Study of interfacial reactions in Sn–3.5Ag–3.0Bi and Sn–8.0Zn–3.0Bi sandwich structure solder joint with Ni(P)/Cu metallization on Cu substrate

2007 ◽  
Vol 437 (1-2) ◽  
pp. 169-179 ◽  
Author(s):  
Peng Sun ◽  
Cristina Andersson ◽  
Xicheng Wei ◽  
Zhaonian Cheng ◽  
Dongkai Shangguan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Sandwich Structure ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Cu Metallization

Interfacial reactions and joint strength of Sn–37Pb and Sn–3.5Ag solders with immersion Ag-plated Cu substrate during aging at 150 °C

2006 ◽  
Vol 21 (12) ◽  
pp. 3196-3204 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Jun Hyung Lim ◽  
Hoo-Jeong Lee ◽  
Jinho Joo ◽  
Seung-Boo Jung ◽  
...  
Keyword(s):  
Solder Joint ◽  
Eutectic Reaction ◽  
Bulk Solder ◽  
Interfacial Reactions ◽  
Test Results ◽  
Mechanical Reliability ◽  
Viable Option ◽  
Reaction Behavior ◽  
Cu Substrate ◽  
Joint Reliability

Joint reliability of immersion Ag with two different solders, Sn–37Pb and Sn–3.5Ag, were evaluated. We first compared the interfacial reactions of the two solder joints and also successfully revealed a connection between the interfacial reaction behavior and mechanical reliability. The Sn–Pb solder produced a Pb-rich phase along the interface between the solder and the Cu substrate during aging. In contrast, the Sn–Ag solder exhibits an off-eutectic reaction to produce the eutectic phase and Ag3Sn precipitate. The shear test results show that the Sn–Pb solder joint fractured along the interface showing brittle failure indications possibly due to the brittle Pb-rich layer. In contrast, the failure of Sn–Ag solder joint was only through the bulk solder, providing evidence that the interface is mechanically reliable. The results from this study confirm that the immersion Ag/Sn–Ag solder joint is mechanically robust, and thus the combination is a viable option for a Pb-free package system.

Microstructural evolution and interfacial reactions of fluxless-bonded Au-20Sn/Cu solder joint during reflow and aging

2007 ◽  
Vol 22 (10) ◽  
pp. 2817-2824 ◽  
Author(s):  
Jeong-Won Yoon ◽  
Hyun-Suk Chun ◽  
Hoo-Jeong Lee ◽  
Seung-Boo Jung
Keyword(s):  
High Temperature ◽  
Solid State ◽  
Intermetallic Compound ◽  
Solder Joint ◽  
Microstructural Evolution ◽  
Surface Finish ◽  
Solder Matrix ◽  
Interfacial Reactions ◽  
Cu Substrate ◽  
Study Results

The microstructural evolution and interfacial reactions of fluxless-bonded, Au-20wt%Sn/Cu solder joint were investigated during reflow and aging. After reflowing at 310 °C, only one thick and irregularly shaped ζ(Cu) layer was formed at the interface. After the prolonged reflow reaction, the AuCu layer was formed between the ζ(Cu) layer and the Cu substrate. During reflowing, the Cu substrate reacted primarily with the ζ-phase in the solder matrix. The solid-state interfacial reaction was much faster at 250 °C than at 150 °C. After aging at 250 °C for 100 h, thick ζ(Cu), AuCu and AuCu3 IMC layers were formed at the interface. The formation of the AuCu3 intermetallic compound (IMC) was caused by Cu enrichment at the AuCu/Cu layer interface. After aging for 500 h, cracks were observed inside the interfacial AuCu layer. The study results clearly demonstrate the need for an alternative surface finish on Cu, to ensure the high temperature reliability of the Au-20Sn/Cu solder joint.

Interfacial Reactions between Sn-Ag-Cu-Fe Composite Solder and Cu Substrate

2013 ◽  
Vol 706-708 ◽  
pp. 138-141
Author(s):  
Xiao Ying Liu ◽  
Ming Liang Huang ◽  
Ning Zhao
Keyword(s):  
Intermetallic Compound ◽  
Solder Joint ◽  
Growth Kinetics ◽  
Liquid State ◽  
Composite Solder ◽  
Interfacial Reactions ◽  
The Other ◽  
Cu Substrate ◽  
Soldering Process ◽  
Small Cracks

The growth kinetics and morphology of intermetallic compound (IMC) between Sn-3Ag-0.5Cu -xFe (x= 0, 0.5wt.%, 1wt.%) composite solders and Cu substrate were investigated in the present work. The Sn-Ag-Cu-Fe/Cu solder joint were prepared by reflowing for various durations at 250°C. During soldering process, Fe particles quickly deposited in the vicinity of IMC, resulting in the formation of Fe-rich area. It was shown that Fe could effectively retard the growth of interfacial Cu6Sn5 and Cu3Sn layers during liquid-state reaction and reduce the size of Cu6Sn5 grains. Small cracks were observed in the Cu6Sn5 grains of Sn-Ag-Cu/Cu interface after reflowing for 30 min while they were not found in the other composite solders.

Solder Joint Reliability of Sn-Cu and Sn-Ag-Cu Lead-Free Solder Alloys Solidified on Copper Substrates with Different Surface Roughnesses

2015 ◽  
Vol 830-831 ◽  
pp. 265-269
Author(s):  
Satyanarayan ◽  
K.N. Prabhu
Keyword(s):  
Solder Joint ◽  
Solder Matrix ◽  
Lead Free ◽  
Lead Free Solder ◽  
Solder Alloys ◽  
Cu Substrate ◽  
Cu Substrates ◽  
Free Solder ◽  
Substrate Surfaces ◽  
Lead Free Solders

In the present work, the bond strength of Sn-0.7Cu, Sn-0.3Ag-0.7Cu, Sn-2.5Ag-0.5Cu and Sn-3Ag-0.5Cu lead free solders solidified on Cu substrates was experimentally determined. The bond shear test was used to assess the integrity of Sn–Cu and Sn–Ag–Cu lead-free solder alloy drops solidified on smooth and rough Cu substrate surfaces. The increase in the surface roughness of Cu substrates improved the wettability of solders. The wettability was not affected by the Ag content of solders. Solder bonds on smooth surfaces yielded higher shear strength compared to rough surfaces. Fractured surfaces revealed the occurrence of ductile mode of failure on smooth Cu surfaces and a transition ridge on rough Cu surfaces. Though rough Cu substrate improved the wettability of solder alloys, solder bonds were sheared at a lower force leading to decreased shear energy density compared to the smooth Cu surface. A smooth surface finish and the presence of minor amounts of Ag in the alloy improved the integrity of the solder joint. Smoother surface is preferable as it favors failure in the solder matrix.

Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate

2019 ◽  
Vol 6 (7) ◽  
pp. 076310
Author(s):  
Nifa Bao ◽  
Xiaowu Hu ◽  
Qinglin Li ◽  
Shuang Li
Keyword(s):  
Interfacial Reactions ◽  
Cu Substrate

Interfacial reactions of lead-free Sn–Zn based solders on Cu and Cu plated electroless Ni–P/Au layer under aging at 150 °C

2004 ◽  
Vol 19 (12) ◽  
pp. 3560-3568 ◽  
Author(s):  
Chia-Wei Huang ◽  
Kwang-Lung Lin
Keyword(s):  
Intermetallic Compounds ◽  
Aging Time ◽  
Weight Percent ◽  
Interfacial Reactions ◽  
Experimental Results ◽  
Lead Free ◽  
Cu Substrate ◽  
Electroless Ni

The interfacial reactions of Sn–Zn based solder on Cu and Cu/Ni–P/Cu–plating substrates under aging at 150 °C were investigated in this study. The compositions of solders investigated were Sn–9Zn, Sn–8.55Zn–0.45Al, and Sn–8.55Zn–0.45Al–0.5Ag solders in weight percent. The experimental results indicated that the Cu substrate formed Cu5Zn8 with the Sn–9Zn solder and Al–Cu–Zn compound with Al–containing solders. However, it was detected that Cu6Sn5 formed at the Sn–9Zn/Cu interface and Cu5Zn8 formed at the Al–containing solders/Cu interface after aging for 1000 h. When it contacted with the Cu/Ni–P/Au substrate, the Sn–9Zn solder formed Au–Zn compound, and the Al–containing solders formed Al–Cu–Zn compound at the interface. After a long aging time, the intermetallic compounds existing between solders and the Cu/Ni–P/Au metallization layers almost did not grow. It was found that the interdiffusion between solders and Cu/Ni–P/Au was slower than that with Cu under aging. Furthermore, the addition of Ag to Sn–Zn solder resulted in the formation of AgZn3 particles at the interface.

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