semi-floating gate (SFG) transistor has been proposed as a capacitor-less memory with faster speed and higher density as compared with the conventional one-transistor one-capacitor (1T1C) DRAM technology. The integration of SFG-based memory on the silicon-on-insulator (SOI) substrate has been demonstrated in this work by using the Sentaurus Technology Computer-Aided Design (TCAD) simulation. An enhancement in retention characteristics, anti-disturbance ability, and fast writing capability, have been illustrated. The device exhibits a low operation voltage, a large threshold voltage window of ~3 V, and an ultra-fast writing of 4 ns. In addition, the SOI-based memory has shown a much-improved anti-irradiation capability compared to the devices based on bulk silicon, which makes it much more attractive in broader applications.


Science ◽  
2013 ◽  
Vol 341 (6146) ◽  
pp. 640-643 ◽  
Author(s):  
Peng-Fei Wang ◽  
Xi Lin ◽  
Lei Liu ◽  
Qing-Qing Sun ◽  
Peng Zhou ◽  
...  

As the semiconductor devices of integrated circuits approach the physical limitations of scaling, alternative transistor and memory designs are needed to achieve improvements in speed, density, and power consumption. We report on a transistor that uses an embedded tunneling field-effect transistor for charging and discharging the semi-floating gate. This transistor operates at low voltages (≤2.0 volts), with a large threshold voltage window of 3.1 volts, and can achieve ultra–high-speed writing operations (on time scales of ~1 nanosecond). A linear dependence of drain current on light intensity was observed when the transistor was exposed to light, so possible applications include image sensing with high density and performance.


2011 ◽  
Vol 383-390 ◽  
pp. 3178-3182
Author(s):  
Yung Yu Chen ◽  
Chih Ren Hsieh ◽  
Fang Yu Chiu

Channel fluorine implantation (CFI) has been successfully integrated with silicon nitride contact etch stop layer (SiN CESL) to further improve the channel hot electron stress (CHES) and constant voltage stress (CVS) reliability of n-channel metal-oxide-semiconductor field-effect-transistor with HfO2/SiON gate stack. Although the improvement of transconductance, drain current and subthreshold swing due to the fluorine passivation is screened out by the effect of uniaxial tensile strain, the result clearly demonstrates that integrating the CFI process in the SiN CESL-strained device can further suppress the CHES- and CVS-induced threshold voltage shift.


2008 ◽  
Vol 48 (11-12) ◽  
pp. 1791-1794 ◽  
Author(s):  
Chia-Wei Hsu ◽  
Yean-Kuen Fang ◽  
Wen-Kuan Yeh ◽  
Chien-Ting Lin

2009 ◽  
Vol 48 (4) ◽  
pp. 04C153 ◽  
Author(s):  
Kosuke Ohara ◽  
Yukiharu Uraoka ◽  
Takashi Fuyuki ◽  
Ichiro Yamashita ◽  
Toshitake Yaegashi ◽  
...  

2021 ◽  
pp. 108062
Author(s):  
Maksym Paliy ◽  
Tommaso Rizzo ◽  
Piero Ruiu ◽  
Sebastiano Strangio ◽  
Giuseppe Iannaccone

Author(s):  
Sapan Agarwal ◽  
Diana Garland ◽  
John Niroula ◽  
Robin B. Jacobs-Gedrim ◽  
Alex Hsia ◽  
...  

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