Laser welding with highly integrated sensor technology – Implemented in industry

Abstract The generation and variation of forces necessary to achieve a training stimulus is often realized in sports and rehabilitation equipment by manually adjustable masses or by complex motor-brake systems. This leads to heavy and unwieldy systems, which cannot be used flexibly, and in addition to high costs. The main objective of this paper is to prove that pseudoelastic shape memory alloys (SMA) are potentially suitable for use in sports and rehabilitation equipment and offer additional value in the area of training flexibility combined with high training resistance. Therefore, the properties of pseudoelastic SMAs for this application were investigated. These multifunctional materials offer the potential for special elastic and sensory properties. The pseudoelastic effect is based on stress-induced martensite formation, which allows high elastic deformations. During this phase transformation, the mechanical stress passes through a plateau. The stress plateau can be moved by changing the temperature of the SMA. The determination of properties of pseudoelastic SMAs with different alloy compositions was carried out according to the specifications of “VDI 2248: Product Development with Shape Memory Technology”. With a functional model based on the material tests, which replaces a commercially available force clamping device, the monitoring of force, displacement and temperature changes can be realized by the integrated sensor technology. This paper presents the methodology, experiments and findings for the use of pseudoelastic SMAs in sport and rehabilitation devices. It concludes with prospects to commercial application.

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Design of Wireless Sensor Network Based on PSoC

Advanced Materials Research ◽

10.4028/www.scientific.net/amr.433-440.5568 ◽

2012 ◽

Vol 433-440 ◽

pp. 5568-5572

Author(s):

Yan Sheng Bao ◽

Wei Yao ◽

Wei Zhang

Keyword(s):

Wireless Sensor Network ◽

Sensor Network ◽

Wireless Sensor ◽

Sensor Technology ◽

Embedded Computing ◽

Integrated Sensor ◽

Distributed Information ◽

Wireless Usb ◽

Entire Network

Wireless sensor network integrated sensor technology, embedded computing technology, distributed information processing technology and wireless communication technology etc. It can collect the information of objects in the network. Besides, the quality of wireless sensor network node can directly affect the life span of the entire network and the reliability of its data transmission. This paper discusses the hardware and software design of Parking Lock System in detail, using PSoC as the processor and wireless USB technology.

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Development of an Instrumented Test Tool for the Determination of Heat Transfer Coefficients for Die Casting Applications

Metals ◽

10.3390/met10091206 ◽

2020 ◽

Vol 10 (9) ◽

pp. 1206

Author(s):

Yosra Kouki ◽

Sebastian Müller ◽

Torsten Schuchardt ◽

Klaus Dilger

Keyword(s):

Heat Transfer ◽

Estimation Method ◽

Sensor Technology ◽

Depth Sensor ◽

Transfer Coefficients ◽

Integrated Sensor ◽

Heat Transfer Coefficients ◽

Test Tool ◽

Calculation Results ◽

Temperature Loads

In the case of casting processes with permanent molds, there is still a relatively pronounced lack of knowledge regarding the locally prevailing heat transfer between casts and mold. This in turn results in an insufficient knowledge of the microstructure and the associated material properties in the areas of the casting component close to the surface. Therefore, this work deals with the design and evaluation of a test tool with an integrated sensor system for temperature measurements, which was applied to obtain a time-dependent heat transfer coefficient (HTC) during casting solidification. For this purpose, the setup, design and computational approach are described first. Special attention is paid to the qualification of the multi-depth sensor and the calculation method. For the calculations, an inverse estimation method (nonlinear sequential function) was used to obtain the HTC profiles from the collected data. The developed sensor technology was used in a test mold to verify the usability of the sensor technology and the plausibility of the obtained calculation results under real casting conditions and associated temperature loads. Both the experimental temperature profiles and the HTC profiles showed that, in the evaluated casting series, the peak values determined were close to each other and reached values between 6000 W/(m2·K) and 8000 W/(m2·K) during solidification.

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First results on label-free detection of DNA and protein molecules using a novel integrated sensor technology based on gravimetric detection principles

Biosensors and Bioelectronics ◽

10.1016/s0956-5663(03)00259-8 ◽

2004 ◽

Vol 19 (6) ◽

pp. 615-620 ◽

Cited By ~ 131

Author(s):

R. Gabl ◽

H.-D. Feucht ◽

H. Zeininger ◽

G. Eckstein ◽

M. Schreiter ◽

...

Keyword(s):

Sensor Technology ◽

Label Free ◽

Integrated Sensor ◽

Label Free Detection ◽

Protein Molecules ◽

First Results

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Heterogeneous integration of Polymer Porous Photonic Bandgap Structure with Xerogel based Biochemical Sensors

MRS Proceedings ◽

10.1557/opl.2011.552 ◽

2011 ◽

Vol 1301 ◽

Cited By ~ 2

Author(s):

Huina Xu ◽

Ke Liu ◽

Ka Yi Yung ◽

Frank V. Bright ◽

Alexander N. Cartwright

Keyword(s):

Holographic Interferometry ◽

Photonic Bandgap ◽

Signal To Noise Ratio ◽

Uv Curing ◽

Cost Effective ◽

Porous Polymer ◽

Sensor Technology ◽

Heterogeneous Integration ◽

Integrated Sensor ◽

Multifunctional Sensor

ABSTRACTWe report the heterogeneous integration of a multifunctional sensor based on polymer porous photonic bandgap (P3BG) structure and xerogel based luminescence sensor technology. The P3BG structure was fabricated using holographic interferometry. Initially, holographic interferometry of a photo-activated prepolymer syrup that included a volatile solvent as well as monomer, photoinitiator, and co-initiator was used to initiate photopolymerization. Subsequent UV curing resulted in well defined lamellae of the polymer separated by porous polymer regions that created a high quality photonic bandgap structure. The resulting P3BG structure was then integrated with the xerogel based luminescence element to produce a luminescence sensor with a selective narrow band reflector. The prototype xerogel based luminescence sensor element consisted of an O2 sensing material based on spin coated tetraethylorthosilane (TEOS) composite xerogel films containing tris (4,7-diphenyl-1,10-phenanthroline) ruthenium (II) ([Ru(dpp)3]2+) luminophore. We demonstrated enhancement of the signal-to-noise ratio (SNR) of this integrated multifunctional sensor while maintaining the same sensitivity to O2 sensing of the xerogel based element. The resulting advantages and enhanced SNR of this integrated sensor will provide a template for other luminescence based assays to support highly sensitive and cost-effective sensor systems for biomedical applications.

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