Depth-resolved residual stress evaluation from X-ray diffraction measurement data using the approximate inverse method

2003 ◽  
Vol 94 (8) ◽  
pp. 934-937 ◽  
Author(s):  
T. Schuster ◽  
J. Plöger ◽  
A. K. Louis
2007 ◽  
Vol 40 (4) ◽  
pp. 675-683 ◽  
Author(s):  
Cristy L. Azanza Ricardo ◽  
Mirco D'Incau ◽  
Paolo Scardi

A new procedure is proposed to determine sub-surface residual stress gradients by laboratory X-ray diffraction measurements at different depths using a chemical layer-removal technique. The standard correction algorithm for stress relaxation due to layer removal is improved by including corrections for X-ray absorption, and by the addition of constraints imposed by the mechanical equilibrium conditions. Besides correcting the data,i.e.providing more reliable through-thickness residual stress trends, the proposed procedure also provides an elastically compatible and plausible estimate of the residual stress inside the component, well beyond the measured region. The application of the model is illustrated for a set of Al-alloy components shot-peened at different Almen intensities. Results are compared with those given by `blind hole drilling', which is an independent and partly destructive method.


1972 ◽  
Vol 16 ◽  
pp. 344-353 ◽  
Author(s):  
Carol J. Kelly ◽  
E. Eichen

AbstractThe system to be described includes hardware and software for the on-line computer control of the X-ray diffraction measurement of residual stress. This determination involves accurately measuring the angles at which a back-reflection line is diffracted, first by diffracting planes parallel to the sample surface, and then by planes at an angle (ψ) to the sample surface. The residual stress is calculated from the difference in the two measured diffraetion angles. The procedure executed by the computer consists of locating the peaks, selecting three angles for collection of X-ray counts, correcting the measured counts, fitting the equi-angular intensity measurements to a three-point parabola, calculating the peak angles, calculating the residual stress from the measured angles and typing a report. This automation has eliminated the tedium of the manual X-ray data accumulation and of the residual stress calculation. The online control has also permitted improvements in the technique not practicable with the manually performed measurement of residual stress.


1985 ◽  
Vol 107 (2) ◽  
pp. 185-191 ◽  
Author(s):  
C. O. Ruud ◽  
R. N. Pangborn ◽  
P. S. DiMascio ◽  
D. J. Snoha

A unique X-ray diffraction instrument for residual stress measurement has been developed that provides for speed, ease of measurement, accuracy, and economy of surface stress measurement. Application of this instrument with a material removal technique, e.g., electropolishing, has facilitated detailed, high resolution studies of three-dimensional stress fields. This paper describes the instrumentation and techniques applied to conduct the residual stress measurement and presents maps of the residual stress data obtained for the surfaces of a heavy 2 1/4 Cr 1 Mo steel plate weldment.


2014 ◽  
Vol 996 ◽  
pp. 175-180 ◽  
Author(s):  
Rasha Alkaisee ◽  
Ru Lin Peng

For X-Ray Diffraction Measurement of Depth Profiles of Residual Stress, Step-Wise Removal of Materials has to be Done to Expose the Underneath Layers to the X-Rays. this Paper Investigates the Influence of Layer Removal Methods, Including Electro-Polishing in Two Different Electrolytes and Chemical Etching, on the Accuracy of Residual Stress Measurement. Measurements on Two Shot-Peened Steels Revealed Large Discrepancy in Subsurface Distributions of Residual Stress Obtained with the Respective Methods. Especially, the Chemical Etching Yielded much Lower Subsurface Compressive Stresses than the Electro-Polishing Using a so Called AII Electrolyte. the Difference was Explained by the Influence of the Different Layer Removal Methods on the Microscopic Roughness.


2008 ◽  
Vol 571-572 ◽  
pp. 421-425
Author(s):  
Guenther A. Maier ◽  
Jozef Keckes ◽  
Jens Brechbuehl ◽  
Hugues Guerault ◽  
Raúl Bermejo

Alumina-zirconia multilayered ceramics have been proposed as an alternative for the design of structural ceramics with improved fracture toughness and strength reliability. During the processing of these laminates, significant residual stresses may arise due to the thermal expansion mismatch between adjacent layers. The correct evaluation of such stress distribution in the laminate may determine its range of application. In this work, the residual stress state in a layered material designed with five thick alumina layers of approximately 650 microns alternated with four thin alumina-zirconia layers of approximately 140 microns was estimated using different methods. A finite element analysis (FEM) was performed for stress evaluation in the bulk and an indentation method and X-Ray diffraction to account for stresses at the surface. Experimental findings show a constant stress distribution within the bulk for each layer, while at the surface stress position dependence is observed in the alumina layers, being the maximum tensile stresses near the layer interface. The accuracy of the results provided by each technique is discussed.


2016 ◽  
Vol 19 (5) ◽  
pp. 1176-1179 ◽  
Author(s):  
Rodrigo Braga Ceglias ◽  
Juciane Maria Alves ◽  
Ramón Alves Botelho ◽  
Eustáquio de Souza Baeta Júnior ◽  
Igor Cuzzuol dos Santos ◽  
...  

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