X-Ray Diffraction Measurement of Residual Stresses in Thick, Multi-Pass Steel Weldments

1985 ◽  
Vol 107 (2) ◽  
pp. 185-191 ◽  
Author(s):  
C. O. Ruud ◽  
R. N. Pangborn ◽  
P. S. DiMascio ◽  
D. J. Snoha

A unique X-ray diffraction instrument for residual stress measurement has been developed that provides for speed, ease of measurement, accuracy, and economy of surface stress measurement. Application of this instrument with a material removal technique, e.g., electropolishing, has facilitated detailed, high resolution studies of three-dimensional stress fields. This paper describes the instrumentation and techniques applied to conduct the residual stress measurement and presents maps of the residual stress data obtained for the surfaces of a heavy 2 1/4 Cr 1 Mo steel plate weldment.

2007 ◽  
Vol 40 (4) ◽  
pp. 675-683 ◽  
Author(s):  
Cristy L. Azanza Ricardo ◽  
Mirco D'Incau ◽  
Paolo Scardi

A new procedure is proposed to determine sub-surface residual stress gradients by laboratory X-ray diffraction measurements at different depths using a chemical layer-removal technique. The standard correction algorithm for stress relaxation due to layer removal is improved by including corrections for X-ray absorption, and by the addition of constraints imposed by the mechanical equilibrium conditions. Besides correcting the data,i.e.providing more reliable through-thickness residual stress trends, the proposed procedure also provides an elastically compatible and plausible estimate of the residual stress inside the component, well beyond the measured region. The application of the model is illustrated for a set of Al-alloy components shot-peened at different Almen intensities. Results are compared with those given by `blind hole drilling', which is an independent and partly destructive method.


2009 ◽  
Vol 2009.46 (0) ◽  
pp. 385-386
Author(s):  
Koji Hattori ◽  
Mitsuyoshi Nakatani ◽  
Tomoki Takehashi ◽  
Masamitsu Abe ◽  
Toshihiko Sasaki

2014 ◽  
Vol 996 ◽  
pp. 175-180 ◽  
Author(s):  
Rasha Alkaisee ◽  
Ru Lin Peng

For X-Ray Diffraction Measurement of Depth Profiles of Residual Stress, Step-Wise Removal of Materials has to be Done to Expose the Underneath Layers to the X-Rays. this Paper Investigates the Influence of Layer Removal Methods, Including Electro-Polishing in Two Different Electrolytes and Chemical Etching, on the Accuracy of Residual Stress Measurement. Measurements on Two Shot-Peened Steels Revealed Large Discrepancy in Subsurface Distributions of Residual Stress Obtained with the Respective Methods. Especially, the Chemical Etching Yielded much Lower Subsurface Compressive Stresses than the Electro-Polishing Using a so Called AII Electrolyte. the Difference was Explained by the Influence of the Different Layer Removal Methods on the Microscopic Roughness.


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