Finite element analysis on the thermal fatigue life of full vs peripheral array packages

PurposeThis paper aims to examine the thermal cycling fatigue life performance of two-common solder array configurations, full and peripheral, using three-dimensional nonlinear finite element analysis.Design/methodology/approachThe finite element simulations were used to identify the location of the critical solder interconnect, and using Darveaux's model, solder thermal fatigue life was computed.FindingsThe results showed that the solder array type does not significantly influence thermal fatigue life of the interconnect. However, smaller size packages result in improved life by almost 45% compared to larger package designs. Additionally, this paper provided an engineered study on the effect of the number of rows available in a perimeter array component on solder thermal fatigue performance.Originality/valueGeneral design recommendations for reliable electronic assemblies under thermal cycling loaded were offered in this research.

Bonding and Thermal Cycling Performances of Two (Poly)Aryl–Ether–Ketone (PAEKs) Materials to an Acrylic Denture Base Resin

Poly(aryl–ether–ketone) materials (PAEKs) are gaining interest in everyday dental practices because of their natural properties. This study aims to analyze the bonding performance of PAEKs to a denture acrylic. Testing materials were pretreated by grinding, sandblasting, and priming prior to polymerization with the denture acrylic. The surface morphologies were observed using a scanning electron microscope and the surface roughness was measured using atomic force microscopy. The shear bond strength (SBS) values were determined after 0 and 2500 thermal cycles. The obtained data were analyzed using a paired samples t-test and Tukey’s honestly significant difference (HSD) test (α = 0.05). The surface characteristics of testing materials after different surface pretreatments showed obvious differences. PAEKs showed lower surface roughness values (0.02–0.03 MPa) than Co-Cr (0.16 MPa) and zirconia (0.22 MPa) after priming and sandblasting treatments (p < 0.05). The SBS values of PAEKs (7.60–8.38 MPa) met the clinical requirements suggested by ISO 10477 (5 MPa). Moreover, PAEKs showed significantly lower SBS reductions (p < 0.05) after thermal cycling fatigue testing compared to Co-Cr and zirconia. Bonding performance is essential for denture materials, and our results demonstrated that PAEKs possess good resistance to thermal cycling fatigue, which is an advantage in clinical applications. The results imply that PAEKs are potential alternative materials for the removable of prosthetic frameworks.

Evaluating Thermal Cycling Fatigue Resistance for LED Chip-on-Board Applications

LED chip-on-board applications typically involve assembling an LED die stack directly on to a high thermal conductivity substrate such as a Metal Core PCB. If solder is used for die-substrate attach for such chip-on-board applications, one needs to consider the CTE mismatch between the die stack and the MCPCB and its impact on thermal cycle-induced creep fatigue of the solder material. This paper presents a methodology to compare relative performance of different solder materials with varying thermo-mechanical properties, and compare the impact of CTE mismatch and temperature swings on transient thermal properties and relative reliability of the solder attach materials. Implications for LED chip-on-board applications are discussed.