Effect of copper addition on localized deformation near grain boundaries in an Al-1.0mass%Mg2Si alloy.

1998 ◽  
Vol 48 (5) ◽  
pp. 207-211 ◽  
Author(s):  
Susumu IKENO ◽  
Kenji MATSUDA ◽  
Katsuyuki NAKAJIMA ◽  
Seichi RENGAKUJI ◽  
Yasuhiro UETANI
1992 ◽  
Vol 260 ◽  
Author(s):  
M. Park ◽  
S. J. Krause ◽  
S. R. Wilson

ABSTRACTThe effect of copper content on the reaction growth and morphology of Al12W in Al-Cu/Ti-W bilayers was studied with plan view and cross-section transmission electron microscopy. After heat treatment at 450°C for 30 minutes, a spiked growth of A112W penetrated into the grain boundaries of Al-0.5 wt.% Cu film by the reaction of Al with the Ti-W sublayer. Increasing copper addition from 0.5 to 1.5% inhibited the spiked growth of AI12W, resulting in a flat and planar layer (-150Å) of Al12W. It is suggested that increasing copper segregation in the aluminum grain boundaries during heat treatment at 450°C causes a significant change in the growth morphology of the Al12W compound.


2014 ◽  
Vol 02 (05) ◽  
pp. 470-483 ◽  
Author(s):  
J. O. Agunsoye ◽  
S. A. Bello ◽  
S. B. Hassan ◽  
R. G. Adeyemo ◽  
J. M. Odii

Molecules ◽  
2017 ◽  
Vol 22 (9) ◽  
pp. 1579 ◽  
Author(s):  
Matthew Bradley ◽  
Ramagopal Ananth ◽  
Heather Willauer ◽  
Jeffrey Baldwin ◽  
Dennis Hardy ◽  
...  

2019 ◽  
Vol 60 (8) ◽  
pp. 1688-1696 ◽  
Author(s):  
Kenji Matsuda ◽  
Toru Yasumoto ◽  
Artenis Bendo ◽  
Taiki Tsuchiya ◽  
Seungwon Lee ◽  
...  

2017 ◽  
Vol 735 ◽  
pp. 205-209
Author(s):  
Mohamed Abd El Naser Mansour ◽  
Ahmed Abdel-Moneim ◽  
Koichi Nakamura

The mechanical properties of sintered nanostructured Pb1-xCuxTe (0 ≤ x ≤ 0.2) alloy systems were investigated using nanoindentation technique. The powder precursors of the designed systems were prepared by ball milling technique and sintered by hot isostatic pressing. Cu acts as a dopant in these alloy systems, and an increase in its concentration, up to x = 0.1, leads to a more dense and refined nanostructure along with enhancements in both hardness and Young’s modulus. The Cu addition caused an apparent embrittlement in the materials, and spalling of the materials was recognized when x exceeded 0.15. These results imply that design parameters of complex mechanical environments under thermal shocks and vibrations cannot be determined only in terms of hardness and Young’s modulus of thermoelectric systems like Pb1-xCuxTe alloys.


2009 ◽  
Vol 67 ◽  
pp. 25-32 ◽  
Author(s):  
A.P. Srivastava ◽  
Dinesh Srivastava ◽  
K.G. Suresh ◽  
G.K. Dey

Effect of copper addition in a Metallic glass 2714A on the nanocrystallization characteristics have been examined in this study. Amorphous ribbon of the alloy composition Co64.5 Fe3.5 Si16.5 B13.5 Ni1Cu1 were prepared by melt spinning technique. Nanocrystallization kinetics was studied using differential scanning calorimeter technique. The kinetic parameters such as activation energy and Avrami exponent were determined using two different non-isothermal analysis methods. The kinetic behavior of individual crystallization event has been rationalized on the basis of these results. The role of addition of copper on the crystallization behavior has been understood by comparing with Metallic glass 2714A. The isothermally annealed nanocrystallized microstructures were characterized by X-ray diffraction.


Sign in / Sign up

Export Citation Format

Share Document