Electrohydrodynamic Microfabricated Ionic Wind Pumps for Thermal Management Applications

2014 ◽  
Vol 136 (6) ◽  
Author(s):  
Andojo Ongkodjojo Ong ◽  
Alexis R. Abramson ◽  
Norman C. Tien
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Thermal Management ◽  
High Reliability ◽  
Semiconductor Industry ◽  
Heat Removal ◽  
Coefficient Of Performance ◽  
Air Cooling ◽  
Ionic Wind

This work demonstrates an innovative microfabricated air-cooling technology that employs an electrohydrodynamic (EHD) corona discharge (i.e., ionic wind pump) for electronics cooling applications. A single, microfabricated ionic wind pump element consists of two parallel collecting electrodes between which a single emitting tip is positioned. A grid structure on the collector electrodes can enhance the overall heat-transfer coefficient and facilitate an IC compatible batch process. The optimized devices studied exhibit an overall device area of 5.4 mm × 3.6 mm, an emitter-to-collector gap of ∼0.5 mm, and an emitter curvature radius of ∼12.5 μm. The manufacturing process developed for the device uses glass wafers, a single mask-based photolithography process, and a low-cost copper-based electroplating process. Various design configurations were explored and modeled computationally to investigate their influence on the cooling phenomenon. The single devices provide a high heat-transfer coefficient of up to ∼3200 W/m2 K and a coefficient of performance (COP) of up to ∼47. The COP was obtained by dividing the heat removal enhancement, ΔQ by the power consumed by the ionic wind pump device. A maximum applied voltage of 1.9 kV, which is equivalent to approximately 38 mW of power input, is required for operation, which is significantly lower than the power required for the previously reported devices. Furthermore, the microfabricated single device exhibits a flexible and small form factor, no noise generation, high efficiency, large heat removal over a small dimension and at low power, and high reliability (no moving parts); these are characteristics required by the semiconductor industry for next generation thermal management solutions.

Numerical Analysis on Heat Transfer Coefficient of Large Die Steel Quenching

2012 ◽  
Vol 487 ◽  
pp. 449-452
Author(s):  
Xin Xiao Bian ◽  
Chao Zhang ◽  
Lin Zhu Qian
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Process Simulation ◽  
Air Cooling ◽  
Empirical Equations ◽  
Surface Conditions ◽  
Die Steel ◽  
Quenching Process ◽  
The Heat Transfer Coefficient

Heat transfer coefficient is one of the most important boundary conditions for quenching process simulation. It depends on many factors, such as material, size, surface conditions of a part, and so on. It is, therefore, difficult to evaluate the heat transfer coefficient accurately. T In the environment for large modules P20 and the actual heat transfer conditions, the off-line air-cooling heat transfer coefficient of C are simulated by using empirical equations.

Dependence of Heat Transfer Coefficient on Porous Structure in Porous Media

2008 ◽  
Author(s):  
Akira Matsui ◽  
Kazuhisa Yuki ◽  
Hidetoshi Hashizume
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Porous Media ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
High Performance ◽  
Heat Removal ◽  
High Heat ◽  
Metal Foams ◽  
High Heat Flux

Detailed heat transfer characteristics of particle-sintered porous media and metal foams are evaluated to specify the important structural parameters suitable for high heat removal. The porous media used in this experiment are particle-sintered porous media made of bronze and SUS316L, and metal foams made of copper and nickel. Cooling water flows into the porous medium opposite to heat flux input loaded by a plasma arcjet. The result indicates that the bronze-particle porous medium of 100μm in pore size shows the highest performance and achieves heat transfer coefficient of 0.035MW/m2K at inlet heat flux 4.6MW/m2. Compared with the heat transfer performance of copper fiber-sintered porous media, the bronze particlesintered ones give lower heat transfer coefficient. However, the stable cooling conditions that the heat transfer coefficient does not depend on the flow velocity, were confirmed even at heat flux of 4.6MW/m2 in case of the bronze particle-sintered media, while not in the case of the copper-fiber sintered media. This signifies the possibility that the bronze-particle sintered media enable much higher heat flux removal of over 10MW/m2, which could be caused by higher permeability of the particle-sintered pore structures. Porous media with high permeability provide high performance of vapor evacuation, which leads to more stable heat removal even under extremely high heat flux. On the other hand, the heat transfer coefficient of the metal foams becomes lower because of the lower capillary and fin effects caused by too high porosity and low effective thermal conductivity. It is concluded that the pore structure having high performance of vapor evacuation as well as the high capillary and high fin effects is appropriate for extremely high heat flux removal of over 10MW/m2.

scholarly journals THE METHOD OF CALCULATION AND ANALYSIS OF HEAT TRANSFER COEFFICIENT OF BIMETALLIC FINNED TUBES OF AIR COOLING UNITS WITH IRREGULAR EXTERNAL CONTAMINATION

2017 ◽  
Vol 60 (3) ◽  
pp. 237-255
Author(s):  
V. V. Dudarev ◽  
S. O. Filatаu ◽  
T. B. Karlovich
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
New Method ◽  
Constant Thickness ◽  
Air Cooling ◽  
Term Operation ◽  
Finned Tubes ◽  
Annular Layer ◽  
The Heat Transfer Coefficient

The article focuses on a new method of calculating heat transfer coefficient of bimetallic finned tubes of air coolers taking into account external operational pollution. In contrast to wellknown methods that use the assumption of a uniform distribution of operational contamination layer with a constant thickness over the entire surface of the fins in the present method being introduced it is assumed that the thickness of the pollution layer during long-term operation is changed irregularly. Under such conditions the thickness of the pollution layer at the base of the fins becomes much greater than at the rest of the finned surface. The suggested method is based on a mathematical model developed with the use of the method of electrothermal analogy, whereby the heat flow through the wall of the finned tube is considered as divided into two components, viz. through the annular layer of outside contamination adjacent to the base of the ribs, and through the remaining part of the external ribbed surface covered with a thin layer of pollution. Within the framework of the developed methodology a new method for determining the thermal resistance of the pollution layer, which is based on analytical solution of two dimensional problem of heat conduction in the annular layer has been created. With the use of this technique the influence of the degree of contamination of the intercostal space of the industrially manufactured bimetallic finned tubes on the heat transfer coefficient has been studied taking into account the intensity of heat transfer of air and the properties and composition of the pollutant for industrial manufactured bimetallic finned tubes. It is established that a layer thickness of the pollutant at the base of the ribs has the greatest influence on the heat transfer coefficient. This is due primarily to the change of actual coefficient of the fins. It is demonstrated that the heat conductivity of the external pollutant has a significant impact on the heat transfer coefficient when the heat exchanger functions in the mode of forced convection of air.

scholarly journals Experimental Investigation on Condensation of Vapor in the Presence of Non-Condensable Gas on a Vertical Tube

2018 ◽  
Author(s):  
Shengjun Zhang ◽  
Feng Shen ◽  
Xu Cheng ◽  
Xianke Meng ◽  
Dandan He
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Total Pressure ◽  
Mass Fraction ◽  
Heat Removal ◽  
Heat Transfer Process ◽  
Transfer Model ◽  
Operation Conditions ◽  
The Heat Transfer Coefficient

According to the operation conditions of time unlimited passive containment heat removal system (TUPAC), a separate effect experiment facility was established to investigate the heat transfer performance of steam condensation in presence of non-condensable gas. The effect of wall subcooling temperature, total pressure and mass fraction of the air on heat transfer process was analyzed. The heat transfer model was also developed. The results showed that the heat transfer coefficient decreased with the rising of subcooling temperature, the decreasing of the total pressure and air mass fraction. It was revealed that Dehbi’s correlation predicted the heat transfer coefficient conservatively, especially in the low pressure and low temperature region. The novel correlation was fitted by the data obtained in the following range: 0.20~0.45 MPa in pressure, 20% ~ 80% in mass fraction, 15°C ~ 45°C in temperature. The discrepancy of the correlation and experiment data was with ±20%.

Numerical and Parametric Investigation of the Effect of Heat Spreading On Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

2021 ◽  
Author(s):  
Wei Tong ◽  
Alireza Ganjali ◽  
Omidreza Ghaffari ◽  
Chady Alsayed ◽  
Luc Frechette ◽  
...  
Keyword(s):  
Heat Transfer ◽  
Heat Flux ◽  
Heat Transfer Coefficient ◽  
Surface Temperature ◽  
Transfer Coefficient ◽  
Critical Heat Flux ◽  
Heat Removal ◽  
Nucleate Boiling ◽  
Input Power ◽  
Immersion Cooling

Abstract In a two-phase immersion cooling system, boiling on the spreader surface has been experimentally found to be non-uniform, and it is highly related to the surface temperature and the heat transfer coefficient. An experimentally obtained temperature-dependent boiling heat transfer coefficient has been applied to a numerical model to investigate the spreader's cooling performance. It is found that the surface temperature distribution becomes less uniform with higher input power. But it is more uniform when the thickness is increased. By defining the characteristic temperatures that represent different boiling regimes on the surface, the fraction of the surface area that has reached the critical heat flux has been numerically calculated, showing that increasing the thickness from 1 mm to 6 mm decreases the critical heat flux reached area by 23% at saturation liquid temperatures. Therefore, on the thicker spreader, more of the surface is utilized for nucleate boiling while localized hot regions that lead to surface dry-out are avoided. At a base temperature of 90 oC, the optimal thickness is found to be 4 mm, beyond which no significant improvement in heat removal can be obtained. Lower coolant temperatures can further increase the heat removal; it is reduced from an 18% improvement in the input power for the 1 mm case to only 3% in the 6 mm case for a coolant temperature drop of 24 oC. Therefore, a trade-off exists between the cost of maintaining the low liquid temperature and the increased heat removal capacity.

Numerical Simulation of Ammonia Flow Boiling in a Horizontal Circular Tube

2013 ◽  
Vol 718-720 ◽  
pp. 162-165
Author(s):  
Sheng Long Wang ◽  
Yin Hai Ge ◽  
Wen Hao Li
Keyword(s):  
Heat Transfer ◽  
Reynolds Number ◽  
Heat Transfer Coefficient ◽  
Transfer Coefficient ◽  
Volume Fraction ◽  
Cooling System ◽  
Flow Boiling ◽  
Convective Heat Transfer Coefficient ◽  
Air Cooling ◽  
Horizontal Pipe

In order to understand the variation of ammonia as a cooling refrigerant, the ammonia coolant is being used in power plant air cooling system. The subcooled boiling phase transformation of ammonia in a horizontal pipe tube was simulated through the application of the CFD fluid computational platform, the fluid state parameters in the tube were given at the same time. The speed variation along the axis of the tube was obtained, the speed is increasing, the Reynolds number corresponding substantial increase in the convective heat transfer coefficient corresponds to raise; The vapor volume fraction and boiling heat transfer coefficient along the tube were obtained. The boiling can strengthen the heat transfer significantly. The results showed that the ammonia as a cooling refrigerant by raising the Reynolds number and the use of the latent heat absorb these dual characteristics to improve the heat transfer coefficient is worth promoting.

Evaluation of Pressure Drop Performance During Enhanced Flow Boiling in Open Microchannels With Tapered Manifolds

2014 ◽  
Vol 136 (5) ◽  
Author(s):  
Ankit Kalani ◽  
Satish G. Kandlikar
Keyword(s):  
Heat Transfer ◽  
Heat Transfer Coefficient ◽  
Pressure Drop ◽  
Transfer Coefficient ◽  
Flow Boiling ◽  
High Surface ◽  
Heat Removal ◽  
Electronics Cooling ◽  
Successful Implementation ◽  
Efficient Operation

Boiling can provide several orders of magnitude higher performance than a traditional air cooled system in electronics cooling applications. It can dissipate large quantities of heat while maintaining a low surface temperature difference. Flow boiling with microchannels has shown a great potential with its high surface area to volume ratio and latent heat removal. However, flow instabilities and low critical heat flux (CHF) have prevented its successful implementation. A novel flow boiling design is experimentally investigated to overcome the above-mentioned disadvantages while presenting a very low pressure drop. The design uses open microchannels with a tapered manifold (OMM) to provide stable and efficient operation. The effect of tapered manifold block with varied dimension is investigated with distilled, degassed water at atmospheric pressure. Heat transfer coefficient and pressure drop results for uniform and tapered manifolds with plain and microchannel chips are presented. The OMM configuration yielded a CHF of over 500 W/cm2 in our earlier work. In the current work, a heat transfer coefficient of 277.8 kW/m2 °C was obtained using an OMM design with an inlet gap of 127 μm and an exit gap of 727 μm over a 10 mm flow length. The OMM geometry also resulted in a dramatic reduction in pressure drop from 158.4 kPa for a plain chip and 62.1 kPa for a microchannel chip with a uniform manifold, to less than 10 kPa with the tapered OMM design. A tapered manifold (inlet and exit manifold heights of 127 and 727 μm, respectively) with microchannel provided the lowest pressure drop of 3.3 kPa.

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