Investigation of Interfacial Reactions between Sn–Ag–Bi–In Solder and (Cu, Electroless Ni–P/Cu) Substrate

2003 ◽  
Vol 94 (4) ◽  
pp. 453-457 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Chang-Yong Lee ◽  
Chang-Bae Lee ◽  
Choong-Sik Yoo ◽  
Seung-Boo Jung
Keyword(s):  
Interfacial Reactions ◽  
Cu Substrate ◽  
Electroless Ni

Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C

2004 ◽  
Vol 19 (12) ◽  
pp. 3560-3568 ◽  
Author(s):  
Chia-Wei Huang ◽  
Kwang-Lung Lin
Keyword(s):  
Intermetallic Compounds ◽  
Aging Time ◽  
Weight Percent ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Lead Free ◽  
Cu Substrate ◽  
Electroless Ni

The interfacial reactions of Sn–Zn based solder on Cu and Cu/Ni–P/Cu–plating substrates under aging at 150 °C were investigated in this study. The compositions of solders investigated were Sn–9Zn, Sn–8.55Zn–0.45Al, and Sn–8.55Zn–0.45Al–0.5Ag solders in weight percent. The experimental results indicated that the Cu substrate formed Cu5Zn8 with the Sn–9Zn solder and Al–Cu–Zn compound with Al–containing solders. However, it was detected that Cu6Sn5 formed at the Sn–9Zn/Cu interface and Cu5Zn8 formed at the Al–containing solders/Cu interface after aging for 1000 h. When it contacted with the Cu/Ni–P/Au substrate, the Sn–9Zn solder formed Au–Zn compound, and the Al–containing solders formed Al–Cu–Zn compound at the interface. After a long aging time, the intermetallic compounds existing between solders and the Cu/Ni–P/Au metallization layers almost did not grow. It was found that the interdiffusion between solders and Cu/Ni–P/Au was slower than that with Cu under aging. Furthermore, the addition of Ag to Sn–Zn solder resulted in the formation of AgZn3 particles at the interface.

scholarly journals Effect of Ni–P thickness on solid-state interfacial reactions between Sn–3.5Ag solder and electroless Ni–P metallization on Cu substrate

2006 ◽  
Vol 504 (1-2) ◽  
pp. 410-415 ◽  
Author(s):  
Aditya Kumar ◽  
Zhong Chen ◽  
S.G. Mhaisalkar ◽  
C.C. Wong ◽  
Poi Siong Teo ◽  
...  
Keyword(s):  
Solid State ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Electroless Ni

Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate

2019 ◽  
Vol 6 (7) ◽  
pp. 076310
Author(s):  
Nifa Bao ◽  
Xiaowu Hu ◽  
Qinglin Li ◽  
Shuang Li
Keyword(s):  
Interfacial Reactions ◽  
Cu Substrate

Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

2007 ◽  
Vol 437 (1-2) ◽  
pp. 169-179 ◽  
Author(s):  
Peng Sun ◽  
Cristina Andersson ◽  
Xicheng Wei ◽  
Zhaonian Cheng ◽  
Dongkai Shangguan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Sandwich Structure ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Cu Metallization

Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C

2006 ◽  
Vol 21 (12) ◽  
pp. 3196-3204 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Jun Hyung Lim ◽  
Hoo-Jeong Lee ◽  
Jinho Joo ◽  
Seung-Boo Jung ◽  
...  
Keyword(s):  
Solder Joint ◽  
Eutectic Reaction ◽  
Bulk Solder ◽  
Interfacial Reactions ◽  
Test Results ◽  
Mechanical Reliability ◽  
Viable Option ◽  
Reaction Behavior ◽  
Cu Substrate ◽  
Joint Reliability

Joint reliability of immersion Ag with two different solders, Sn–37Pb and Sn–3.5Ag, were evaluated. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn–Pb solder produced a Pb-rich phase along the interface between the solder and the Cu substrate during aging. In contrast, the Sn–Ag solder exhibits an off-eutectic reaction to produce the eutectic phase and Ag3Sn precipitate. The shear test results show that the Sn–Pb solder joint fractured along the interface showing brittle failure indications possibly due to the brittle Pb-rich layer. In contrast, the failure of Sn–Ag solder joint was only through the bulk solder, providing evidence that the interface is mechanically reliable. The results from this study confirm that the immersion Ag/Sn–Ag solder joint is mechanically robust, and thus the combination is a viable option for a Pb-free package system.

Interfacial Reactions of Low-Melting Sn-Bi-Ga Solder Alloy on Cu Substrate

2015 ◽  
Vol 45 (1) ◽  
pp. 197-202 ◽  
Author(s):  
Chih-Hao Chen ◽  
Boon-Ho Lee ◽  
Hsiang-Chua Chen ◽  
Chang-Meng Wang ◽  
Albert T. Wu
Keyword(s):  
Solder Alloy ◽  
Interfacial Reactions ◽  
Cu Substrate
Sign in / Sign up

Export Citation Format

Share Document