scholarly journals Imprinting the Polytype Structure of Silicon Carbide by Rapid Thermal Processing

Crystals ◽  
2020 ◽  
Vol 10 (6) ◽  
pp. 523 ◽  
Author(s):  
Jörg Pezoldt ◽  
Volker Cimalla

Silicon carbide is a material with a multistable crystallographic structure, i.e., a polytypic material. Different polytypes exhibit different band gaps and electronic properties with nearly identical basal plane lattice constants, making them interesting for heterostructures without concentration gradients. The controlled formation of this heterostructure is still a challenge. The ability to adjust a defined temperature–time profile using rapid thermal processing was used to imprint the polytype transitions by controlling the nucleation and structural evolution during the temperature ramp-up and the steady state. The influence of the linear heating-up rate velocity during ramp-up and steady-state temperature on the crystal structure of amorphized ion-implanted silicon carbide layers was studied and used to form heteropolytype structures. Integrating the structural selection properties of the non-isothermal annealing stage of the ion-implanted layers into an epitaxial growth process allows the imprinting of polytype patterns in epitaxial layers due to the structural replication of the polytype pattern during epitaxial growth. The developed methodology paves the way for structural selection and vertical and lateral polytype patterning. In rapid thermal chemical vapor deposition, the adjustment of the process parameters or the buffer layer allowed the nucleation and growth of wurtzite silicon carbide.

1991 ◽  
Vol 220 ◽  
Author(s):  
T. Y. Hsieh ◽  
K. H. Jung ◽  
D. L. Kwong

ABSTRACTWe have demonstrated, for the first time, that the epitaxial growth temperature can be lowered by dopant incorporation using rapid thermal processing chemical vapor deposition (RTPCVD). Heavily arsenic-doped epitaxial layers with very abrupt dopant transition profiles and relative uniform carrier distribution have been achieved at 800°C. The defect formation is closely related to dopant concentration; the defect density as a function of carrier concentration shows a sharp transition at about 3×1018 cm−3.


1991 ◽  
Vol 224 ◽  
Author(s):  
T. Y. Hsieh ◽  
K. H. Jung ◽  
D. L. Kwong ◽  
S. Lin ◽  
H. L. Marcus

AbstractA short time high temperature H2 pre-bake resulted in an undulating SIMOX surface, which planarized after epitaxial growth by rapid thermal processing chemical vapor deposition (RTPCVD). However, a short time, high temperature N2 pre-bake resulted in severe surface pitting. From dilute Schimmel etch results, no significant changes in the defect densities of the Si layers occurred after RTPCVD. Auger depth profiles of the SOI substrate prior to epitaxial growth show an oxygen peak in the SIMOX Si layer. However, the peak flattens out after epitaxial growth. Oxygen was not observed in the epitaxial film, even though oxygen was still observed in the SIMOX top Si layer.The use of GexSi1−x epitaxial layers to reduce threading dislocation densities was examined. A 1000°C Si buffer layer was first grown for 30s, followed by a GexSi1−x layer, and topped off by a 1000°C Si layer for 120s. The GexSi1−x layers were grown at temperatures varying from 850°C to 1000°C for 30s to 240s. The defect density was significantly reduced when the 900°C and 850°C GexSi1−x layers were used, although an increase in stacking fault densities (still small compared to threading dislocation densities) accompanied the lower deposition temperatures. The 1000°C GexSi1−x layer and a control sample in which pure Si was grown showed no significant decrease in defect densities.


1991 ◽  
Vol 4 (1) ◽  
pp. 14-20 ◽  
Author(s):  
S.A. Campbell ◽  
K.-H. Ahn ◽  
K.L. Knutson ◽  
B.Y.H. Liu ◽  
J.D. Leighton

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