scholarly journals Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module

2020 ◽  
Vol 15 (55) ◽  
pp. 316-326
Author(s):  
Dianhao Zhang ◽  
Xiao-guang Huang ◽  
Bin-liang Cheng ◽  
Neng Zhang
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
High Frequency ◽  
Fatigue Behavior ◽  
Electronic Devices ◽  
Power Module ◽  
Thermomechanical Model ◽  
Thermal Fatigue Life ◽  
Solder Layer

Limited by the mechanical properties of materials, silicon (Si) carbide insulated gate bipolar transistor (IGBT) can no longer meet the requirements of high power and high frequency electronic devices. Silicon carbide (SiC) IGBT, represented by SiC MOSFET, combines the excellent performance of SiC materials and IGBT devices, and becomes an ideal device for high-frequency and high-temperature electronic devices. Even so, the thermal fatigue failure of SiC IGBT, which directly determines its application and promotion, is a problem worthy of attention. In this study, the thermal fatigue behavior of SiC-IGBT under cyclic temperature cycles was investigated by finite element method. The finite element thermomechanical model was established, and stress-strain distribution and creep characteristics of the SnAgCu solder layer were obtained. The thermal fatigue life of the solder was predicted by the creep, shear strain and energy model respectively, and the failure position and factor of failure were discussed.

scholarly journals Prediction of Thermal Fatigue Life of Lead-Free BGA Solder Joints by Finite Element Analysis

2001 ◽  
Vol 42 (5) ◽  
pp. 809-813 ◽  
Author(s):  
Young-Eui Shin ◽  
Kyung-Woo Lee ◽  
Kyong-Ho Chang ◽  
Seung-Boo Jung ◽  
Jae Pil Jung
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Solder Joints ◽  
Lead Free ◽  
Element Analysis ◽  
Thermal Fatigue Life

Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

2011 ◽  
Author(s):  
Tomohiro Takahashi ◽  
Qiang Yu ◽  
Masahiro Kobayashi
Keyword(s):  
Fatigue Life ◽  
Temperature Distribution ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Thermal Structure ◽  
Inelastic Strain ◽  
Power Module ◽  
Thermal Fatigue Life ◽  
Power Cycling ◽  
Precision Evaluation

For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal fatigue. In this study, thermal fatigue life of solder joints on power module was evaluated. The finite element method (FEM) was used to evaluate temperature distribution induced by joule heating. Higher temperature appears below the Al wire because the electric current flows through the bonding Al wire. Coupled thermal-structure analysis is also required to evaluate the inelastic strain distribution. The damage of each part of solder joint can be calculated from equivalent inelastic strain range and crack propagation was simulated by deleting damaged elements step by step. The initial cracks were caused below the bonding Al wire and propagated concentrically under power cycling. There is the difference from environmental thermal cycling where the crack initiated at the edge of solder layer. In addition, in order to accurately evaluate the thermal fatigue life, the factors affecting the thermal fatigue life of solder joint where verified using coupled electrical-thermal-structural analysis. Then, the relation between the thermal fatigue life of solder joint and each factor is clarified. The precision evaluation for the thermal fatigue life of power module is improved.

Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch

2002 ◽  
Vol 124 (4) ◽  
pp. 403-410 ◽  
Author(s):  
J. Lau ◽  
Z. Mei ◽  
S. Pang ◽  
C. Amsden ◽  
J. Rayner ◽  
...  
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Energy Density ◽  
Thermal Fatigue ◽  
Strain Energy Density ◽  
Strain Energy ◽  
Constitutive Law ◽  
Isothermal Fatigue ◽  
Thermal Fatigue Life ◽  
Sealing Ring

Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination of the thermal-fatigue life of the solder sealing ring under shipping/storing/handling conditions. The solder ring is assumed to obey the Garofalo-Arrhenius creep constitutive law. The nonlinear responses such as the deflections, stresses, creep strains, and creep strain energy density of the 3-D photonic package have been determined with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life of the solder sealing ring is readily determined and is found to be more than adequate for shipping/storing/handling the photonic switches.

Examination of evaluation parameter for thermal fatigue life of wirebond used in power module

2019 ◽  
Vol 2019.32 (0) ◽  
pp. 063
Author(s):  
Toru OSAKO ◽  
Yoshiki SETOGUCHI ◽  
Nobuyuki SHISHIDO ◽  
Masaaki KOGANEMARU ◽  
Toru IKEDA ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Power Module ◽  
Thermal Fatigue Life

Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps

2020 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Haiyan Sun ◽  
Bo Gao ◽  
Jicong Zhao
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
Mechanical Performance ◽  
Three Dimension ◽  
Wafer Level ◽  
Element Analysis ◽  
Content Type ◽  
Cycle Simulation ◽  
Thermal Fatigue Life

Purpose This study aims to investigate the several parameters in wafer-level packaging (WLP) to find the most critical factor impacting the thermal fatigue life, such as the height of copper post, the height of solder bump, the thickness of chip. The FEA results indicate the height of solder bumps is the most important factor in the whole structure. Design/methodology/approach The copper post bumps with 65 µm pitch are proposed to investigate the thermal-mechanical performance of WLP. The thermal cycle simulation is used to evaluate the reliability of WLP by using finite element analysis (FEA). Taguchi method is adopted to obtain the sensitivity of parameters of three-dimension finite element model, for an optimized configuration. Findings It can be found that the optimal design has increased thermal fatigue life by 147% compared with the original one. Originality/value It is concluded that the finite element simulation results show outstanding thermal-mechanical performances of the proposed 65 µm pitch copper post bumps of WLP, including low plastic strain, high thermal fatigue life, which are desired for mobile device.

Thermal Stress and Thermal Cycling Analyses of Microgyroscope Chip Models

2011 ◽  
Vol 462-463 ◽  
pp. 622-627 ◽  
Author(s):  
Meng Kao Yeh ◽  
Chun Lin Lu
Keyword(s):  
Finite Element Method ◽  
Finite Element ◽  
Thermal Stress ◽  
Fatigue Life ◽  
Stress Distribution ◽  
Thermal Fatigue ◽  
Simplified Model ◽  
The Finite Element Method ◽  
Nonlinear Analyses ◽  
Thermal Fatigue Life

The thermal stress and thermal fatigue life for three different microgyroscope chip models were investigated in this paper. The deformation and stress distribution in chip, at interface between microgyroscope and chip, and in the spring of microgyroscope were obtained for three different microgyroscope chip models by the finite element method. The results show that for the simplified model, no obvious differences from linear or nonlinear analyses are obtained and the fatigue life of microgyroscope chip can be predicted with the properly simplified model. Also, the model having the same process in fabricating microgyroscope and carrier has better reliability. This paper provides an effective method for the reliability analysis of microgyroscope chip.

Finite element analysis on the thermal fatigue life of full vs peripheral array packages

2021 ◽  
Vol ahead-of-print (ahead-of-print) ◽  
Author(s):  
Mohammad A. Gharaibeh
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Fatigue Life ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Three Dimensional ◽  
Element Analysis ◽  
Content Type ◽  
Thermal Fatigue Life ◽  
Thermal Cycling Fatigue

PurposeThis paper aims to examine the thermal cycling fatigue life performance of two-common solder array configurations, full and peripheral, using three-dimensional nonlinear finite element analysis.Design/methodology/approachThe finite element simulations were used to identify the location of the critical solder interconnect, and using Darveaux's model, solder thermal fatigue life was computed.FindingsThe results showed that the solder array type does not significantly influence thermal fatigue life of the interconnect. However, smaller size packages result in improved life by almost 45% compared to larger package designs. Additionally, this paper provided an engineered study on the effect of the number of rows available in a perimeter array component on solder thermal fatigue performance.Originality/valueGeneral design recommendations for reliable electronic assemblies under thermal cycling loaded were offered in this research.

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