scholarly journals Design, Analysis and Comparison of Insulated Metal Substrates for High Power Wide-Bandgap Power Modules

2019 ◽  
Author(s):  
Emre Gurpinar ◽  
Burak Ozpineci ◽  
Shajjad Chowdhury
Keyword(s):  
High Power ◽  
Wide Bandgap ◽  
Design Analysis ◽  
Design Approach ◽  
Element Analysis ◽  
Promising Alternative ◽  
Dielectric Thickness ◽  
Metal Substrates ◽  
Power Modules ◽  
Transient Thermal

Abstract In this technical paper, design, analysis and comparison of insulated metal substrates for high power wide-bandgap semiconductor-based power modules is discussed. The paper starts with technical description and discussion of state-of-the-art direct bonded copper substrates with different ceramic insulators such as AlN, Al2O3 and Si3N4. This is followed by introduction of insulated metal substrates, material properties and options on each layer, and design approach for high power applications. The properties of dielectric thickness, and impact on power handling capability of the substrate are discussed. Insulated metal substrate design approach for SiC MOSFET based power modules is presented. Finite element analysis-based characterization and comparison of different designs including steady-state and transient thermal response is presented. The results show that IMS is a promising alternative to DBC in high power modules with improved transient thermal performance. IMS provides flexible building structure with multi-layer stacking options and variable thicknesses at different layers.

scholarly journals Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

2020 ◽  
Vol 142 (4) ◽  
Author(s):  
Emre Gurpinar ◽  
Burak Ozpineci ◽  
Shajjad Chowdhury
Keyword(s):  
Steady State ◽  
Thermal Performance ◽  
High Power ◽  
Coefficient Of Thermal Expansion ◽  
Wide Bandgap ◽  
Design Analysis ◽  
Dielectric Thickness ◽  
Metal Substrates ◽  
Power Modules ◽  
Transient Thermal

Abstract Direct bonded copper (DBC) substrates used in power modules have limited heat spreading and manufacturing capability due to ceramic properties and manufacturing technology. The ceramic and copper bonding is also subject to high mechanical stress due to coefficient of thermal expansion mismatch between the copper and the ceramic. For wide-bandgap (WBG) devices, it is of interest exploring new substrate technologies that can overcome some of the challenges of direct bonded copper substrates. In this technical paper, the design, analysis, and comparison of insulated metal substrates (IMSs) for high-power wide-bandgap semiconductor-based power modules are discussed. This paper starts with technical description and discussion of state-of-the-art DBC substrates with different ceramic insulators such as aluminum nitride (AlN), Al2O3, and Si3N4. Next, an introduction of IMSs and their material properties, and a design approach for SiC (silicon carbide) metal-oxide-semiconductor field-effect transistor (MOSFET)-based power modules for high-power applications is provided. The influence of dielectric thickness on the power handling capability of the substrate are also discussed. The designed IMS and DBC substrates were characterized in terms of steady-state and transient thermal performance using finite element simulation. Finally, the performance of the IMS and DBC are validated in an experimental setup under different loading and cooling temperature conditions. The simulation and experimental results showed that the IMS can provide high steady-state thermal performance for high-power modules based on SiC MOSFETs. Furthermore, the IMS provided enhanced transient thermal performance, which provided a reduced junction temperature when the module is operated at low fundamental output frequencies in traction drive systems.

Performance analysis of magnetic gear with Halbach array for high power and high speed

2020 ◽  
Vol 64 (1-4) ◽  
pp. 959-967
Author(s):  
Se-Yeong Kim ◽  
Tae-Woo Lee ◽  
Yon-Do Chun ◽  
Do-Kwan Hong
Keyword(s):  
Permanent Magnet ◽  
Eddy Current ◽  
High Power ◽  
High Speed ◽  
Torque Ripple ◽  
Eddy Current Loss ◽  
Element Analysis ◽  
Current Loss ◽  
Halbach Array ◽  
Magnetic Gear

In this study, we propose a non-contact 80 kW, 60,000 rpm coaxial magnetic gear (CMG) model for high speed and high power applications. Two models with the same power but different radial and axial sizes were optimized using response surface methodology. Both models employed a Halbach array to increase torque. Also, an edge fillet was applied to the radial magnetized permanent magnet to reduce torque ripple, and an axial gap was applied to the permanent magnet with a radial gap to reduce eddy current loss. The models were analyzed using 2-D and 3-D finite element analysis. The torque, torque ripple and eddy current loss were compared in both models according to the materials used, including Sm2Co17, NdFeBs (N42SH, N48SH). Also, the structural stability of the pole piece structure was investigated by forced vibration analysis. Critical speed results from rotordynamics analysis are also presented.

Based on ANSYS Planetary Gear Ransmission Design Analysis

2011 ◽  
Vol 314-316 ◽  
pp. 1218-1221
Author(s):  
Hao Min Huang
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Contact Stress ◽  
Planetary Gear ◽  
Design Analysis ◽  
Ansys Software ◽  
Element Analysis ◽  
Planet Gear ◽  
Gear Contact ◽  
Transmission Gear

Conventional methods of design to be completed ordinary hydraulic transmission gear gearbox design, but for such a non-planet-rule entity, and the deformation of the planet-gear contact stress will have a great impact on the planet gear, it will be very difficult According to conventional design. In this paper, ANSYS software to the situation finite element analysis, the planetary gear to simulate modeling study.

scholarly journals Interleaved, Switched Inductor and High-Gain Wide Bandgap Based Boost Converter Proposal

Energies ◽  
2021 ◽  
Vol 14 (4) ◽  
pp. 800
Author(s):  
David Marroqui ◽  
Ausias Garrigós ◽  
Cristian Torres ◽  
Carlos Orts ◽  
Jose M. Blanes ◽  
...  
Keyword(s):  
Power Density ◽  
High Power ◽  
Low Voltage ◽  
High Gain ◽  
Wide Bandgap ◽  
High Power Density ◽  
Boost Converters ◽  
Proposal A ◽  
Current Ripples ◽  
Current Ripple

Many applications (electric vehicles, renewable energies, low-voltage DC grids) require simple, high-power density and low-current ripple-boost converters. Traditional step-up converters are limited when large transformation ratios are involved. In this work is proposed a step-up converter that brings together the characteristics of high gain, low ripple, and high-power density. From the converter proposal, a mathematical analysis of its operation is first performed, including its static transfer function, stress of components, and voltage and current ripples. Furthermore, it provides a design example for an application of Vin = 48 V to Vo = 270 V and 500 W. For its implementation, two different wide bandgap (WBG) semiconductor models have been used, hybrid GaN cascodes and SiC MOSFETs. Finally, the experimental results of the produced prototypes are shown, and the results are discussed.

Transient thermal properties of high-power diode laser bars

2007 ◽  
Author(s):  
Mathias Ziegler ◽  
Fritz Weik ◽  
Jens W. Tomm ◽  
Thomas Elsaesser ◽  
Wlodzimierz Nakwaski ◽  
...  
Keyword(s):  
Thermal Properties ◽  
Diode Laser ◽  
High Power ◽  
Transient Thermal ◽  
Power Diode ◽  
High Power Diode Laser

Finite Element Analysis of a Gasketed Flange Joint Under Combined Internal Pressure and Thermal Transient Loading

2007 ◽  
Author(s):  
Muhammad Abid ◽  
Javed A. Chattha ◽  
Kamran A. Khan
Keyword(s):  
Finite Element Analysis ◽  
Steady State ◽  
Internal Pressure ◽  
Thermal Loading ◽  
Flange Joint ◽  
Element Analysis ◽  
Transient Loading ◽  
Thermal Transient ◽  
Transient Thermal ◽  
Bolted Flange

Performance of a bolted flange joint is characterized mainly by its ‘strength’ and ‘sealing capability’. A number of analytical and experimental studies have been conducted to study these characteristics only under internal pressure loading. In the available published work, thermal behavior of the pipe flange joints is discussed under steady state loading with and without internal pressure and under transient loading condition without internal pressure. The present design codes also do not address the effects of steady state and thermal transient loading on the structural integrity and sealing ability. It is realized that due to the ignorance of any applied transient thermal loading, the optimized performance of the bolted flange joint can not be achieved. In this paper, in order to investigate gasketed joint’s performance i.e. joint strength and sealing capability under combined internal pressure and transient thermal loading, an extensive nonlinear finite element analysis is carried out and its behavior is discussed.

Epitaxial growth of β-Ga2O3 (-201) thin film on fourfold symmetry CeO2 (001) substrate for heterogeneous integrations

2021 ◽  
Author(s):  
Xiao Tang ◽  
Kuanghui Li ◽  
Che-Hao Liao ◽  
Dongxing Zheng ◽  
chen Liu ◽  
...  
Keyword(s):  
Thin Film ◽  
Thin Films ◽  
Epitaxial Growth ◽  
Gas Sensors ◽  
High Power ◽  
Wide Bandgap ◽  
Semiconductor Material ◽  
Uv Detectors ◽  
Wide Bandgap Semiconductor ◽  
Fourfold Symmetry

β-Ga2O3 is a wide bandgap semiconductor material promising for many fields such as gas sensors, UV detectors, and high power electronics. Until now, most epitaxial β-Ga2O3 thin films could only...

scholarly journals Facile Formation of High-Quality InGaN/GaN Quantum-Disks-in-Nanowires on Bulk-Metal Substrates for High-Power Light-Emitters

Nano Letters ◽  
2016 ◽  
Vol 16 (2) ◽  
pp. 1056-1063 ◽  
Author(s):  
Chao Zhao ◽  
Tien Khee Ng ◽  
Nini Wei ◽  
Aditya Prabaswara ◽  
Mohd S. Alias ◽  
...  
Keyword(s):  
High Power ◽  
Light Emitters ◽  
High Quality ◽  
Bulk Metal ◽  
Metal Substrates ◽  
Quantum Disks
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