A new method for prediction of corrosion processes in Aluminum housing materials for electronic components

Review on the Integration of Microelectronics for E-Textile

Materials ◽

10.3390/ma14175113 ◽

2021 ◽

Vol 14 (17) ◽

pp. 5113

Author(s):

Abdella Ahmmed Simegnaw ◽

Benny Malengier ◽

Gideon Rotich ◽

Melkie Getnet Tadesse ◽

Lieva Van Langenhove

Keyword(s):

New Method ◽

Electronic Textiles ◽

Electronic Components ◽

Smart Textiles ◽

Electronic Elements ◽

Microelectronic Components ◽

Textile Fabric ◽

Levels Of Integration

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical, and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable, and washable to offer a superior usability, comfortability, and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile-adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

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A New Method for the Characterization of Electronic Components Immunity

IEEE Transactions on Instrumentation and Measurement ◽

10.1109/tim.2015.2412014 ◽

2015 ◽

Vol 64 (9) ◽

pp. 2496-2503 ◽

Cited By ~ 4

Author(s):

Ala Ayed ◽

Tristan Dubois ◽

Jean-Luc Levant ◽

Genevieve Duchamp

Keyword(s):

New Method ◽

Electronic Components

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Review on the Integration of Microelectronics for E-Textile

10.20944/preprints202107.0388.v2 ◽

2021 ◽

Author(s):

Abdella Ahmmed Simegnaw ◽

Benny Malengier ◽

Gideon K. Rotich ◽

Melkie Getnet Tadesse ◽

Lieva Van Langenhove

Keyword(s):

New Method ◽

Electronic Textiles ◽

Electronic Components ◽

Smart Textiles ◽

Electronic Elements ◽

Microelectronic Components ◽

Textile Fabric ◽

Levels Of Integration

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

Download Full-text

Review on the Integration of Microelectronics for E-textile

10.20944/preprints202107.0388.v1 ◽

2021 ◽

Author(s):

Abdella Ahmmed Simegnaw ◽

Benny Malengier ◽

Gideon K. Rotich ◽

Melkie Getnet Tadesse ◽

Lieva Van Langenhove

Keyword(s):

New Method ◽

Electronic Textiles ◽

Electronic Components ◽

Smart Textiles ◽

Electronic Elements ◽

Microelectronic Components ◽

Textile Fabric ◽

Levels Of Integration

Modern electronic textiles are moving towards flexible wearable textiles, so-called e-textiles that have micro-electronic elements embedded onto the textile fabric that can be used for varied classes of functionalities. There are different methods of integrating rigid microelectronic components into/onto textiles for the development of smart textiles, which include, but are not limited to, physical, mechanical and chemical approaches. The integration systems must satisfy being flexible, lightweight, stretchable and washable to offer a superior usability, comfortability and non-intrusiveness. Furthermore, the resulting wearable garment needs to be breathable. In this review work, three levels of integration of the microelectronics into/onto the textile structures are discussed, the textile-adapted, the textile-integrated, and the textile-based integration. The textile-integrated and the textile- adapted e-textiles have failed to efficiently meet being flexible and washable. To overcome the above problems, researchers studied the integration of microelectronics into/onto textile at fiber or yarn level applying various mechanisms. Hence, a new method of integration, textile-based, has risen to the challenge due to the flexibility and washability advantages of the ultimate product. In general, the aim of this review is to provide a complete overview of the different interconnection methods of electronic components into/onto textile substrate.

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Selective Sampling and Orientation of Non-Homogeneous Tissues

Proceedings, annual meeting, Electron Microscopy Society of America ◽

10.1017/s0424820100100238 ◽

1968 ◽

Vol 26 ◽

pp. 98-99

Author(s):

C. C. Clawson ◽

L. W. Anderson ◽

R. A. Good

Keyword(s):

Electron Microscopy ◽

Electron Microscope ◽

Light Microscopy ◽

Random Sampling ◽

New Method ◽

Microscope Examination ◽

Small Areas ◽

Selective Sampling ◽

Large Numbers ◽

Specific Orientation

Investigations which require electron microscope examination of a few specific areas of non-homogeneous tissues make random sampling of small blocks an inefficient and unrewarding procedure. Therefore, several investigators have devised methods which allow obtaining sample blocks for electron microscopy from region of tissue previously identified by light microscopy of present here techniques which make possible: 1) sampling tissue for electron microscopy from selected areas previously identified by light microscopy of relatively large pieces of tissue; 2) dehydration and embedding large numbers of individually identified blocks while keeping each one separate; 3) a new method of maintaining specific orientation of blocks during embedding; 4) special light microscopic staining or fluorescent procedures and electron microscopy on immediately adjacent small areas of tissue.

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