scholarly journals Multiparameter Determination of Thin Liquid Urea-Water Films

2021 ◽  
Vol 11 (19) ◽  
pp. 8925
Author(s):  
Sani van der Kley ◽  
Gabriele Goet ◽  
Anna Schmidt ◽  
Valentina Einspieler ◽  
Steven Wagner

In this work, wavelengths were determined for the robust and simultaneous measurement of film thickness, urea concentration and fluid temperature. Film parameters such as film thickness, film temperature and the composition of the film are typically dynamically and interdependently changing. To gain knowledge of these quantities, a measurement method is required that offers a high temporal resolution while being non-intrusive so as to not disturb the film as well as the process conditions. We propose the extension of the FMLAS method, which was previously validated for the film thickness measurement of thin liquid films, to determine temperatures and concentrations using an adapted evaluation approach.

Author(s):  
Prong Kongsubto ◽  
Sirarat Kongwudthiti

Abstract Organic solderability preservatives (OSPs) pad is one of the pad finishing technologies where Cu pad is coated with a thin film of an organic material to protect Cu from oxidation during storage and many processes in IC manufacturing. Thickness of OSP film is a critical factor that we have to consider and control in order to achieve desirable joint strength. Until now, no non-destructive technique has been proposed to measure OSP thickness on substrate. This paper reports about the development of EDS technique for estimating OSP thickness, starting with determination of the EDS parameter followed by establishing the correlation between C/Cu ratio and OSP thickness and, finally, evaluating the accuracy of the EDS technique for OSP thickness measurement. EDS quantitative analysis was proved that it can be utilized for OSP thickness estimation.


2020 ◽  
Vol 91 (12) ◽  
pp. 123111
Author(s):  
Zirui Qin ◽  
Qinggang Liu ◽  
Chong Yue ◽  
Yaopu Lang ◽  
Xinglin Zhou

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