scholarly journals The effects of varying humidity on copper sulfide film formation.

2004 ◽  
Author(s):  
Thomas Michael Mayer ◽  
Nancy A. Missert ◽  
John Charles Barbour ◽  
John Patrick Sullivan ◽  
Robert Guild Copeland ◽  
...  
Keyword(s):  
Copper Sulfide ◽  
Film Formation ◽  
Sulfide Film

Study of Rubber-Brass Adhesion Mechanism by Secondary Ion Mass Spectrometry

2002 ◽  
Vol 75 (2) ◽  
pp. 199-214 ◽  
Author(s):  
Jong Myoung Kim ◽  
Wim J. van Ooij
Keyword(s):  
Mass Spectrometry ◽  
Copper Sulfide ◽  
Secondary Ion Mass Spectrometry ◽  
Cluster Formation ◽  
Copper Sulfides ◽  
Sulfide Layer ◽  
Tof Sims ◽  
Sulfide Film ◽  
Ion Mass Spectrometry ◽  
Secondary Ion

Abstract The sulfidization reaction of brass was studied in a squalene model system by Time-of-Flight Secondary Ion Mass Spectrometry, TOF-SIMS. Fragments of the accelerator were observed on the surface of the brass and their concentration changed with reaction time. Copper sulfide formation in the brass panels was confirmed from the TOF-SIMS spectra. The composition of the brass panels could be studied by varying the analysis depth. TOF-SIMS spectra of copper sulfide layer showed a pattern of cluster formation. Cobalt was observed to exist in the sulfide film partly in combination with carbon. Evidence was found of covalent bonding between copper sulfides and squalene.

Copper-sulfide Passivation Capping for Cu Interconnects

2010 ◽  
Vol 1249 ◽  
Author(s):  
Uri Cohen
Keyword(s):  
Copper Sulfide ◽  
Dry Process ◽  
Cu Interconnects ◽  
Sulfide Film ◽  
Strong Adhesion ◽  
Excellent Adhesion ◽  
Rc Delay

AbstractCopper-sulfide is proposed as a selective self-aligned passivation capping film on Cu lines, to improve the lines immunity against electromigration. Copper-sulfide is tenacious, having excellent adhesion (chemically bonded) to the underlying copper lines and strong adhesion to the overlying dielectric capping barrier. Contrary to other passivation schemes, Cu sulfidation is 100% selective. The sulfidation can be done by a wet or a dry process. A very thin copper-sulfide film (of about 25-100Å) will be required, and no significant increase of RC delay is expected.

Sulfide Film Formation on Copper under Electrochemical and Natural Corrosion Conditions

CORROSION ◽  
2007 ◽  
Vol 63 (2) ◽  
pp. 135-144 ◽  
Author(s):  
J. Smith ◽  
Z. Qin ◽  
F. King ◽  
L. Werme ◽  
D. W. Shoesmith
Keyword(s):  
Film Formation ◽  
Sulfide Film ◽  
Natural Corrosion

The nature of the copper sulfide film grown on copper in aqueous sulfide and chloride solutions

2020 ◽  
Vol 72 (1-2) ◽  
pp. 300-307 ◽  
Author(s):  
Mengnan Guo ◽  
Jian Chen ◽  
Taylor Martino ◽  
Christina Lilja ◽  
Johannes A. Johansson ◽  
...  
Keyword(s):  
Copper Sulfide ◽  
Chloride Solutions ◽  
Sulfide Film

scholarly journals Microstructural Studies of the Initial Stages of Copper Sulfide Film Growth: Influence of Humidity

2003 ◽  
Vol 9 (S02) ◽  
pp. 380-381
Author(s):  
M. J. Campin ◽  
J. C. Barbour ◽  
J. W. Braithwaite ◽  
P. P. Provencio ◽  
J. G. Zhu
Keyword(s):  
Copper Sulfide ◽  
Film Growth ◽  
Sulfide Film ◽  
Microstructural Studies
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