Precision Evaluation for Thermal Fatigue Life of Power Module Using Coupled Electrical-Thermal-Structural Analysis

2011 ◽  
Author(s):  
Tomohiro Takahashi ◽  
Qiang Yu ◽  
Masahiro Kobayashi
Keyword(s):  
Fatigue Life ◽  
Temperature Distribution ◽  
Solder Joint ◽  
Thermal Fatigue ◽  
Thermal Structure ◽  
Inelastic Strain ◽  
Power Module ◽  
Thermal Fatigue Life ◽  
Power Cycling ◽  
Precision Evaluation

For power module, the reliability evaluation of thermal fatigue life by power cycling has been prioritized as an important concern. Since in power cycling produces there exists non-uniform temperature distribution in the power module, coupled thermal-structure analysis is required to evaluate thermal fatigue mechanism. The thermal expansion difference between a Si chip and a substrate causes thermal fatigue. In this study, thermal fatigue life of solder joints on power module was evaluated. The finite element method (FEM) was used to evaluate temperature distribution induced by joule heating. Higher temperature appears below the Al wire because the electric current flows through the bonding Al wire. Coupled thermal-structure analysis is also required to evaluate the inelastic strain distribution. The damage of each part of solder joint can be calculated from equivalent inelastic strain range and crack propagation was simulated by deleting damaged elements step by step. The initial cracks were caused below the bonding Al wire and propagated concentrically under power cycling. There is the difference from environmental thermal cycling where the crack initiated at the edge of solder layer. In addition, in order to accurately evaluate the thermal fatigue life, the factors affecting the thermal fatigue life of solder joint where verified using coupled electrical-thermal-structural analysis. Then, the relation between the thermal fatigue life of solder joint and each factor is clarified. The precision evaluation for the thermal fatigue life of power module is improved.

Examination of evaluation parameter for thermal fatigue life of wirebond used in power module

2019 ◽  
Vol 2019.32 (0) ◽  
pp. 063
Author(s):  
Toru OSAKO ◽  
Yoshiki SETOGUCHI ◽  
Nobuyuki SHISHIDO ◽  
Masaaki KOGANEMARU ◽  
Toru IKEDA ◽  
...  
Keyword(s):  
Fatigue Life ◽  
Thermal Fatigue ◽  
Power Module ◽  
Thermal Fatigue Life

scholarly journals Numerical analysis and thermal fatigue life prediction of solder layer in a SiC-IGBT power module

2020 ◽  
Vol 15 (55) ◽  
pp. 316-326
Author(s):  
Dianhao Zhang ◽  
Xiao-guang Huang ◽  
Bin-liang Cheng ◽  
Neng Zhang
Keyword(s):  
Finite Element ◽  
Fatigue Life ◽  
Thermal Fatigue ◽  
High Frequency ◽  
Fatigue Behavior ◽  
Electronic Devices ◽  
Power Module ◽  
Thermomechanical Model ◽  
Thermal Fatigue Life ◽  
Solder Layer

Limited by the mechanical properties of materials, silicon (Si) carbide insulated gate bipolar transistor (IGBT) can no longer meet the requirements of high power and high frequency electronic devices. Silicon carbide (SiC) IGBT, represented by SiC MOSFET, combines the excellent performance of SiC materials and IGBT devices, and becomes an ideal device for high-frequency and high-temperature electronic devices. Even so, the thermal fatigue failure of SiC IGBT, which directly determines its application and promotion, is a problem worthy of attention. In this study, the thermal fatigue behavior of SiC-IGBT under cyclic temperature cycles was investigated by finite element method. The finite element thermomechanical model was established, and stress-strain distribution and creep characteristics of the SnAgCu solder layer were obtained. The thermal fatigue life of the solder was predicted by the creep, shear strain and energy model respectively, and the failure position and factor of failure were discussed.

Thermal Fatigue Life Determination of CCGA Interconnect Using a Simple Method

2007 ◽  
Author(s):  
T. E. Wong ◽  
C. Chu
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Temperature Cycling ◽  
Test Results ◽  
Electronic Package ◽  
Thermal Fatigue Life ◽  
Life Prediction Model

A simplified method was developed to determine the fatigue life of a ceramic column grid array (CCGA) solder joint when exposed to thermal environments. The CCGA package with 90Pb/10Sn solder columns is soldered onto the printed circuit board with a tin-lead solder paste. Failure of the solder joint occurs at the CCGA solder column. A closed-form solution with the equilibrium of displacements of electronic package assembly was first derived to calculate the solder joint strains during the temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution in the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials, which used elastic-plastic properties. A fatigue life prediction model, evolved from an empirically derived formula based upon a modified Coffin-Manson fatigue theory, was then established. CCGA test results, obtained from various sources, combined with the derived solder strains were used to calibrate the proposed life prediction model. In the model calibration process, the 625- and 1657-pin CCGA test results, which were cycled between 20°C/90°C, 0°C/100°C, −55°C/110°C, or −55°C/125°C, were reasonably well correlated to the calculated values of solder strains. In addition, this calibrated model is remarkably simple compared to the model used in an evaluation by a finite element analysis. Therefore, this model could be used and is recommended to serve as an effective tool to make a preliminarily estimate at the CCGA solder joint thermal fatigue life. It is also recommended to 1) select more study cases with various solder joint configurations, package sizes, environmental profiles, etc. to further calibrate this life prediction model, 2) use this model to conduct parametric studies to identify critical factors impacting solder joint fatigue life and then seeking an optimum design, and 3) develop a similar life prediction model for lead-free solder materials.

CBGA Solder Joint Thermal Fatigue Life Estimation by a Simple Method

2003 ◽  
Author(s):  
T. E. Wong ◽  
C. Y. Lau ◽  
H. S. Fenger
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Prediction Model ◽  
Thermal Fatigue ◽  
Life Prediction ◽  
Test Results ◽  
Electronic Package ◽  
Eutectic Solder ◽  
Thermal Fatigue Life ◽  
Life Prediction Model

A simple analysis method was developed to determine the fatigue life of a ceramic ball grid array (CBGA) solder joint when exposed to thermal environments. The solder joint consists of a 90Pb/10Sn solder ball with eutectic solder on both top and bottom of the ball. Failure of the solder joint occurs at the eutectic solder. A closed-form solution with the equilibrium of displacements of electronic package assembly was first developed to calculate the solder joint strains during the temperature cycling. In the calculation, an iteration technique was used to obtain a convergent solution in the solder strains, and the elastic material properties were used for all the electronic package assembly components except for the solder materials, which used elastic-plastic properties. A fatigue life prediction model, evolved from an empirically derived formula based upon a modified Coffin-Manson fatigue theory, was then established. CBGA test results, obtained from Motorola, combined with the derived solder strains were used to calibrate the proposed life prediction model. In the model calibration process, the 255- and 304-pin CBGA test results, which were cycled between 0°C and 100°C or −40°C and 125°C, were reasonably well correlated to the calculated values of solder strains. In addition, this calibrated model is remarkably simple compared to the model used in an evaluation by finite element analysis. Therefore, this model could be used and is recommended to serve as an effective tool to preliminarily estimate the CBGA solder joint thermal fatigue life.

Assessment of Relative Thermal Fatigue Life of SAC Lead-Free and Tin-Lead Solders With Custom-Made BGA Assemblies Creating Various Stress Ranges

2009 ◽  
Author(s):  
Y. S. Chan ◽  
C. Yang ◽  
S. W. Ricky Lee
Keyword(s):  
Fatigue Life ◽  
Solder Joint ◽  
Thermal Cycling ◽  
Thermal Fatigue ◽  
Relative Magnitude ◽  
Lead Free ◽  
Thermal Fatigue Life ◽  
Snpb Solder ◽  
Custom Made ◽  
Sac Solder

The present study evaluates the relative thermal fatigue life of tin-silver-copper (SnAgCu or SAC) lead-free and tin-lead (SnPb) solders with custom-made BGA assembly configurations generating various stress ranges under thermal cyclic loading. Although the SAC solder bears a lower creep strain rate compared with the SnPb solder in common thermal cycling conditions, it is found that there exits conditions at which the SnPb solder joint maintain a longer life than the SAC solder joint. The determination lies on the maximum normalized equivalent stress levels (σ/E) experienced by the two kinds of solder joint during the temperature cycles. Even under the same straining and thermal cycling condition, it is observed that the maximum σ/E induced in the two kinds of solder joint are normally different, as a result of their different rate of stress relaxation. The analysis shows that both the absolute and relative magnitude of σ/E experienced by the two kinds of solder joint affect the relative life. In general, the SAC solder joint sustain a longer life at low σ/E levels, while the SnPb solder joint outperform the SAC solder joint at high σ/E levels. There exists a critical σ/E level at which both solder joints acquire similar performance. However, this margin shifts with the relative magnitude of σ/E the two kinds of solder joint suffered. Having studied the variation of σ/E for the two kinds of solder joint under various loading conditions, this study uncovers the rationale for the difference in the relative thermal fatigue life of the two kinds of solder joint.

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