scholarly journals Modeling and thermal analysis of micro beam using COMSOL multiphysics

2021 ◽  
Vol 25 (Spec. issue 1) ◽  
pp. 41-49
Author(s):  
Osman Ulkir ◽  
Ishak Ertugrul ◽  
Oguz Girit ◽  
Sezgin Ersoy
Keyword(s):  
Functional Materials ◽  
Micro Electro Mechanical System ◽  
Temperature Data ◽  
Heat Energy ◽  
Comsol Multiphysics ◽  
Metallic Materials ◽  
Simulation Studies ◽  
Analysis Software ◽  
Current Passing ◽  
Beam Design

In this study, the design and analysis of the micro beam is carried out using COMSOL multiphysics. The current passing through the beam distributes the heat energy due to its resistance that pushes the entire micro beam to the desired distance through thermal expansion. This expansion varies depending on the amount of current passing through the beam and the emitted temperature. The purpose of the model created is to estimate the amount of current and temperature increase required to cause displacement in the proposed micro beam using analysis software. In addition, displacements and temperature data produced in micro beams for different metallic materials (Al, Cu, Ni, and Pt) and different input potentials (0.3 V, 0.6 V, and 0.9 V) are reported. These materials are used as functional materials in the field of micro-electro-mechanical-system because of their important physical and electrical properties. As a result of the simulation studies, increasing the voltage increased the displacement in the materials and the resulting temperature. While there is a serious difference between the displacement data of the materials, the temperatures are close to each other. When 0.9 V voltage is applied, the highest displacement values for Al, Cu, Ni, and Pt are; 7.88 ?m, 5.36 ?m, 3.62 ?m, and 2.72 ?m, respectively. As a result, it has been observed that aluminum used in micro beam design gives a significant amount of dis?placement for the proposed geometry when compared to other metallic beams.

scholarly journals Displacement Analysis of the MEMS Device

10.30544/504 ◽  
2020 ◽  
Author(s):  
Ishak Ertugrul
Keyword(s):  
Thermal Expansion ◽  
Heat Energy ◽  
High Conductivity ◽  
Metallic Materials ◽  
Microelectromechanical System ◽  
Current Passing ◽  
Displacement Analysis ◽  
Mems Technology ◽  
Mems Device

In this study, the displacement analysis of the microelectromechanical system (MEMS) device was performed. The current passing through the microdevice radiates heat energy as it pushes the device to the desired distance through thermal expansion. The amount of expansion varies depending on the current flowing through the device. With the designed model, the amount of current required for the displacement of the MEMS device is determined. In addition, the displacements produced in the microdevice for different metallic materials (silver and gold) and input potentials (0.4 V, 0.8 V, and 1.2 V) were calculated. These types of materials are frequently preferred in MEMS technology due to their high conductivity. Increasing the voltage value as a result of the analysis studies increased the displacement of the materials. When 1.2 V voltage is applied, the highest displacement values for silver and gold are; 6.45 μm, 4.32 μm, respectively. According to the results, the silver material showed a significant displacement compared to gold material.

scholarly journals Design and Simulation of MEMS Moisture Sensor Using COMSOL Multiphysics Software

2018 ◽  
Vol 7 (4.26) ◽  
pp. 141
Author(s):  
Muhamad Nazrin Ismail ◽  
Noriah Yusoff ◽  
Nor Hayati Saad ◽  
Amirul Abd Rashid
Keyword(s):  
Cost Effective ◽  
Micro Electro Mechanical System ◽  
Experimental Result ◽  
Comsol Multiphysics ◽  
Model Parameters ◽  
Moisture Sensor ◽  
Sensor Sensitivity ◽  
Sensor Devices ◽  
Major Application ◽  
Highly Correlated

Micro-electro-mechanical system (MEMS) is a hybrid technology that combines electronic, electric and mechanical technology in a micron-size system. This allowed for higher performance and multifunction devices fabricated at much lighter weight and cost effective. One of the major application of MEMS is in sensor devices area. This paper highlight the simulation study of a typical moisture sensor fabricated from Tungsten Interdigitated (IDE) MEMS device. Using COMSOL Multiphysics software, the moisture sensor was modelled based on the current material and physical dimension and layout. The model then go through validation proses to its sensitivity performance against the experimental result. Subsequently, the optimization on sensor sensitivity was carried out by varying the model parameters including the sensor physical dimension, working temperature and humidity. The simulation result suggest that the sensor sensitivity is highly correlated to the electrode distance value. The average sensitivity of the sensor improved to ~48% better when the distance between reduced to 50% from 6 micron to 3 micron tested at temperature between 25 ̊ C to 45 ̊ C. This information is valuable as the input to the sensor designer in finalizing the MEMS physical layout in producing highly sensitive moisture sensor devices.  

Experimental Research on Thermal and Vibration Performance of High-Speed Spindle

2011 ◽  
Vol 411 ◽  
pp. 42-45 ◽  
Author(s):  
Huai Xing Wen ◽  
Jiang Fei Su
Keyword(s):  
High Speed ◽  
Small Error ◽  
Temperature Data ◽  
Analysis Software ◽  
Vibration Acceleration ◽  
Vibration Displacement ◽  
Working Status ◽  
Analysis System ◽  
Vibration Performance ◽  
Acceleration Signals

Temperature data and vibration acceleration signals of both ends of high-speed spindle in different speeds are gathered by the DHDAS dynamic signal testing analysis system when spindle is in the working status. And the own analysis software and MATLAB are applied to analyze it. Temperature curves and vibration displacement curves are obtained after real and effective information is extracted. It can provide the basis for the research and analysis of spindle performance. The experiment results show that the method is real-time, efficient and has strong anti-jamming capability and small error. It can perform effectively in high-speed spindle studies.

Modeling a Three-Axis Thermal MEMS Gyroscope

2012 ◽  
Author(s):  
Nilgoon Zarei ◽  
Albert M. Leung ◽  
John D. Jones
Keyword(s):  
Three Dimensional ◽  
Element Model ◽  
Micro Electro Mechanical System ◽  
Comsol Multiphysics ◽  
Mems Gyroscope ◽  
Mems Gyroscopes ◽  
Dimensional Finite Element ◽  
Axis Rotation ◽  
Three Dimensional Finite Element ◽  
Single Axis Rotation

This paper reports modeling of a three-axis thermal Micro-Electro-Mechanical System, MEMS, gyroscope through the use of the COMSOL Multiphysics software package. Being very small and having no movable parts makes the thermal MEMS gyroscope very reliable. Previously designed Thermal MEMS gyroscopes have the capability of detecting single-axis rotation. A three-dimensional finite-element model of the device has been developed to investigate three-axis rotation detection possibilities. The effect of gravity has been also investigated and we show techniques for suppressing this interference.

Optimized Ionic Wind-Based Cooling Microfabricated Devices for Improving a Measured Coefficient of Performance

2011 ◽  
Author(s):  
Andojo Ongkodjojo ◽  
Alexis R. Abramson ◽  
Norman C. Tien
Keyword(s):  
Three Dimensional ◽  
Heat Removal ◽  
Temperature Data ◽  
Coefficient Of Performance ◽  
Comsol Multiphysics ◽  
Air Cooling ◽  
Ionic Wind ◽  
Cooling Systems ◽  
Removal Capacity ◽  
Cooling Technology

This work is a continuation of previous investigations aimed at developing an innovative microfabricated air-cooling technology that employs an electrohydrodynamic corona discharge (i.e. ionic wind pump) [1], [2]. This technology enables the miniaturization of cooling systems for next generation electronics. Our single ionic wind pump element consists of two parallel collecting electrodes between which a single emitting tip is positioned. Two-dimensional (2-D) and three-dimensional (3-D) simulations using COMSOL Multiphysics™ are additionally employed to predict the temperature distribution, the flow field, and the heat removal capacity of the device in operation. One such model utilizes a small gap between collector and emitter electrodes and demonstrates an improvement in the COP (coefficient of performance) of a single device. Comparisons are made with experimental temperature data on an actual device. The purpose of this work is therefore to optimize the performance of a single microfabricated ionic wind pump to enable the development of an array of these elements for use in larger-scale heat transfer applications.

COMPARATIVE STUDY OF DIFFERENT MICRO-THERMAL ACTUATORS FOR MICRO-ELECTRO-MECHANICAL-SYSTEM APPLICATION

2012 ◽  
Vol 11 (01) ◽  
pp. 17-26
Author(s):  
P. K. PATOWARI ◽  
M. M. NATH ◽  
A. S. BHARALI ◽  
J. GOGOI ◽  
C. K. SINGH
Keyword(s):  
Comparative Study ◽  
Single Crystal Silicon ◽  
Micro Electro Mechanical System ◽  
Silicon Single Crystal ◽  
Comsol Multiphysics ◽  
Crystal Silicon ◽  
Thermal Actuators ◽  
Basic Model ◽  
Deflection Analysis ◽  
Improved Performance

This paper presents a comparative study of three micro-thermal actuators, which differ in their construction and material being used. Model-I is the basic model and Model-II and Model-III are developed with a view to achieve improved performance over Model-I. The main objective of this analysis is to achieve greater deflection from the considered actuator models under a range of applied voltages. Apart from deflection analysis, analyses for temperature distribution and stress developed in the actuator models are also carried out for feasibility study. The materials under consideration are poly-silicon, single crystal silicon, and titanium. The software used for modeling and simulation is Comsol Multiphysics.

Advancing the Modelling Environment for the Safety Assessment of the Swedish LILW Repository at Forsmark

2015 ◽  
Vol 1744 ◽  
pp. 223-228 ◽  
Author(s):  
Henrik von Schenck ◽  
Ulrik Kautsky ◽  
Björn Gylling ◽  
Elena Abarca ◽  
Jorge Molinero
Keyword(s):  
Safety Assessment ◽  
Coupled Processes ◽  
Comsol Multiphysics ◽  
Surface Model ◽  
Analysis Software ◽  
Surface Hydrology ◽  
Dynamic Surface ◽  
Near Surface ◽  
Regional Hydrogeology ◽  
Modelling Environment

ABSTRACTAn extension of the Swedish final repository for short-lived radioactive waste (SFR) is planned and a safety assessment has been performed as part of the licensing process. Within this work, steps have been taken to advance the modelling environment to better integrate its individual parts. It is desirable that an integrating modelling environment provides the framework to set up and solve a consistent hierarchy of models on different scales. As a consequence, the consistent connection between software tools and models needs to be considered, related to the full assessment domain. It should also be possible to include the associated geometry and material descriptions, minimizing simplifications of conceptual understanding.The usefulness of the analysis software Comsol Multiphysics as component of an integrating modelling environment has been tested. Here, we present two examples of hierarchical models. Consistent properties and boundary conditions have been extracted form regional hydrogeology and surface hydrology models when setting up repository scale models. CAD models of the repository have been imported into the analysis software, representing tunnel systems and storage vaults with engineered structures and barriers. Data from geographic information systems such as digital elevation models and geological formations have been also directly implemented into model geometries.The repository scale hydrology models have provided a basis for further developments focussed on the modelling of coupled processes. An interface between Comsol Multiphysics and the geochemical simulator Phreeqc has been developed to support reactive solute transport studies. An important test case concerns radionuclide transport in a 3D, near-surface model of a catchment area. The dynamic surface hydrology has been simulated with MIKE SHE and connected to Comsol Multiphysics and Phreeqc for detailed hydro-geo-chemical modelling of radionuclide migration through soils and sediments.

Design analysis of polysilicon piezoresistors PDMS (Polydimethylsiloxane) microcantilever based MEMS Force sensor

2020 ◽  
Vol 34 (09) ◽  
pp. 2050072 ◽  
Author(s):  
Monica Lamba ◽  
Naman Mittal ◽  
Kulwant Singh ◽  
Himanshu Chaudhary
Keyword(s):  
Finite Element Analysis ◽  
High Sensitivity ◽  
Force Sensor ◽  
Sensitivity Enhancement ◽  
Micro Electro Mechanical System ◽  
Design Analysis ◽  
Comsol Multiphysics ◽  
Element Analysis ◽  
Operating Range ◽  
Low Magnitude

This study is aimed for the analysis of different designs for sensing low magnitude forces which lies in the micro-Newton range and suitable for biomimetic microbotics. For this, a flexible and high sensitive Micro Electro Mechanical System (MEMS) based Force sensor using piezoresistive sensing mechanism has been analyzed. Design analysis is carried out for sensitivity enhancement on microcantilever by incorporating various combinations of stress concentrated regions (SCR) and their respective arrays. The materials under consideration for sensor are polysilicon piezoresistors and Polydimethylsiloxane (PDMS) microcantilever. For design analysis, the designing and simulation work is assessed using Finite Element Analysis approach in COMSOL Multiphysics 5.3a software. The results revealed that the electrical sensitivity of 1.62 mV/[Formula: see text]N within (0–100) [Formula: see text]N operating range is achieved for microcantilever with rectangular SCR with square SCR array. This operating range has many applications in microbotic field such as sensing tactile movements. Hence, MEMS Force sensor for low magnitude forces has been designed with high sensitivity and flexibility.

Simulation Studies Related to GARP

1970 ◽  
Vol 51 (6) ◽  
pp. 490-514 ◽  
Author(s):  
Robert Jastrow ◽  
Milton Halem
Keyword(s):  
Simulated Data ◽  
Extended Period ◽  
Temperature Data ◽  
Temperature Profiles ◽  
Simulation Studies ◽  
Series Of Experiments ◽  
The Tropics ◽  
The Relationship ◽  
Initial Results ◽  
Valuable Role

A series of simulation studies has been conducted in an effort to obtain information relevant to the planning of the First GARP Global Experiment. Thus far, the studies have used only the Mintz-Arakawa 1969 model, and have been concerned mainly with the utilization of IR vertical sounding measurements. The initial results indicate that temperature profiles derived from these measurements can play a valuable role, provided they are used on a continuing, day-to-day basis over an extended period. Temperature data used in this way appear to have a controlling influence on all other meteorological variables in the model, including winds and pressure in particular. Assuming a mean error of 1C in the temperature data, and assuming the coverage provided by the planned GARP satellite configuration of two polar orbiting satellites containing IR sounders with full side-scan capability, the experiments indicate that winds are determined within an error of 2 m sec−1 and pressures within an error of 2 mb. The wind and pressure determinations are significantly improved if (i) IR sounders are added to the geostationary satellites, (ii) the number of polar orbiting satellites is increased, or (iii) the errors in the temperature data are decreased. If the side-scan capability is reduced, the wind and pressure determinations are substantially worsened, and may fail entirely. The validity of these results is limited by (i) the defects of the model, especially in the tropics, (ii) the use of simulated data in place of real observations, and (iii) the fact that the experiments use a comparison with the solutions to the model as a test of the accuracy of the results, in place of a comparison with actual observations of winds and pressures. A second series of experiments has been concerned with the relationship between the error limits specified in the global observations and the accuracy of the forecasts that will be based on these observations. The results indicate that with the present GARP data specifications, i.e., ± 3 m sec−1 in winds, ± 1C in temperature, and ± 3 mb in pressure, the forecasts begin to deteriorate on the 5th day and are misleading in major respects after the 8th day. The limit of deterministic predictability is reached in three weeks in agreement with the results of other studies. Further experiments indicate that the accuracy of the forecasts is limited primarily by the errors in the wind components, and secondarily by pressure errors. If the error limits are tightened to 1.5 m sec−1 in winds and to 2 mb in pressure, the forecasts are accurate in all major respects for 7 or 8 days. In order to secure accurate forecasts for 12 to 14 days, the error limits must be tightened to 0.5 m sec−1, 0.5 mb and 0.5C. In all cases, the limit of deterministic predictability is two or three times greater than the range of accurate forecasts.

scholarly journals Mems Electromagnetic Micro Relays Overview and Design Considerations

1970 ◽  
Vol 6 (2) ◽  
Author(s):  
Zuraini Dahari, Thurai Vinay and Dinesh Sood
Keyword(s):  
Unit Cost ◽  
Micro Electro Mechanical System ◽  
Simulation Studies ◽  
Design Considerations ◽  
Electromagnetic Relay ◽  
Batch Fabrication ◽  
Mems Technology ◽  
Commercial Applications ◽  
Reliability Of Operation ◽  
Novel Design

Miniature electromagnetic relay matrices capable of switching currents up to one ampere range are  widely used in commercial applications such as instrumentation and telecommunication. Traditionally these devices have been fabricated from a number of discrete components, however in recent years the emergence of Micro Electro Mechanical System (MEMS) technology has opened up the possibility for batch fabrication of microrelays at much reduced unit cost. While several electromagnetic microrelay designs have been successfully developed and commercialized for use as individual units, development work on electromagnetic microrelay matrices where individual relays can be selectively switched on and off have been fewer and less successful. Due to inherent limitations of the micromachining processes, significant dimensional and material property variations occur among individual relays in a matrix. These variations severely limit the tolerance window and hence the reliability of operation of the device. After reviewing existing designs of electromagnetic microrelays, a set of desirable design features that would make the electromagnetic microrelay more robust are identified.  A novel design incorporating these features is proposed and preliminary results of ANSYS1 simulation studies are presented.Keywords: MEMS, microrelay and electromagnetic

Sign in / Sign up

Export Citation Format

Share Document