scholarly journals An Intelligent and Fast Chaotic Encryption Using Digital Logic Circuits for Ad-Hoc and Ubiquitous Computing

Entropy ◽  
2016 ◽  
Vol 18 (5) ◽  
pp. 201 ◽  
Author(s):  
Ankur Khare ◽  
Piyush Shukla ◽  
Murtaza Rizvi ◽  
Shalini Stalin
Keyword(s):  
Ubiquitous Computing ◽  
Ad Hoc ◽  
Logic Circuits ◽  
Digital Logic ◽  
Chaotic Encryption

DIGITALIZATION OF LABOR MIGRATION PROCESSES IN UZBEKISTAN. WORLD EXPERIENCE

2020 ◽  
Vol 4 (3) ◽  
pp. 29-39
Author(s):  
Sulkhiya Gazieva ◽  
Keyword(s):  
Labor Market ◽  
Technological Change ◽  
Labor Migration ◽  
Smart Phone ◽  
Logic Circuits ◽  
Digital Logic ◽  
The Internet ◽  
The Future

The future of labor market depends upon several factors, long-term innovation and the demographic developments. However, one of the main drivers of technological change in the future is digitalization and central to this development is the production and use of digital logic circuits and its derived technologies, including the computer,the smart phone and the Internet. Especially, smart automation will perhaps not cause e.g.regarding industries, occupations, skills, tasks and duties

scholarly journals Parallel Crossed Chaotic Encryption for Hyperspectral Images

2018 ◽  
Vol 8 (7) ◽  
pp. 1183 ◽  
Author(s):  
Carlos Villaseñor ◽  
Eric Gutierrez-Frias ◽  
Nancy Arana-Daniel ◽  
Alma Alanis ◽  
Carlos Lopez-Franco
Keyword(s):  
Chaotic Systems ◽  
Ad Hoc ◽  
State Of The Art ◽  
Hyperspectral Images ◽  
Encryption Algorithm ◽  
Electromagnetic Spectrum ◽  
Chaotic Encryption ◽  
Raw Data ◽  
Essential Tool ◽  
Encryption Schemes

Hyperspectral images (HI) collect information from across the electromagnetic spectrum, and they are an essential tool for identifying materials, recognizing processes and finding objects. However, the information on an HI could be sensitive and must to be protected. Although there are many encryption schemes for images and raw data, there are not specific schemes for HI. In this paper, we introduce the idea of crossed chaotic systems and we present an ad hoc parallel crossed chaotic encryption algorithm for HI, in which we take advantage of the multidimensionality nature of the HI. Consequently, we obtain a faster encryption algorithm and with a higher entropy result than others state of the art chaotic schemes.

Parallel Simulation of Digital Logic Circuits Using Message Passing via CSP as an Educational Tool

2019 ◽  
pp. 284-298
Author(s):  
Mario Rossainz-López ◽  
Carmen Cerón-Garnica ◽  
Etelvina Archundia-Sierra ◽  
Patricia Cervantes-Márquez ◽  
David Carrasco-Limón ◽  
...  
Keyword(s):  
Message Passing ◽  
Parallel Simulation ◽  
Logic Circuits ◽  
Digital Logic ◽  
Educational Tool

CMOS Circuits on Silicon Carbide for High Temperature Operation

2014 ◽  
Vol 1693 ◽  
Author(s):  
David T. Clark ◽  
Robin F. Thompson ◽  
Aled E. Murphy ◽  
David A. Smith ◽  
Ewan P. Ramsay ◽  
...  
Keyword(s):  
Silicon Carbide ◽  
High Temperature ◽  
Wide Temperature Range ◽  
Integrated Circuit ◽  
Elevated Temperatures ◽  
Logic Circuits ◽  
Digital Logic ◽  
Cmos Integrated Circuit ◽  
Temperature Range ◽  
Simple Logic

ABSTRACTWe present the characteristics of a high temperature CMOS integrated circuit process based on 4H silicon carbide designed to operate at temperatures beyond 300°C. N-channel and P-channel transistor characteristics at room and elevated temperatures are presented. Both channel types show the expected low values of field effect mobility well known in SiC MOSFETS. However the performance achieved is easily capable of exploitation in CMOS digital logic circuits and certain analogue circuits, over a wide temperature range.Data is also presented for the performance of digital logic demonstrator circuits, in particular a 4 to 1 analogue multiplexer and a configurable timer operating over a wide temperature range. Devices are packaged in high temperature ceramic dual in line (DIL) packages, which are capable of greater than 300°C operation. A high temperature “micro-oven” system has been designed and built to enable testing and stressing of units assembled in these package types. This system heats a group of devices together to temperatures of up to 300°C while keeping the electrical connections at much lower temperatures. In addition, long term reliability data for some structures such as contact chains to n-type and p-type SiC and simple logic circuits is summarized.

Multiple-Input Relay Design for More Compact Implementation of Digital Logic Circuits

2012 ◽  
Vol 33 (2) ◽  
pp. 281-283 ◽  
Author(s):  
Jaeseok Jeon ◽  
Louis Hutin ◽  
Ruzica Jevtic ◽  
Nathaniel Liu ◽  
Yenhao Chen ◽  
...  
Keyword(s):  
Logic Circuits ◽  
Digital Logic ◽  
Multiple Input
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