Consideration of Cluster Design Approach for High Power Hall Propulsion

2003 ◽  
Author(s):  
Leonid Zakharenkov ◽  
Alexander Semenkin ◽  
Sergey Tverdokhlebov ◽  
Georgii Karabadzhak ◽  
Vladimir Baranov
Keyword(s):  
High Power ◽  
Design Approach ◽  
Cluster Design

High-Power LED Constant Current Dimming Circuit Design

2012 ◽  
Vol 182-183 ◽  
pp. 411-415
Author(s):  
Jun Sun ◽  
Bo Xiang ◽  
Ping Zhou ◽  
Xiu Ying Wang
Keyword(s):  
Circuit Design ◽  
Software Design ◽  
High Power ◽  
Design Method ◽  
Design Approach ◽  
Constant Current ◽  
Design Requirement ◽  
Digital Potentiometer ◽  
Hardware Circuit ◽  
Electronic Design

In this paper, an adjustable constant current circuit is designed by combining the digital potentiometer X9312 and the microcontroller 89C52. We first introduce the overall component and structure of the constant current dimming circuit which needs to be designed. Then, the hardware circuit design and the software design are discussed in detail. Based on the proposed design method, the manufacturing and the testing of the prototype machine are taken at last. The testing results are satisfactory, and meet the design requirement. The proposed design approach has won award in 2009 National Undergraduate Electronic Design Contest.

Vertical Design Approach for Suppressing Power Saturation in GaAs-Based High-Power Diode Lasers

2021 ◽  
Author(s):  
Seval Arslan ◽  
Anisuzzaman Boni ◽  
Andre Maasdorf ◽  
Gotz Erbert ◽  
Dominik Martin ◽  
...  
Keyword(s):  
High Power ◽  
Diode Lasers ◽  
Design Approach ◽  
Power Diode

scholarly journals Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

2019 ◽  
Author(s):  
Emre Gurpinar ◽  
Burak Ozpineci ◽  
Shajjad Chowdhury
Keyword(s):  
High Power ◽  
Wide Bandgap ◽  
Design Analysis ◽  
Design Approach ◽  
Element Analysis ◽  
Promising Alternative ◽  
Dielectric Thickness ◽  
Metal Substrates ◽  
Power Modules ◽  
Transient Thermal

Abstract In this technical paper, design, analysis and comparison of insulated metal substrates for high power wide-bandgap semiconductor-based power modules is discussed. The paper starts with technical description and discussion of state-of-the-art direct bonded copper substrates with different ceramic insulators such as AlN, Al2O3 and Si3N4. This is followed by introduction of insulated metal substrates, material properties and options on each layer, and design approach for high power applications. The properties of dielectric thickness, and impact on power handling capability of the substrate are discussed. Insulated metal substrate design approach for SiC MOSFET based power modules is presented. Finite element analysis-based characterization and comparison of different designs including steady-state and transient thermal response is presented. The results show that IMS is a promising alternative to DBC in high power modules with improved transient thermal performance. IMS provides flexible building structure with multi-layer stacking options and variable thicknesses at different layers.

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