scholarly journals Displacement Analysis of the MEMS Device

10.30544/504 ◽  
2020 ◽  
Author(s):  
Ishak Ertugrul
Keyword(s):  
Thermal Expansion ◽  
Heat Energy ◽  
High Conductivity ◽  
Metallic Materials ◽  
Microelectromechanical System ◽  
Current Passing ◽  
Displacement Analysis ◽  
Mems Technology ◽  
Mems Device

In this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the current flowing through the device. With the designed model, the amount of current required for the displacement of the MEMS device is determined. In addition, the displacements produced in the microdevice for different metallic materials (silver and gold) and input potentials (0.4 V, 0.8 V, and 1.2 V) were calculated. These types of materials are frequently preferred in MEMS technology due to their high conductivity. Increasing the voltage value as a result of the analysis studies increased the displacement of the materials. When 1.2 V voltage is applied, the highest displacement values for silver and gold are; 6.45 μm, 4.32 μm, respectively. According to the results, the silver material showed a significant displacement compared to gold material.

scholarly journals Modeling and thermal analysis of micro beam using COMSOL multiphysics

2021 ◽  
Vol 25 (Spec. issue 1) ◽  
pp. 41-49
Author(s):  
Osman Ulkir ◽  
Ishak Ertugrul ◽  
Oguz Girit ◽  
Sezgin Ersoy
Keyword(s):  
Functional Materials ◽  
Micro Electro Mechanical System ◽  
Temperature Data ◽  
Heat Energy ◽  
Comsol Multiphysics ◽  
Metallic Materials ◽  
Simulation Studies ◽  
Analysis Software ◽  
Current Passing ◽  
Beam Design

In this study, the design and analysis of the micro beam is carried out using COMSOL multiphysics. The current passing through the beam distributes the heat energy due to its resistance that pushes the entire micro beam to the desired distance through thermal expansion. This expansion varies depending on the amount of current passing through the beam and the emitted temperature. The purpose of the model created is to estimate the amount of current and temperature increase required to cause displacement in the proposed micro beam using analysis software. In addition, displacements and temperature data produced in micro beams for different metallic materials (Al, Cu, Ni, and Pt) and different input potentials (0.3 V, 0.6 V, and 0.9 V) are reported. These materials are used as functional materials in the field of micro-electro-mechanical-system because of their important physical and electrical properties. As a result of the simulation studies, increasing the voltage increased the displacement in the materials and the resulting temperature. While there is a serious difference between the displacement data of the materials, the temperatures are close to each other. When 0.9 V voltage is applied, the highest displacement values for Al, Cu, Ni, and Pt are; 7.88 ?m, 5.36 ?m, 3.62 ?m, and 2.72 ?m, respectively. As a result, it has been observed that aluminum used in micro beam design gives a significant amount of dis?placement for the proposed geometry when compared to other metallic beams.

scholarly journals On-Demand MEMS Device Production System by Module-Based Microfactory

2010 ◽  
Vol 4 (2) ◽  
pp. 110-116 ◽  
Author(s):  
Kiwamu Ashida ◽  
◽  
Shizuka Nakano ◽  
Jaehyuk Park ◽  
Jun Akedo
Keyword(s):  
Production System ◽  
High Performance ◽  
Thin Sheet ◽  
Aerosol Deposition ◽  
Micro Electro Mechanical Systems ◽  
Unit Process ◽  
On Demand ◽  
Mems Technology ◽  
Thin Sheet Metal ◽  
Mems Device

Many micro-scale devices have been developed by applying micro-electro-mechanical systems (MEMS) technology, but MEMS production facilities are large and costly, making it difficult to develop small numbers of trial devices. The novel on-demand MEMS device production system we developed applies two major concepts – that of the microfactory and the introduction of non-MEMS processes in microfabrication. These two concepts have made manufacturing more ecological, economical, agile, and flexible through downsizing, forming an automated production line by connecting standardized unit-processing cells, each of which has a desktop process, a part transfer robot, and a standardized connection interface. These enable any process cell to be connected in any sequence that the target product requires. Four unit-process cells were developed – the micropress cell for fabricating microstructures from thin sheet metal and the miniature aerosol deposition (AD) process cell for fabricating high-performance piezoelectric (PZT) ceramics actuators. The feasibility of the on-demand MEMS production system was demonstrated by the fabrication of a MEMS-like micromirror scanner, proving the potential of on-demand MEMS production in diversified small-lot production.

scholarly journals Colocalized Sensing and Intelligent Computing in Micro-Sensors

Sensors ◽  
2020 ◽  
Vol 20 (21) ◽  
pp. 6346
Author(s):  
Mohammad H Hasan ◽  
Ali Al-Ramini ◽  
Eihab Abdel-Rahman ◽  
Roozbeh Jafari ◽  
Fadi Alsaleem
Keyword(s):  
Electrical Signal ◽  
Virtual Node ◽  
Noise Resistance ◽  
Microelectromechanical System ◽  
Analog To Digital ◽  
Intelligent Computing ◽  
Electrostatically Actuated ◽  
Digital To Analog Converters ◽  
Mems Sensor ◽  
Mems Device

This work presents an approach to delay-based reservoir computing (RC) at the sensor level without input modulation. It employs a time-multiplexed bias to maintain transience while utilizing either an electrical signal or an environmental signal (such as acceleration) as an unmodulated input signal. The proposed approach enables RC carried out by sufficiently nonlinear sensory elements, as we demonstrate using a single electrostatically actuated microelectromechanical system (MEMS) device. The MEMS sensor can perform colocalized sensing and computing with fewer electronics than traditional RC elements at the RC input (such as analog-to-digital and digital-to-analog converters). The performance of the MEMS RC is evaluated experimentally using a simple classification task, in which the MEMS device differentiates between the profiles of two signal waveforms. The signal waveforms are chosen to be either electrical waveforms or acceleration waveforms. The classification accuracy of the presented MEMS RC scheme is found to be over 99%. Furthermore, the scheme is found to enable flexible virtual node probing rates, allowing for up to 4× slower probing rates, which relaxes the requirements on the system for reservoir signal sampling. Finally, our experiments show a noise-resistance capability for our MEMS RC scheme.

Through the years with on-a-chip gas chromatography: a review

Lab on a Chip ◽  
2015 ◽  
Vol 15 (12) ◽  
pp. 2559-2575 ◽  
Author(s):  
F. Haghighi ◽  
Z. Talebpour ◽  
A. Sanati-Nezhad
Keyword(s):  
Gas Chromatography ◽  
Small Volume ◽  
Microelectromechanical System ◽  
Low Concentration ◽  
Mems Technology

In recent years, the need for measurement and detection of samples in situ or with very small volume and low concentration (low and sub-parts per billion) is a cause for miniaturizing systems via microelectromechanical system (MEMS) technology.

HIGH METALLIC RESISTIVITIES AND RESISTIVITY SATURATION: HIGH-PRESSURE AND THERMAL EXPANSION EFFECTS

1993 ◽  
Vol 07 (08) ◽  
pp. 491-499 ◽  
Author(s):  
BERTIL SUNDQVIST
Keyword(s):  
High Pressure ◽  
Thermal Expansion ◽  
High Pressures ◽  
Measured Temperature ◽  
Metallic Materials ◽  
High Pressure Studies ◽  
Graphite Intercalation ◽  
Recent Developments ◽  
High Transition ◽  
Source Of Information

Some recent developments in the field of resistivity saturation in metallic materials are discussed, concentrating on effects of thermal expansion and high pressures. It is shown that thermal expansion effects can significantly modify the measured temperature dependence of the resistivity, and that high pressure studies are an important, but little used, source of information. Examples are shown for transition metals and alloys, high transition temperature superconductors, and graphite intercalation compounds.

Fabrication of 3D Feed Horn Shape MEMS Antenna Array using MRPBI (Mirror Reflected Parallel Beam Illuminator) System with an Ultra-Slow-Rotated and Inclined X-Y-Z Stage

2001 ◽  
Vol 687 ◽  
Author(s):  
Jong-Yeon Park ◽  
Kun-Tae Kim ◽  
Sung Moon ◽  
James Jungho Pak
Keyword(s):  
Antenna Array ◽  
High Frequency ◽  
Device Fabrication ◽  
Parallel Beam ◽  
Optical Mems ◽  
High Frequency Structure Simulator ◽  
Novel Technique ◽  
Mems Technology ◽  
Mems Device ◽  
Array Fabrication

AbstractA 3D Feed horn shape MEMS antenna has some attractive features for array application, which can be used to improve microbolometer performance. Since MEMS technology have been faced many difficulties to fabrication of 3D feed horn shape MEMS antenna array itself. The purpose of this paper is to propose a new fabrication method to realize a 3D feed horn shape MEMS antenna array using a MRPBI(Mirror Reflected Parallel Beam Illuminator) system with an ultra-slow-rotated and inclined x-y-z stage. A high-aspect-ratio 300 [.proportional]m sidewalls had been fabricated using SU-8 negative photo resist. It can be demonstrated to feasibility of realize 3D feed horn shape MEMS antenna array fabrication. In order to study the effect of this novel technique, the 3D feed horn shape MEMS antenna array had been simulated with HFSS(High Frequency Structure Simulator) tools and then compared with traditional 3D theoretical antenna models. As a result, it seems possible to use a 3D feed horn shape MEMS antenna at the tera hertz band to improve microbolometer performance and optical MEMS device fabrication.

Fabrication and Characteristics of Silicon Bridge Magnetic Sensor Based on Cantilever Beam

2014 ◽  
Vol 609-610 ◽  
pp. 1088-1093
Author(s):  
Lei Li ◽  
Xiao Feng Zhao ◽  
Yang Yu ◽  
Dian Zhong Wen ◽  
Jing Ya Cao ◽  
...  
Keyword(s):  
Magnetic Field ◽  
Cantilever Beam ◽  
Thin Film Transistors ◽  
Wheatstone Bridge ◽  
Magnetic Sensor ◽  
Element Analysis ◽  
Microelectromechanical System ◽  
The Finite Element Analysis ◽  
Mems Technology ◽  
Simulation Results

A silicon bridge magnetic sensor based on cantilever beam is presented in this paper. Thesensor is composed of the Wheatstone bridge that made up of nano-polysilicon thin-film transistors(TFTs) and a ferromagnetic magnet adhered to the free end of cantilever beam. Through building thesimulation model, the finite element analysis of the sensor is carried out by using ANSYS software.The results show that this sensor can realize the measurement to the external magnetic field. Accordingto the simulation results, fabrication and packaging of the sensor chip are achieved by using the microelectromechanical system (MEMS) technology. Experiment result shows that when the supply voltageis 3.0 V, the sensitivity of the sensor is 94 mV/T.

scholarly journals DEVELOPMENT OF A NEW STRUCTURE OF 3-DOF PIEZORESISTIVE ACCELEROMETER TO ENHANCE THE SENSITIVITY

2010 ◽  
Vol 13 (2) ◽  
pp. 57-65
Author(s):  
Tan Duc Tran
Keyword(s):  
Mechanical System ◽  
Degrees Of Freedom ◽  
Micro Electro Mechanical System ◽  
Ansys Software ◽  
Mems Sensors ◽  
Mems Technology ◽  
Mems Device ◽  
Three Degrees Of Freedom

Nowadays, the Micro Electro Mechanical System (MEMS) technology’ has been achieved great developments. Accelerometer is one kind of the most popular MEMS sensors due to it's widely applications. In order to fabricate any MEMS device, the design and simulation have been considered seriously. This paper presents a new design of the three degrees of freedom piezoresistive accelerometer to improve the sensitivity, urgent demand from the reality. The ANSYS software was utilized to design, simulate and evaluate the advantages of this new structure compared to other sensors fabricated previously.

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